JPH01162236U - - Google Patents
Info
- Publication number
- JPH01162236U JPH01162236U JP5548788U JP5548788U JPH01162236U JP H01162236 U JPH01162236 U JP H01162236U JP 5548788 U JP5548788 U JP 5548788U JP 5548788 U JP5548788 U JP 5548788U JP H01162236 U JPH01162236 U JP H01162236U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- semiconductor component
- semiconductor
- metallized layer
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5548788U JPH01162236U (ko) | 1988-04-25 | 1988-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5548788U JPH01162236U (ko) | 1988-04-25 | 1988-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01162236U true JPH01162236U (ko) | 1989-11-10 |
Family
ID=31281389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5548788U Pending JPH01162236U (ko) | 1988-04-25 | 1988-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01162236U (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003023843A1 (fr) * | 2001-09-05 | 2003-03-20 | Renesas Thechnology Corp. | Dispositif a semi-conducteur, son procede de fabrication et dispositif de communication radio |
-
1988
- 1988-04-25 JP JP5548788U patent/JPH01162236U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003023843A1 (fr) * | 2001-09-05 | 2003-03-20 | Renesas Thechnology Corp. | Dispositif a semi-conducteur, son procede de fabrication et dispositif de communication radio |