JPH01162259U - - Google Patents
Info
- Publication number
- JPH01162259U JPH01162259U JP5550588U JP5550588U JPH01162259U JP H01162259 U JPH01162259 U JP H01162259U JP 5550588 U JP5550588 U JP 5550588U JP 5550588 U JP5550588 U JP 5550588U JP H01162259 U JPH01162259 U JP H01162259U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- resin
- pellets
- semiconductor
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5550588U JPH01162259U (es) | 1988-04-25 | 1988-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5550588U JPH01162259U (es) | 1988-04-25 | 1988-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01162259U true JPH01162259U (es) | 1989-11-10 |
Family
ID=31281407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5550588U Pending JPH01162259U (es) | 1988-04-25 | 1988-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01162259U (es) |
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1988
- 1988-04-25 JP JP5550588U patent/JPH01162259U/ja active Pending