JPH01162261U - - Google Patents
Info
- Publication number
- JPH01162261U JPH01162261U JP5631688U JP5631688U JPH01162261U JP H01162261 U JPH01162261 U JP H01162261U JP 5631688 U JP5631688 U JP 5631688U JP 5631688 U JP5631688 U JP 5631688U JP H01162261 U JPH01162261 U JP H01162261U
- Authority
- JP
- Japan
- Prior art keywords
- flat plate
- led chip
- end formed
- led lamp
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5631688U JPH01162261U (nl) | 1988-04-25 | 1988-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5631688U JPH01162261U (nl) | 1988-04-25 | 1988-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01162261U true JPH01162261U (nl) | 1989-11-10 |
Family
ID=31282195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5631688U Pending JPH01162261U (nl) | 1988-04-25 | 1988-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01162261U (nl) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003158302A (ja) * | 2001-11-21 | 2003-05-30 | Toyoda Gosei Co Ltd | 発光ダイオード |
| WO2003049207A1 (fr) * | 2001-11-16 | 2003-06-12 | Toyoda Gosei Co., Ltd. | Diode electroluminescente, eclairage a diode et dispositif d'eclairage |
| JP2005079578A (ja) * | 2003-08-28 | 2005-03-24 | Agilent Technol Inc | 熱伝導率を向上させた発光デバイス・アセンブリ、それを含むシステム及び熱伝導率を向上する方法 |
| JP2006270129A (ja) * | 2006-06-23 | 2006-10-05 | Sanyo Electric Co Ltd | レーザ装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6054354B2 (ja) * | 1977-12-28 | 1985-11-29 | 株式会社東芝 | 螢光体 |
| JPS6117759B2 (nl) * | 1977-11-28 | 1986-05-09 | Mitsubishi Electric Corp |
-
1988
- 1988-04-25 JP JP5631688U patent/JPH01162261U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6117759B2 (nl) * | 1977-11-28 | 1986-05-09 | Mitsubishi Electric Corp | |
| JPS6054354B2 (ja) * | 1977-12-28 | 1985-11-29 | 株式会社東芝 | 螢光体 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003049207A1 (fr) * | 2001-11-16 | 2003-06-12 | Toyoda Gosei Co., Ltd. | Diode electroluminescente, eclairage a diode et dispositif d'eclairage |
| JP2003158302A (ja) * | 2001-11-21 | 2003-05-30 | Toyoda Gosei Co Ltd | 発光ダイオード |
| JP2005079578A (ja) * | 2003-08-28 | 2005-03-24 | Agilent Technol Inc | 熱伝導率を向上させた発光デバイス・アセンブリ、それを含むシステム及び熱伝導率を向上する方法 |
| JP2013110435A (ja) * | 2003-08-28 | 2013-06-06 | Intellectual Discovery Co Ltd | 熱伝導率を向上させた発光デバイス・アセンブリ、それを含むシステム及び熱伝導率を向上する方法 |
| JP2006270129A (ja) * | 2006-06-23 | 2006-10-05 | Sanyo Electric Co Ltd | レーザ装置 |