JPH01160824U - - Google Patents
Info
- Publication number
- JPH01160824U JPH01160824U JP4861988U JP4861988U JPH01160824U JP H01160824 U JPH01160824 U JP H01160824U JP 4861988 U JP4861988 U JP 4861988U JP 4861988 U JP4861988 U JP 4861988U JP H01160824 U JPH01160824 U JP H01160824U
- Authority
- JP
- Japan
- Prior art keywords
- external terminal
- electrode lead
- lead plate
- wall portion
- thin wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の電解コンデンサの断面図、第
２図はそのコンデンサ素子の要部展開斜視図、第
３図は従来の電解コンデンサの断面図、第４図及
び第５図は夫々その不良状態の断面図である。
１，２…電極引出リード板、１ａ，２ａ…肉薄
部、３…コンデンサ素子、６…封口板。
Fig. 1 is a cross-sectional view of the electrolytic capacitor of the present invention, Fig. 2 is an exploded perspective view of the main parts of the capacitor element, Fig. 3 is a cross-sectional view of a conventional electrolytic capacitor, and Figs. 4 and 5 respectively show defects. It is a sectional view of the state. DESCRIPTION OF SYMBOLS 1, 2... Electrode extraction lead plate, 1a, 2a... Thin wall part, 3... Capacitor element, 6... Sealing plate.
Claims (1)
設け、該外部端子にケース内に収納されるコンデ
ンサ素子より導出した電極引出リード板を接続す
る電解コンデンサであつて、前記電極引出リード
板にその板厚が薄くなつた肉薄部を形成し、開口
端の封止時に前記電極引出リード板が肉薄部より
折れ曲がるように構成した事を特徴とする電解コ
ンデンサ。 An electrolytic capacitor in which an external terminal is provided on a sealing plate that seals an open end of the case, and an electrode lead plate led out from a capacitor element housed in the case is connected to the external terminal, the electrode lead plate being connected to the external terminal. 1. An electrolytic capacitor characterized in that a thin wall portion is formed in which the plate thickness is reduced, and the electrode lead plate is bent from the thin wall portion when the opening end is sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4861988U JPH01160824U (en) | 1988-04-11 | 1988-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4861988U JPH01160824U (en) | 1988-04-11 | 1988-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160824U true JPH01160824U (en) | 1989-11-08 |
Family
ID=31274759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4861988U Pending JPH01160824U (en) | 1988-04-11 | 1988-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160824U (en) |
-
1988
- 1988-04-11 JP JP4861988U patent/JPH01160824U/ja active Pending
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