JPH01158519A - Substrate for detecting position - Google Patents

Substrate for detecting position

Info

Publication number
JPH01158519A
JPH01158519A JP62317179A JP31717987A JPH01158519A JP H01158519 A JPH01158519 A JP H01158519A JP 62317179 A JP62317179 A JP 62317179A JP 31717987 A JP31717987 A JP 31717987A JP H01158519 A JPH01158519 A JP H01158519A
Authority
JP
Japan
Prior art keywords
substrate
detecting
electrodes
adhesive
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62317179A
Other languages
Japanese (ja)
Other versions
JP2597118B2 (en
Inventor
Tetsuo Taguchi
哲夫 田口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pentel Co Ltd
Original Assignee
Pentel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pentel Co Ltd filed Critical Pentel Co Ltd
Priority to JP31717987A priority Critical patent/JP2597118B2/en
Publication of JPH01158519A publication Critical patent/JPH01158519A/en
Application granted granted Critical
Publication of JP2597118B2 publication Critical patent/JP2597118B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the danger of a bubble remaining when a substrate is stuck to an enclosure, to attain the work without anxiety, to shorten an assembling time and to improve a yield by applying directly adhesives to a substrate for detecting a position and providing a passage where the air runs away when the substrate for detecting a position is stuck, between adhesives. CONSTITUTION:For a substrate 1 for detecting a position, the necessary number of electrodes 3 and extension lines 4 is formed by a silk printing on a sheet 2 composed of a synthetic resin. An electrode is formed by a silk printing through an insulating layer onto the electrode 3 of the sheet 2 as shown in a broken line 5 even in a Y direction and even the extension line corresponding to this is formed and further, the whole is silk-printed with the insulating layer. The part corresponding to the part to form the electrodes 3 and 5 is made into a non-bonding part 7 and adhesives 6 are applied to the part corresponding to the part divided by the orthogonal line of electrodes 3 and 5. Thus, only by sticking the substrate for detecting the position, the air can be extracted from the non-bonding part as air extraction and the bubble does not remain.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は座標入力装置、タブレット入力装置等に用いら
れる位置検出用基板に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a position detection substrate used in coordinate input devices, tablet input devices, and the like.

[従来の技術] 座標入力装置やタブレット入力装置では、その筐体に位
置検出用基板が取着される。取着の手法は種々あるが、
特にその素材をフィルム状とし、シルク印刷の手法で所
要の電極を形成した位置検出用基板の取着の場合には、
取着が確実であること、取着面を単に平面にしておけば
良いので金型加工が容易になる等の理由から、両面粘着
シートや接着剤等による貼着という手法が用いられる。
[Prior Art] In a coordinate input device or a tablet input device, a position detection board is attached to the housing thereof. There are various mounting methods, but
In particular, when attaching a position detection substrate whose material is in the form of a film and the required electrodes are formed using silk printing,
Attachment using a double-sided pressure-sensitive adhesive sheet, adhesive, or the like is used because the attachment is reliable and because the attachment surface can be simply flattened, making mold processing easier.

[発明が解決しようとする問題点] しかし上記取着方法は、筐体と位置検出用基板の位置合
せ後、基板中央から周辺に向かって慎重に押しつけて行
かないと基板と筐体間に気泡が残る虞れがあり、また失
敗した場合貼り直しができないため、基板を無駄にする
虞れがあって、作業性及び歩留まりが悪いという問題が
あった。
[Problems to be Solved by the Invention] However, with the above mounting method, air bubbles may form between the board and the case unless the board is carefully pressed from the center toward the periphery after aligning the case and the position detection board. There is a risk that the adhesive will remain, and if it fails, it cannot be reattached, so there is a risk that the substrate will be wasted, resulting in problems of poor workability and yield.

そこで本願出願人は、実願昭62−148955号とし
て基板の所要箇所に空気抜孔を穿設することとして上記
問題の解決を図った位置検出用基板を提案した。このよ
うにすれば1位置合わせの後単純に押さえつけるように
しても上記空気抜孔から空気が逃げ気泡が残ることはな
くなったが、この位置検出用基板を筐体に貼付するには
熟練した作業者が必要であった。
Therefore, the applicant of the present application proposed a position detection board in which the above-mentioned problem was solved by providing air vent holes at required locations on the board as U.S. Pat. No. 62-148955. In this way, the air would escape from the air vent hole and no air bubbles would remain even if it was simply pressed down after one positioning, but it would take a skilled worker to attach this position detection board to the casing. was necessary.

[問題点を解決するための手段] そこで本発明では、位置検出用基板に直接接着剤を塗布
し、位置検出用基板を貼付する際に空気が逃げる通路を
接着剤間に設けた。
[Means for Solving the Problems] Accordingly, in the present invention, an adhesive is applied directly to the position detection substrate, and a path is provided between the adhesives through which air can escape when the position detection substrate is attached.

[作用] このようにすれば、位置検出用基板を貼付するだけで空
気抜きとしての非接着部分から空気が抜けることができ
、気泡が残ることはない。
[Function] By doing so, air can be evacuated from the non-adhesive portion as an air vent by simply pasting the position detection substrate, and no air bubbles remain.

[実施例] 以下本発明の詳細を図示実施例に基いて説明する。第1
図に於て、参照符号1は本発明に係る位置検出用基板で
あり、合成樹脂からなるシート2上に、シルク印刷によ
り電極3及び引出線4が所要数形成されて成る。なおこ
の実施例は、静電結合方式座標入力装置に関するもので
実際にはY方向にも破線5で示すようにシート2の電極
3上に絶縁層を介して電極がシルク印刷により形成され
、これに対応する引出線も形成され(引出線は図示せず
)、更に全体を絶縁層でシルク印刷されている。
[Examples] The details of the present invention will be explained below based on illustrated examples. 1st
In the figure, reference numeral 1 is a position detection substrate according to the present invention, which is formed by forming a required number of electrodes 3 and leader lines 4 on a sheet 2 made of synthetic resin by silk printing. This embodiment relates to a capacitive coupling type coordinate input device, and in reality, electrodes are formed by silk printing on the electrodes 3 of the sheet 2 with an insulating layer interposed therebetween, as shown by the broken line 5 in the Y direction. A corresponding leader line is also formed (the leader line is not shown), and the entire surface is silk-printed with an insulating layer.

電極3および5の形成された部分に対応する部分を非接
着部分7として、この電極3と5の直交線で区画された
部分に対応する部分に接着剤6を塗布している。接着剤
としては合成ゴムベース溶剤型のスクリーン印刷用感圧
接着剤を0.02mm程度の厚さに塗布される。接着剤
の塗布間隔としては4〜6nwnで、非接着部分7の幅
は略1m程度とされている。この電極3,5、引出線4
、接着剤6、非接着部分7および絶縁層全体をを覆って
剥離紙が貼付されている。(不図示)ここで、非接着部
分7は交叉して連通しており、端部は接着剤6の配置部
分外へ延在しそいるものである。
A portion corresponding to the portion where the electrodes 3 and 5 are formed is defined as a non-adhesive portion 7, and an adhesive 6 is applied to a portion corresponding to the portion divided by the orthogonal line between the electrodes 3 and 5. As the adhesive, a synthetic rubber-based solvent-type pressure-sensitive adhesive for screen printing is applied to a thickness of about 0.02 mm. The adhesive application interval is 4 to 6 nwn, and the width of the non-adhesive portion 7 is approximately 1 m. These electrodes 3, 5, lead wire 4
, a release paper is attached covering the adhesive 6, the non-adhesive portion 7, and the entire insulating layer. (Not shown) Here, the non-adhesive portions 7 intersect and communicate, and the ends tend to extend outside the area where the adhesive 6 is arranged.

21は座標入力装置の筐体としての上ケースで、上面に
は座標入力領域を示す区画線22が描かれており、また
下面は基板1を貼着するために平らにされている。なお
、この上ケース21は制御回路等を載置した不図示下ケ
ースに組合わせられ完成品の形をなす。
Reference numeral 21 denotes an upper case serving as a housing of the coordinate input device.A partition line 22 indicating a coordinate input area is drawn on the upper surface of the upper case, and the lower surface is made flat for attaching the substrate 1. The upper case 21 is combined with a lower case (not shown) on which a control circuit and the like are mounted to form a completed product.

而して図では分解した形で示したが、この実施例の組立
ては以下の手順で行なう。まず位置検出用基板1の上面
側の剥離紙(不図示)を剥し、位置検出用基板1を上ケ
ース21の下面に貼り付ける。ここで位置検出用基板1
の剥離紙をはがしながら接着剤6を上ケース21の下面
に接着していくので、接着剤6を離隔した非接着部分7
がら空気が逃げるのでシート2と上ケース21の間に気
泡が残る虞れはない。
Although the figure shows it in an exploded form, the assembly of this embodiment is carried out in the following steps. First, the release paper (not shown) on the top surface of the position detection substrate 1 is peeled off, and the position detection substrate 1 is attached to the bottom surface of the upper case 21 . Here, position detection board 1
Since the adhesive 6 is adhered to the lower surface of the upper case 21 while peeling off the release paper, the adhesive 6 is separated from the non-adhesive part 7.
Since the air escapes, there is no risk of air bubbles remaining between the sheet 2 and the upper case 21.

なお検出用基板1の上面の代りに上ケース21の下面に
非接着部分を残して接着剤を塗りこれらを貼り合わせる
ようにしても良い。この場合にも非接着部分から空気が
逃げるので無雑作に貼り合わせても気泡は残らない。
Note that instead of the upper surface of the detection substrate 1, a non-adhesive portion may be left on the lower surface of the upper case 21 and an adhesive may be applied to the lower surface of the upper case 21 to bond them together. In this case as well, air escapes from the non-adhesive portions, so no air bubbles remain even if they are laminated together carelessly.

なお又、本実施例では静電結合方式用の電極3.5を形
成したが、本発明は電磁結合方式その他の方式にも適用
可能であり、また座標入力装置(ディジタイザ−)だけ
でなくタブレット入力装置等にも適用し得る。
Furthermore, in this embodiment, the electrode 3.5 is formed for an electrostatic coupling method, but the present invention can be applied to an electromagnetic coupling method and other methods. It can also be applied to input devices and the like.

[発明の効果] 以上説明したように本発明によれば基板を筐体に取着す
る際気泡が残る虞れなく安心して作業ができ、従って組
立時間の短縮ができ歩留まりが向上する。
[Effects of the Invention] As described above, according to the present invention, when attaching a board to a casing, the work can be carried out with peace of mind without the risk of leaving bubbles, and therefore the assembly time can be shortened and the yield can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を示す分解斜視図である。 1・・・座標検出用基板、 2・・・シート、3.5・
・・電極、 6・・・接着剤、 7・・・非接着部分、
21・・・上ケース。
FIG. 1 is an exploded perspective view showing one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Coordinate detection board, 2... Sheet, 3.5.
...electrode, 6...adhesive, 7...non-adhesive part,
21... Upper case.

Claims (1)

【特許請求の範囲】[Claims]  筐体に貼着される位置検出用基板であって、基板の貼
付面には接着剤塗布部分と、該塗布された接着剤を相互
に離隔する非接着部分を交叉して設けたことを特徴とす
る位置検出用基板。
A position detection board that is pasted on a housing, characterized in that the pasting surface of the board is provided with an adhesive-applied part and a non-adhesive part that separates the applied adhesive from each other. A board for position detection.
JP31717987A 1987-12-15 1987-12-15 Position detection board Expired - Fee Related JP2597118B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31717987A JP2597118B2 (en) 1987-12-15 1987-12-15 Position detection board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31717987A JP2597118B2 (en) 1987-12-15 1987-12-15 Position detection board

Publications (2)

Publication Number Publication Date
JPH01158519A true JPH01158519A (en) 1989-06-21
JP2597118B2 JP2597118B2 (en) 1997-04-02

Family

ID=18085330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31717987A Expired - Fee Related JP2597118B2 (en) 1987-12-15 1987-12-15 Position detection board

Country Status (1)

Country Link
JP (1) JP2597118B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010165094A (en) * 2009-01-14 2010-07-29 Fujikura Ltd Capacitance type touch sensor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS625344U (en) * 1985-06-21 1987-01-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS625344U (en) * 1985-06-21 1987-01-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010165094A (en) * 2009-01-14 2010-07-29 Fujikura Ltd Capacitance type touch sensor

Also Published As

Publication number Publication date
JP2597118B2 (en) 1997-04-02

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