JPH01162280U - - Google Patents

Info

Publication number

JPH01162280U

JPH01162280U JP5569988U JP5569988U JPH01162280U JP H01162280 U JPH01162280 U JP H01162280U JP 5569988 U JP5569988 U JP 5569988U JP 5569988 U JP5569988 U JP 5569988U JP H01162280 U JPH01162280 U JP H01162280U

Authority

JP

Japan

Prior art keywords

insulating material

copper foil

adhesive layer

material board

copper

Prior art date

1988-04-25

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
• 239000011889 copper foil Substances 0.000 claims description 4
• 239000011810 insulating material Substances 0.000 claims description 4
• 239000012790 adhesive layer Substances 0.000 claims description 3
• 239000006096 absorbing agent Substances 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 2