JPH01155673U - - Google Patents
Info
- Publication number
- JPH01155673U JPH01155673U JP5195188U JP5195188U JPH01155673U JP H01155673 U JPH01155673 U JP H01155673U JP 5195188 U JP5195188 U JP 5195188U JP 5195188 U JP5195188 U JP 5195188U JP H01155673 U JPH01155673 U JP H01155673U
- Authority
- JP
- Japan
- Prior art keywords
- locking
- female
- contact plate
- electrical connector
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 2
- 238000000034 method Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Connector Housings Or Holding Contact Members (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5195188U JPH01155673U (ar) | 1988-04-18 | 1988-04-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5195188U JPH01155673U (ar) | 1988-04-18 | 1988-04-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01155673U true JPH01155673U (ar) | 1989-10-25 |
Family
ID=31277967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5195188U Pending JPH01155673U (ar) | 1988-04-18 | 1988-04-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01155673U (ar) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995010128A1 (fr) * | 1993-10-01 | 1995-04-13 | Ryosei Electro-Circuit Systems, Ltd. | Borne de jonction et son procede de fabrication |
-
1988
- 1988-04-18 JP JP5195188U patent/JPH01155673U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995010128A1 (fr) * | 1993-10-01 | 1995-04-13 | Ryosei Electro-Circuit Systems, Ltd. | Borne de jonction et son procede de fabrication |