JPH01156514U - - Google Patents
Info
- Publication number
- JPH01156514U JPH01156514U JP5389088U JP5389088U JPH01156514U JP H01156514 U JPH01156514 U JP H01156514U JP 5389088 U JP5389088 U JP 5389088U JP 5389088 U JP5389088 U JP 5389088U JP H01156514 U JPH01156514 U JP H01156514U
- Authority
- JP
- Japan
- Prior art keywords
- terminal board
- terminal
- electronic component
- component body
- protrudes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Description
第１図、第２図は本考案の面実装用電子部品の
一実施例を示す正面断面図と底面図、第３図、第
４図は従来の面実装用電子部品の正面断面図と底
面図である。
１１……端子、１２……配線用端子部分、１３
……ホーミング前の端子、１４……端子板の底面
、１５……端子板、１６……ポツトコア、１７…
…ドラムコア、１８……巻線コイル、１９……配
線溝、１１Ａ……面実装部分、２０……リード線
。
1 and 2 are a front sectional view and a bottom view showing an embodiment of the surface mount electronic component of the present invention, and FIGS. 3 and 4 are a front sectional view and bottom view of a conventional surface mount electronic component. It is a diagram. 11...Terminal, 12...Wiring terminal part, 13
... Terminal before homing, 14 ... Bottom of terminal board, 15 ... Terminal board, 16 ... Pot core, 17 ...
...Drum core, 18...Wound coil, 19...Wiring groove, 11A...Surface mounting part, 20...Lead wire.
Claims (1)
ト成形し、この端子板上に電子部品本体を取付け
、この電子部品本体のリード線を端子板の下面に
突出した配線端子に接続し、端子板の側面に突出
した部分をＬ字状に折曲して端子板の底面と面一
となる面実装端子としてなる面実装用部品。 Insert mold the tip into the terminal board so that it protrudes from the bottom surface, mount the electronic component body on this terminal board, connect the lead wire of this electronic component body to the wiring terminal that protrudes from the bottom surface of the terminal board, and then attach the electronic component body to the terminal board. A surface mount component that is made into a surface mount terminal by bending the protruding part on the side into an L-shape so that it is flush with the bottom of the terminal board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5389088U JPH01156514U (en) | 1988-04-21 | 1988-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5389088U JPH01156514U (en) | 1988-04-21 | 1988-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01156514U true JPH01156514U (en) | 1989-10-27 |
Family
ID=31279845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5389088U Pending JPH01156514U (en) | 1988-04-21 | 1988-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01156514U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6022806B2 (en) * | 1977-11-04 | 1985-06-04 | オリンパス光学工業株式会社 | release type electromagnet device |
-
1988
- 1988-04-21 JP JP5389088U patent/JPH01156514U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6022806B2 (en) * | 1977-11-04 | 1985-06-04 | オリンパス光学工業株式会社 | release type electromagnet device |
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