JPH01156547U - - Google Patents

Info

Publication number
JPH01156547U
JPH01156547U JP1988052090U JP5209088U JPH01156547U JP H01156547 U JPH01156547 U JP H01156547U JP 1988052090 U JP1988052090 U JP 1988052090U JP 5209088 U JP5209088 U JP 5209088U JP H01156547 U JPH01156547 U JP H01156547U
Authority
JP
Japan
Prior art keywords
bump
large number
semiconductor device
parts
bumps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988052090U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988052090U priority Critical patent/JPH01156547U/ja
Publication of JPH01156547U publication Critical patent/JPH01156547U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Wire Bonding (AREA)
JP1988052090U 1988-04-20 1988-04-20 Pending JPH01156547U (is)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988052090U JPH01156547U (is) 1988-04-20 1988-04-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988052090U JPH01156547U (is) 1988-04-20 1988-04-20

Publications (1)

Publication Number Publication Date
JPH01156547U true JPH01156547U (is) 1989-10-27

Family

ID=31278099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988052090U Pending JPH01156547U (is) 1988-04-20 1988-04-20

Country Status (1)

Country Link
JP (1) JPH01156547U (is)

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