JPH01158464U - - Google Patents
Info
- Publication number
- JPH01158464U JPH01158464U JP5425088U JP5425088U JPH01158464U JP H01158464 U JPH01158464 U JP H01158464U JP 5425088 U JP5425088 U JP 5425088U JP 5425088 U JP5425088 U JP 5425088U JP H01158464 U JPH01158464 U JP H01158464U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- lead wires
- mount
- tape
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5425088U JPH01158464U (enExample) | 1988-04-22 | 1988-04-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5425088U JPH01158464U (enExample) | 1988-04-22 | 1988-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01158464U true JPH01158464U (enExample) | 1989-11-01 |
Family
ID=31280186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5425088U Pending JPH01158464U (enExample) | 1988-04-22 | 1988-04-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01158464U (enExample) |
-
1988
- 1988-04-22 JP JP5425088U patent/JPH01158464U/ja active Pending
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