JPH01157463U - - Google Patents
Info
- Publication number
- JPH01157463U JPH01157463U JP4706688U JP4706688U JPH01157463U JP H01157463 U JPH01157463 U JP H01157463U JP 4706688 U JP4706688 U JP 4706688U JP 4706688 U JP4706688 U JP 4706688U JP H01157463 U JPH01157463 U JP H01157463U
- Authority
- JP
- Japan
- Prior art keywords
- thermally conductive
- conductive pattern
- hybrid
- generating component
- heat generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4706688U JPH01157463U (un) | 1988-04-07 | 1988-04-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4706688U JPH01157463U (un) | 1988-04-07 | 1988-04-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01157463U true JPH01157463U (un) | 1989-10-30 |
Family
ID=31273297
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4706688U Pending JPH01157463U (un) | 1988-04-07 | 1988-04-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01157463U (un) |
-
1988
- 1988-04-07 JP JP4706688U patent/JPH01157463U/ja active Pending