JPH01157470U - - Google Patents

Info

Publication number
JPH01157470U
JPH01157470U JP4673988U JP4673988U JPH01157470U JP H01157470 U JPH01157470 U JP H01157470U JP 4673988 U JP4673988 U JP 4673988U JP 4673988 U JP4673988 U JP 4673988U JP H01157470 U JPH01157470 U JP H01157470U
Authority
JP
Japan
Prior art keywords
circuit board
molded product
flexible circuit
embedded
resin molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4673988U
Other languages
English (en)
Japanese (ja)
Other versions
JP2510436Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988046739U priority Critical patent/JP2510436Y2/ja
Publication of JPH01157470U publication Critical patent/JPH01157470U/ja
Application granted granted Critical
Publication of JP2510436Y2 publication Critical patent/JP2510436Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
JP1988046739U 1988-04-08 1988-04-08 樹脂成形品に埋設される可撓性回路板 Expired - Lifetime JP2510436Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988046739U JP2510436Y2 (ja) 1988-04-08 1988-04-08 樹脂成形品に埋設される可撓性回路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988046739U JP2510436Y2 (ja) 1988-04-08 1988-04-08 樹脂成形品に埋設される可撓性回路板

Publications (2)

Publication Number Publication Date
JPH01157470U true JPH01157470U (US08124317-20120228-C00060.png) 1989-10-30
JP2510436Y2 JP2510436Y2 (ja) 1996-09-11

Family

ID=31272993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988046739U Expired - Lifetime JP2510436Y2 (ja) 1988-04-08 1988-04-08 樹脂成形品に埋設される可撓性回路板

Country Status (1)

Country Link
JP (1) JP2510436Y2 (US08124317-20120228-C00060.png)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58120659U (ja) * 1982-02-12 1983-08-17 株式会社日立製作所 混成集積回路パツケ−ジ
JPS6149484U (US08124317-20120228-C00060.png) * 1984-09-03 1986-04-03
JPS61149378U (US08124317-20120228-C00060.png) * 1985-03-08 1986-09-16
JPS62172176U (US08124317-20120228-C00060.png) * 1986-04-15 1987-10-31

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58120659U (ja) * 1982-02-12 1983-08-17 株式会社日立製作所 混成集積回路パツケ−ジ
JPS6149484U (US08124317-20120228-C00060.png) * 1984-09-03 1986-04-03
JPS61149378U (US08124317-20120228-C00060.png) * 1985-03-08 1986-09-16
JPS62172176U (US08124317-20120228-C00060.png) * 1986-04-15 1987-10-31

Also Published As

Publication number Publication date
JP2510436Y2 (ja) 1996-09-11

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