JPH01162253U - - Google Patents
Info
- Publication number
- JPH01162253U JPH01162253U JP5538688U JP5538688U JPH01162253U JP H01162253 U JPH01162253 U JP H01162253U JP 5538688 U JP5538688 U JP 5538688U JP 5538688 U JP5538688 U JP 5538688U JP H01162253 U JPH01162253 U JP H01162253U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- mounting part
- lead frame
- joining
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims 1
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5538688U JPH01162253U (ro) | 1988-04-25 | 1988-04-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5538688U JPH01162253U (ro) | 1988-04-25 | 1988-04-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01162253U true JPH01162253U (ro) | 1989-11-10 |
Family
ID=31281290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5538688U Pending JPH01162253U (ro) | 1988-04-25 | 1988-04-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01162253U (ro) |
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1988
- 1988-04-25 JP JP5538688U patent/JPH01162253U/ja active Pending