JPH01162276U - - Google Patents
Info
- Publication number
- JPH01162276U JPH01162276U JP5427688U JP5427688U JPH01162276U JP H01162276 U JPH01162276 U JP H01162276U JP 5427688 U JP5427688 U JP 5427688U JP 5427688 U JP5427688 U JP 5427688U JP H01162276 U JPH01162276 U JP H01162276U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- circuit wiring
- liquid level
- cooling
- cooling liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 3
- 239000000110 cooling liquid Substances 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 2
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5427688U JPH071815Y2 (ja) | 1988-04-22 | 1988-04-22 | 回路配線板の冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5427688U JPH071815Y2 (ja) | 1988-04-22 | 1988-04-22 | 回路配線板の冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01162276U true JPH01162276U (en, 2012) | 1989-11-10 |
| JPH071815Y2 JPH071815Y2 (ja) | 1995-01-18 |
Family
ID=31280212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5427688U Expired - Lifetime JPH071815Y2 (ja) | 1988-04-22 | 1988-04-22 | 回路配線板の冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH071815Y2 (en, 2012) |
-
1988
- 1988-04-22 JP JP5427688U patent/JPH071815Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH071815Y2 (ja) | 1995-01-18 |