JPH0116003B2 - - Google Patents
Info
- Publication number
- JPH0116003B2 JPH0116003B2 JP58217836A JP21783683A JPH0116003B2 JP H0116003 B2 JPH0116003 B2 JP H0116003B2 JP 58217836 A JP58217836 A JP 58217836A JP 21783683 A JP21783683 A JP 21783683A JP H0116003 B2 JPH0116003 B2 JP H0116003B2
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- uncut
- insulating substrate
- metal plate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明はスライド型可変抵抗器の製造方法に係
り、特に、絶縁基板に端子と基板ブロツクとを形
成する方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method of manufacturing a sliding type variable resistor, and particularly to a method of forming terminals and a substrate block on an insulating substrate.
スライド型可変抵抗器を製造する場合、表面に
抵抗層を設けた絶縁基板に端子と基板ブロツクと
を形成し、これに、摺動子を固着した摺動子受と
枠体とを取り付けて製品を完成する。
When manufacturing a sliding type variable resistor, a terminal and a board block are formed on an insulating substrate with a resistance layer on the surface, and a slider holder and a frame body to which a slider is fixed are attached to this, and the product is manufactured. complete.
従来、絶縁基板に端子と基板ブロツクとを形成
する工程は、例えば未切断端子を切断して端子を
形成した後、合成樹脂材よりなる基板ブロツクを
成型する際に、人手を要するため自動化が困難
で、製造工程が煩雑になつてしまうという問題が
あつた。 Conventionally, the process of forming terminals and board blocks on an insulating board is difficult to automate because it requires human labor, for example, when forming terminals by cutting uncut terminals and then molding board blocks made of synthetic resin material. However, there was a problem that the manufacturing process became complicated.
本発明の目的は、上述した従来の問題点を解決
し、絶縁基板に端子と基板ブロツクとを形成する
製造工程が自動化できて簡単なスライド型可変抵
抗器の製造方法を提供するにある。
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional problems and to provide a simple method of manufacturing a sliding type variable resistor in which the manufacturing process of forming terminals and board blocks on an insulating substrate can be automated.
この目的を達成するために、本発明は、帯状の
金属板に複数の鳩目を連続して形成した後、この
金属板に打抜き加工を施すことにより、一端に前
記鳩目を有し他端が連結された複数の未切断端子
を形成し、これら未切断端子をその連結端側で隣
接する対どうしの間隔が狭まる方向に折り返した
後、前記鳩目を抵抗層を設けた絶縁基板の透孔に
挿入してカシメつけ、次いで前記絶縁基板にこの
カシメ部分を含んで合成樹脂材を充填して基板ブ
ロツクを形成し、その後前記未切断端子をこの基
板ブロツクの外方で前記金属板から切断すること
を特徴とする。
In order to achieve this object, the present invention involves continuously forming a plurality of eyelets on a strip-shaped metal plate, and then punching the metal plate so that one end has the eyelet and the other end is connected. A plurality of uncut terminals are formed, and these uncut terminals are folded back in a direction in which the distance between adjacent pairs is narrowed on the connected end side, and then the eyelet is inserted into a through hole of an insulating substrate provided with a resistive layer. and caulking, then filling the insulating substrate including the caulked portion with a synthetic resin material to form a substrate block, and then cutting the uncut terminals from the metal plate outside the substrate block. Features.
以下、本発明の実施例を図面に基づいて説明す
る。
Embodiments of the present invention will be described below based on the drawings.
第1図は絶縁基板に所定の端子と基板ブロツク
とを形成し終えた完成品の斜視図であり、1は絶
縁基板、2はこの絶縁基板1上に設けてある抵抗
層、3は同じく絶縁基板1上に設けてある集電
層、4は合成樹脂材よりなる基板ブロツク、5は
金属製の端子である。 FIG. 1 is a perspective view of a completed product in which predetermined terminals and board blocks have been formed on an insulating substrate. 1 is an insulating substrate, 2 is a resistance layer provided on this insulating substrate 1, and 3 is also an insulating substrate. A current collecting layer is provided on a substrate 1, 4 is a substrate block made of a synthetic resin material, and 5 is a metal terminal.
かかる完成品を製造する工程は、まずフープ状
の比較的薄い2枚の金属板を所定の間隔をおいて
平行に載置し、第2図に示す如く、それぞれの金
属板6を位置決め用のピツチ穴7で順次矢印方向
に送りながら、鳩目絞りを施して鳩目8を形成す
る。 In the process of manufacturing such a finished product, first, two relatively thin hoop-shaped metal plates are placed in parallel at a predetermined interval, and each metal plate 6 is placed in a positioning position as shown in FIG. The eyelet 8 is formed by drawing the eyelet while sequentially feeding it in the direction of the arrow through the pit hole 7.
次いで第3図に示す如く、前記鳩目8を含む端
子形状に打抜き加工し、さらに第4図に示す如く
矢印方向の曲げ加工を施して、一端を連結したま
ま一対ずつ所定間隔に隣接した未切断端子9を形
成する。この一対ごとの未切断端子9はそれぞ
れ、第4図では示していないが、もう1枚の金属
板より同様の方法で形成された一対の未切断端子
と対向している。なお、第3図と第4図とは表裏
逆の面を示している。 Next, as shown in FIG. 3, the terminals are punched into a terminal shape including the eyelet 8, and then bent in the direction of the arrow as shown in FIG. Terminal 9 is formed. Although not shown in FIG. 4, each pair of uncut terminals 9 faces a pair of uncut terminals formed from another metal plate in a similar manner. Note that FIGS. 3 and 4 show the reverse sides.
上記折り曲げ加工により、一対の未切断端子9
間の寸法(ピツチ幅)は折り曲げ前に比べて狭く
なり、この折り曲げ後の寸法が後述する絶縁基板
の一対の透孔間ピツチと同じになるように設定さ
れているため、前述した鳩目絞り工程では、各鳩
目8間のピツチを目的とする寸法に比べて充分に
大きく設定することができる。また上記折り曲げ
加工により、一対の未切断端子9の根元部分は
180度折り返されて二重となるため、この部分の
保持強度を高めることができる。 By the above bending process, a pair of uncut terminals 9
The dimension between them (pitch width) is narrower than before bending, and the dimension after bending is set to be the same as the pitch between a pair of through holes in the insulating substrate, which will be described later. In this case, the pitch between each eyelet 8 can be set sufficiently larger than the intended dimension. Also, due to the above bending process, the root portions of the pair of uncut terminals 9 are
Since it is folded back 180 degrees to form a double layer, the holding strength of this part can be increased.
そして第5図に示す如く、一対ずつ対向してい
る未切断端子9の間に予め用意した絶縁基板1を
配し、この絶縁基板1の両端部の透孔にそれぞれ
前記鳩目8を挿入して、絶縁基板1と未切断端子
9とをカシメる。なお、前記絶縁基板1の上面に
は、印刷法等によつて抵抗層2と集電層3とが予
め形成されている。 Then, as shown in FIG. 5, an insulating substrate 1 prepared in advance is arranged between pairs of uncut terminals 9 facing each other, and the eyelets 8 are inserted into through holes at both ends of the insulating substrate 1. , the insulating substrate 1 and the uncut terminals 9 are caulked. Note that a resistance layer 2 and a current collection layer 3 are previously formed on the upper surface of the insulating substrate 1 by a printing method or the like.
次に、前記絶縁基板1に所定形状の成形金型
(図示せず)を配して、ここに合成樹脂材を充填
し、第6図に示す如く基板ブロツク4を形成す
る。この場合、各未切断端子9の根元部分は、前
述の如く折り返し加工によつて保持強度が高めら
れているため、未切断端子9が樹脂圧等の外力に
より変形することはない。 Next, a molding die (not shown) having a predetermined shape is placed on the insulating substrate 1 and filled with a synthetic resin material to form a substrate block 4 as shown in FIG. In this case, the holding strength of the base portion of each uncut terminal 9 is increased by the folding process as described above, so that the uncut terminal 9 will not be deformed by external force such as resin pressure.
その後、前記未切断端子9の連結してある側を
切断加工し、これを、斜め下から見たとき第7図
に示すような形状になるように折り曲げて4本の
端子5を形成し、こうして、絶縁基板に所定の端
子と基板ブロツクとを形成する一連の工程が完了
する。 Thereafter, the connected side of the uncut terminals 9 is cut and bent to form four terminals 5 into a shape as shown in FIG. 7 when viewed diagonally from below. In this way, a series of steps for forming predetermined terminals and substrate blocks on the insulating substrate is completed.
上述した製造工程は、ピツチ穴7で正確に位置
決めしたまま順送りに、プレス型や成形金型で製
造していく一連の工程であり、人手によらず全工
程を自動化することができる。そして、こうして
絶縁基板1に端子5と基板ブロツク4とを形成し
た後、枠体(図示せず)を基板ブロツク4の上側
に固定し、この枠体と絶縁基板1との間には、抵
抗層2に摺接する摺動子(図示せず)を下面に固
着した摺動子受(図示せず)を収納して、スライ
ド型可変抵抗器を完成する。 The above-mentioned manufacturing process is a series of steps in which the product is manufactured in a sequential manner using a press mold or a molding die while accurately positioning with the pitch holes 7, and the entire process can be automated without manual labor. After forming the terminals 5 and the board block 4 on the insulating substrate 1 in this way, a frame (not shown) is fixed above the board block 4, and a resistor is placed between the frame and the insulating substrate 1. A slider holder (not shown) having a slider (not shown) fixed to the lower surface thereof which slides on the layer 2 is housed to complete the sliding type variable resistor.
なお、第7図において、絶縁基板1の下方に設
けてある金属製の取付板10は、スライド型可変
抵抗器を適宜位置へ取り付けるためのもので、本
実施例では、基板ブロツク4の一部を熱溶着する
ことでこの取付板10を固定している。また、第
8図は、本発明の製造工程を説明するフローチヤ
ートである。 In FIG. 7, the metal mounting plate 10 provided below the insulating board 1 is for mounting the sliding type variable resistor in an appropriate position. This mounting plate 10 is fixed by heat welding. Moreover, FIG. 8 is a flowchart explaining the manufacturing process of the present invention.
以上説明したように、本発明によれば、鳩目を
有する複数の未切断端子がそれぞれの一端を連結
した状態で形成され、かつ未切断端子の根元の強
度が折り返し加工によつて高められているため、
絶縁基板に端子と基板ブロツクとを形成する製造
工程をすべて自動化することができ、コストダウ
ンが図れる。
As explained above, according to the present invention, a plurality of uncut terminals having eyelets are formed with one end of each connected, and the strength of the base of the uncut terminals is increased by folding. For,
The entire manufacturing process of forming terminals and board blocks on an insulating substrate can be automated, leading to cost reductions.
第1図は絶縁基板に端子と基板ブロツクとを形
成した完成品の斜視図、第2図は鳩目形成の工程
を示す斜視図、第3図は打抜き加工の工程を示す
斜視図、第4図は曲げ加工の工程を示す斜視図、
第5図は絶縁基板に鳩目をカシメる工程を示す斜
視図、第6図は基板ブロツクを形成する工程を示
す斜視図、第7図は絶縁基板に端子と基板ブロツ
クとを形成した完成品の裏面を示す斜視図、第8
図は本発明の製造工程を説明するフローチヤート
である。
1……絶縁基板、2……抵抗層、4……基板ブ
ロツク、5……端子、6……金属板、8……鳩
目、9……未切断端子。
Fig. 1 is a perspective view of a completed product in which terminals and board blocks are formed on an insulating substrate, Fig. 2 is a perspective view showing the eyelet forming process, Fig. 3 is a perspective view showing the punching process, and Fig. 4. is a perspective view showing the bending process;
Fig. 5 is a perspective view showing the process of caulking eyelets on the insulating substrate, Fig. 6 is a perspective view showing the process of forming the board block, and Fig. 7 is a finished product in which terminals and board blocks are formed on the insulating board. Perspective view showing the back side, No. 8
The figure is a flowchart explaining the manufacturing process of the present invention. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Resistance layer, 4... Board block, 5... Terminal, 6... Metal plate, 8... Eyelet, 9... Uncut terminal.
Claims (1)
た後、この金属板に打抜き加工を施すことによ
り、一端に前記鳩目を有し他端が連結された複数
の未切断端子を形成し、これら未切断端子をその
連結端側で隣接する対どうしの間隔が狭まる方向
に折り返した後、前記鳩目を抵抗層を設けた絶縁
基板の透孔に挿入してカシメつけ、次いで前記絶
縁基板にこのカシメ部分を含んで合成樹脂材を充
填して基板ブロツクを形成し、その後前記未切断
端子をこの基板ブロツクの外方で前記金属板から
切断することを特徴とするスライド携型可変抵抗
器の製造方法。1. After continuously forming a plurality of eyelets on a band-shaped metal plate, by punching this metal plate, a plurality of uncut terminals having the eyelet at one end and connected at the other end are formed, After folding these uncut terminals in a direction that narrows the distance between adjacent pairs on their connecting end sides, the eyelets are inserted into the through holes of the insulating substrate provided with the resistance layer and caulked, and then the terminals are attached to the insulating substrate. Manufacture of a slide portable variable resistor characterized in that a substrate block is formed by filling synthetic resin material including the caulked portion, and then the uncut terminals are cut from the metal plate outside the substrate block. Method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58217836A JPS60110102A (en) | 1983-11-21 | 1983-11-21 | Method of producing slide type variable resistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58217836A JPS60110102A (en) | 1983-11-21 | 1983-11-21 | Method of producing slide type variable resistor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60110102A JPS60110102A (en) | 1985-06-15 |
JPH0116003B2 true JPH0116003B2 (en) | 1989-03-22 |
Family
ID=16710509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58217836A Granted JPS60110102A (en) | 1983-11-21 | 1983-11-21 | Method of producing slide type variable resistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60110102A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6220301A (en) * | 1985-07-19 | 1987-01-28 | アルプス電気株式会社 | Manufacture of fixed side member for rotary type electric part |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5731642A (en) * | 1980-06-19 | 1982-02-20 | Shell Int Research | Carbonylation of alkanol and/or ether |
-
1983
- 1983-11-21 JP JP58217836A patent/JPS60110102A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5731642A (en) * | 1980-06-19 | 1982-02-20 | Shell Int Research | Carbonylation of alkanol and/or ether |
Also Published As
Publication number | Publication date |
---|---|
JPS60110102A (en) | 1985-06-15 |
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