JPH01163341U - - Google Patents
Info
- Publication number
- JPH01163341U JPH01163341U JP6038488U JP6038488U JPH01163341U JP H01163341 U JPH01163341 U JP H01163341U JP 6038488 U JP6038488 U JP 6038488U JP 6038488 U JP6038488 U JP 6038488U JP H01163341 U JPH01163341 U JP H01163341U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- package
- support stand
- leads
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000945 filler Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6038488U JPH01163341U (de) | 1988-05-07 | 1988-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6038488U JPH01163341U (de) | 1988-05-07 | 1988-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01163341U true JPH01163341U (de) | 1989-11-14 |
Family
ID=31286090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6038488U Pending JPH01163341U (de) | 1988-05-07 | 1988-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01163341U (de) |
-
1988
- 1988-05-07 JP JP6038488U patent/JPH01163341U/ja active Pending