JPH01154633U - - Google Patents

Info

Publication number

JPH01154633U

JPH01154633U JP5263388U JP5263388U JPH01154633U JP H01154633 U JPH01154633 U JP H01154633U JP 5263388 U JP5263388 U JP 5263388U JP 5263388 U JP5263388 U JP 5263388U JP H01154633 U JPH01154633 U JP H01154633U

Authority

JP

Japan

Prior art keywords

bonding pad

semiconductor substrate

semiconductor device

protective film

insulating protective

Prior art date

1988-04-18

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 10
• 230000001681 protective effect Effects 0.000 claims description 3
• 239000000758 substrate Substances 0.000 claims 4
• 230000015556 catabolic process Effects 0.000 claims 1
• 229920002120 photoresistant polymer Polymers 0.000 description 2
• 238000004519 manufacturing process Methods 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 125000006850 spacer group Chemical group 0.000 description 1