JPH01156580U - - Google Patents

Info

Publication number

JPH01156580U

JPH01156580U JP5425188U JP5425188U JPH01156580U JP H01156580 U JPH01156580 U JP H01156580U JP 5425188 U JP5425188 U JP 5425188U JP 5425188 U JP5425188 U JP 5425188U JP H01156580 U JPH01156580 U JP H01156580U

Authority

JP

Japan

Prior art keywords

attachment

integrated circuit

components

attached

circuit device

Prior art date

1988-04-21

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000010586 diagram Methods 0.000 description 4
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1