JPH01156551U - - Google Patents
Info
- Publication number
- JPH01156551U JPH01156551U JP1988052365U JP5236588U JPH01156551U JP H01156551 U JPH01156551 U JP H01156551U JP 1988052365 U JP1988052365 U JP 1988052365U JP 5236588 U JP5236588 U JP 5236588U JP H01156551 U JPH01156551 U JP H01156551U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor device
- semiconductor
- electrodes
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 5
- 238000002161 passivation Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- 229910052737 gold Inorganic materials 0.000 claims 2
- 229910052745 lead Inorganic materials 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 230000004888 barrier function Effects 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05556—Shape in side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988052365U JPH01156551U (US08063081-20111122-C00044.png) | 1988-04-19 | 1988-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988052365U JPH01156551U (US08063081-20111122-C00044.png) | 1988-04-19 | 1988-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01156551U true JPH01156551U (US08063081-20111122-C00044.png) | 1989-10-27 |
Family
ID=31278366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988052365U Pending JPH01156551U (US08063081-20111122-C00044.png) | 1988-04-19 | 1988-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01156551U (US08063081-20111122-C00044.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5441666A (en) * | 1977-09-09 | 1979-04-03 | Hitachi Ltd | Semiconductor integrated circuit element |
-
1988
- 1988-04-19 JP JP1988052365U patent/JPH01156551U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5441666A (en) * | 1977-09-09 | 1979-04-03 | Hitachi Ltd | Semiconductor integrated circuit element |
