JPH01162289U - - Google Patents
Info
- Publication number
- JPH01162289U JPH01162289U JP5639688U JP5639688U JPH01162289U JP H01162289 U JPH01162289 U JP H01162289U JP 5639688 U JP5639688 U JP 5639688U JP 5639688 U JP5639688 U JP 5639688U JP H01162289 U JPH01162289 U JP H01162289U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- soldering
- attach
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5639688U JPH01162289U (de) | 1988-04-26 | 1988-04-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5639688U JPH01162289U (de) | 1988-04-26 | 1988-04-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01162289U true JPH01162289U (de) | 1989-11-10 |
Family
ID=31282276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5639688U Pending JPH01162289U (de) | 1988-04-26 | 1988-04-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01162289U (de) |
-
1988
- 1988-04-26 JP JP5639688U patent/JPH01162289U/ja active Pending