JPH01160809U - - Google Patents
Info
- Publication number
- JPH01160809U JPH01160809U JP5027288U JP5027288U JPH01160809U JP H01160809 U JPH01160809 U JP H01160809U JP 5027288 U JP5027288 U JP 5027288U JP 5027288 U JP5027288 U JP 5027288U JP H01160809 U JPH01160809 U JP H01160809U
- Authority
- JP
- Japan
- Prior art keywords
- groove
- superconducting coil
- thermosetting resin
- superconducting
- communicating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims 1
Landscapes
- Superconductive Dynamoelectric Machines (AREA)
Description
第１図はこの考案の一実施例による超電導コイ
ル装置を示す断面図、第２図は超電導線と中空管
の構成を一部破断した拡大斜視図、第３図は従来
の超電導コイル装置を示す断面図である。
図において、５は超電導線、５ａは溝、７は中
空管、９は熱硬化性樹脂、１０は超電導コイルで
ある。なお、図中、同一符号は同一又は相当部分
を示す。
Fig. 1 is a sectional view showing a superconducting coil device according to an embodiment of this invention, Fig. 2 is an enlarged perspective view with a partially cutaway view of the structure of superconducting wire and hollow tube, and Fig. 3 is a conventional superconducting coil device. FIG. In the figure, 5 is a superconducting wire, 5a is a groove, 7 is a hollow tube, 9 is a thermosetting resin, and 10 is a superconducting coil. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
連通する溝を有した超電導線と中空管とが併設し
て巻回されてなる超電導コイルと、この超電導コ
イルの上記溝および溝に連通する空隙に含浸され
る熱硬化性樹脂とを備えたことを特徴とする超電
導コイル装置。 A superconducting coil formed by winding a superconducting wire and a hollow tube that have a groove communicating with the entire length on at least one of the contacting surfaces, and a gap communicating with the groove of the superconducting coil and the groove. A superconducting coil device comprising: a thermosetting resin impregnated with the thermosetting resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5027288U JPH01160809U (en) | 1988-04-13 | 1988-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5027288U JPH01160809U (en) | 1988-04-13 | 1988-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160809U true JPH01160809U (en) | 1989-11-08 |
Family
ID=31276331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5027288U Pending JPH01160809U (en) | 1988-04-13 | 1988-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160809U (en) |
-
1988
- 1988-04-13 JP JP5027288U patent/JPH01160809U/ja active Pending