JPH01159366U - - Google Patents
Info
- Publication number
- JPH01159366U JPH01159366U JP5538588U JP5538588U JPH01159366U JP H01159366 U JPH01159366 U JP H01159366U JP 5538588 U JP5538588 U JP 5538588U JP 5538588 U JP5538588 U JP 5538588U JP H01159366 U JPH01159366 U JP H01159366U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- lead
- attachment pattern
- hybrid integrated
- lead attachment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 2
- 238000009434 installation Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5538588U JPH01159366U (sk) | 1988-04-25 | 1988-04-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5538588U JPH01159366U (sk) | 1988-04-25 | 1988-04-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01159366U true JPH01159366U (sk) | 1989-11-06 |
Family
ID=31281289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5538588U Pending JPH01159366U (sk) | 1988-04-25 | 1988-04-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01159366U (sk) |
-
1988
- 1988-04-25 JP JP5538588U patent/JPH01159366U/ja active Pending