JPH0115356B2 - - Google Patents

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Publication number
JPH0115356B2
JPH0115356B2 JP54065003A JP6500379A JPH0115356B2 JP H0115356 B2 JPH0115356 B2 JP H0115356B2 JP 54065003 A JP54065003 A JP 54065003A JP 6500379 A JP6500379 A JP 6500379A JP H0115356 B2 JPH0115356 B2 JP H0115356B2
Authority
JP
Japan
Prior art keywords
wire
lubricant
plating layer
porosity
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54065003A
Other languages
Japanese (ja)
Other versions
JPS55156691A (en
Inventor
Hirokimi Takeuchi
Akira Horata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Original Assignee
Daido Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd filed Critical Daido Steel Co Ltd
Priority to JP6500379A priority Critical patent/JPS55156691A/en
Publication of JPS55156691A publication Critical patent/JPS55156691A/en
Publication of JPH0115356B2 publication Critical patent/JPH0115356B2/ja
Granted legal-status Critical Current

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  • Nonmetallic Welding Materials (AREA)
  • Electroplating Methods And Accessories (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

発明の目的 purpose of invention

【産業上の利用分野】[Industrial application field]

本発明は、ガスシールドアーク溶接用ワイヤの
改良に関し、その製造法をも包含する。
The present invention relates to improvements in gas-shielded arc welding wires, and also includes a method for manufacturing the same.

【従来の技術】[Conventional technology]

ガスシールドアーク溶接の電極ワイヤ(以下、
単に「ワイヤ」という)は、従前は、表面をミク
ロ的に平滑にし、かつ製造工程で用いた潤滑剤な
どの残存付着量を極力低くすべきであるとされて
いた。これは、溶接装置のコンジツトチユーブ内
をワイヤや円滑に通つて行くことがスパツタの防
止にとつて肝要であり、また溶接時、油脂などの
潤滑剤の分解生成物に起因して溶接欠陥ができた
り、潤滑剤に伴つて付着したホコリがコンジツト
チユーブ内に堆積して安定なワイヤの送給を妨げ
るといつたことがないように、との配慮から出た
ものである。 しかし、潤滑剤の量を極度に少なくすること
は、上記した潤滑剤成分に起因する溶接欠陥の低
減には有効であつても、やはり潤滑剤不足による
送給ムラを不可避にし、ワイヤ送給の微振動にも
とづくスパツタ発生を多くする。そこで、ワイヤ
10Kgあたり0.5〜2gの範囲に規制された量の潤
滑剤を用いることによつて、この問題を解決する
ことなどが提案されていた。 ところが実際上、ミクロ的にち密平滑なワイヤ
表面に上記範囲内で下限に近い量の潤滑剤を使用
したのでは、ワイヤ表面に均一な潤滑剤被覆をつ
くることは極て困難である。潤滑剤被膜が他物と
の接触によつて拭い去られるおそれもあり、しば
しばワイヤ炭給の安定を欠き、スパツタ防止の意
図がはたせない。一方、潤滑剤の分解生成物がひ
きおこす溶接欠陥を考えると、潤滑剤の量は少な
いに越したことはない。また、潤滑剤をあまり多
量に用いると、長時間の装置使用につれてワイヤ
送給抵抗がかえつて増大する傾向がある。これ
は、潤滑剤が多いとワイヤにホコリがつきやすく
なり、そのホコリがコンジツトチユーブ内に蓄積
するためであることがわかつた。
Electrode wire for gas shielded arc welding (hereinafter referred to as
In the past, it was believed that the surface of wires (simply referred to as "wires") should be microscopically smooth and that the amount of residual lubricant used in the manufacturing process should be kept as low as possible. This is because it is important to ensure that the wire passes smoothly through the conduit tube of the welding equipment in order to prevent spatter, and also to prevent welding defects due to decomposition products of lubricants such as oil and fat during welding. This was done to prevent the conduit tube from accumulating in the conduit tube and interfering with stable wire feeding due to dust attached with the lubricant. However, even though extremely reducing the amount of lubricant is effective in reducing welding defects caused by the lubricant components mentioned above, it still inevitably leads to uneven feeding due to lack of lubricant, making it difficult to feed the wire. Increases the occurrence of spatter due to micro vibrations. So, the wire
It has been proposed to solve this problem by using a regulated amount of lubricant in the range of 0.5 to 2 g per 10 kg. However, in practice, if an amount of lubricant close to the lower limit within the above range is used on the microscopically dense and smooth wire surface, it is extremely difficult to create a uniform lubricant coating on the wire surface. There is also a risk that the lubricant film may be wiped off by contact with other objects, and the wire charcoal feeding often lacks stability, making the purpose of preventing spatter impossible. On the other hand, considering the welding defects caused by the decomposition products of the lubricant, it is better to use less lubricant. Furthermore, if too much lubricant is used, the wire feeding resistance tends to increase as the device is used for a long time. It turns out that this is because too much lubricant makes it easier for wires to become dusty, and that dust accumulates inside the conduit tube.

【発明が解決しようとする問題点】[Problems to be solved by the invention]

本発明の目的は、上記の諸問題を解消し、溶接
時の送給性が改善され、作業は安定でスパツタの
発生が少なく、しかも溶接欠陥の生じる危険の低
い溶接を可能にする溶接用ワイヤと、その好適な
製造法を提供することにある。 発明の構成
The purpose of the present invention is to provide a welding wire that solves the above-mentioned problems, improves feedability during welding, provides stable work, reduces the occurrence of spatter, and enables welding with a low risk of welding defects. and to provide a suitable manufacturing method thereof. Composition of the invention

【問題点を解決するための手段】[Means to solve the problem]

本発明のガスシールドアーク溶接用ワイヤは、
溶接用ワイヤ材料の表面を多孔度5〜50%の多孔
質銅メツキ層で被覆し、このメツキ層に潤滑剤を
含ませて成る。 ここで「多孔度」とは、ワイヤ表面を顕微鏡観
察したとき、見かけ上の表面より凹である部分が
全表面中に占める面積の割合(%)として定義さ
れる。 潤滑剤は従来から使われていたものでよく、そ
の量は、適切な多孔度の表面被覆層が与えられれ
ば従来より少量で足り、たとえばワイヤ10Kgあた
り0.1〜0.5gで、従来の0.5〜2gの場合に匹敵す
る低いワイヤ送給抵抗が得られる。 本発明の上記溶接用ワイヤの製造法のひとつの
態様は、溶接用ワイヤ素材の表面に多孔質のメツ
キ層を与える条件で銅メツキを施し、このメツキ
層に潤滑剤を塗布して減面率60〜10%の条件で伸
線を行ない、所望のワイヤ径にするとともにメツ
キ層の多孔度を5〜50%の範囲に調節することか
らなる。いまひとつの態様は、溶接用ワイヤ素材
の表面に多孔質のメツキ層を与える条件で銅メツ
キを施し、このメツキ層を酸洗処理したのち、潤
滑剤を塗布して減面率80〜10%の条件で伸線を行
ない、所望のワイヤ径にするとともにメツキ層の
多孔度を5〜50%の範囲に調節することからな
る。 メツキ手段としては、電気メツキおよび化学浸
漬メツキのいずれも利用できるし、気相メツキす
なわち蒸着によることもできる。化学メツキは多
孔質のメツキ層を与える傾向が大きいが、電気メ
ツキにおいても電流密度その他の電解条件の選択
により多孔度を調節することができる。その具体
的方法は、後記する実施例を参考に、メツキ技術
において知られているところに従えばよい。 本発明がガスシールドアーク溶接に使用するど
のような溶接用ワイヤに対しても適用できること
は容易に理解されるであろうが、代表的な応用分
野は、軟鋼または低合金鋼をワイヤ材料とするも
のである。
The gas shielded arc welding wire of the present invention is
The surface of the welding wire material is coated with a porous copper plating layer having a porosity of 5 to 50%, and this plating layer is impregnated with a lubricant. Here, "porosity" is defined as the ratio (%) of the area of the entire surface occupied by a portion that is more concave than the apparent surface when the wire surface is observed under a microscope. The lubricant used can be any conventionally used lubricant, and its amount can be smaller than conventionally as long as a surface coating layer with appropriate porosity is provided, for example, 0.1 to 0.5 g per 10 kg of wire, compared to the conventional 0.5 to 2 g. A low wire feed resistance comparable to that obtained is obtained. One embodiment of the method for producing the welding wire of the present invention is to apply copper plating to the surface of the welding wire material under conditions that provide a porous plating layer, and apply a lubricant to this plating layer to reduce the area reduction. Wire drawing is carried out under conditions of 60 to 10% to obtain a desired wire diameter, and the porosity of the plating layer is adjusted to a range of 5 to 50%. Another method is to apply copper plating under conditions that provide a porous plating layer to the surface of the welding wire material, pickle the plating layer, and then apply a lubricant to achieve an area reduction rate of 80 to 10%. The process consists of drawing the wire under certain conditions to obtain the desired wire diameter and adjusting the porosity of the plating layer within the range of 5 to 50%. As the plating means, both electroplating and chemical immersion plating can be used, and vapor phase plating, that is, vapor deposition can also be used. Chemical plating tends to provide a porous plating layer, but even in electroplating, the porosity can be adjusted by selecting current density and other electrolytic conditions. The specific method may be based on what is known in the plating technology, with reference to the examples described later. Although it will be readily appreciated that the present invention is applicable to any welding wire used in gas-shielded arc welding, a typical field of application is where the wire material is mild steel or low alloy steel. It is something.

【作用】[Effect]

本発明者らは、前記した諸問題の解決をめざし
て研究の結果、次のような知見を得た。 第一は、安定なワイヤ送給にとつて、ワイヤ表
面の状態は、ミクロ的に平滑であることよりもむ
しろ、潤滑剤が均一に被覆しているか否かの方が
重要であること、(ワイヤ表面が平滑でミクロ的
には十分な潤滑剤量を与えても、付着のムラとく
に潤滑剤被膜切れがあると送給性は悪くなるこ
と)である。そして、潤滑剤の均一な被膜は、ワ
イヤ表面をち密平滑にするより、むしろ適度に多
孔質にしてそこに潤滑剤を存在させることによつ
て得られること、である。 その第二は、ワイヤの製造において多くの場合
に行なわれるメツキ工程において、メツキ条件に
よつては上記した適度の多孔性をもつたメツキ層
を与えることができ、またメツキ後の伸線によつ
てこの層の多孔度は低下し、その度合は減面率が
大きいほど高まること、およびメツキ後に酸洗を
行なうことによつて多孔度を増大できること、な
どである。これらの事実を利用すれば、ワイヤ表
面のメツキ層の多孔度を所望のレベルにコントロ
ールすることができる。 メツキ層の多孔度は、後に示す実例から明らか
なように、5%に達しない低い値では潤滑剤に拠
点を与える作用が不十分であり、他方、50%を超
える高い多孔度にすると、表面が粗であることに
もとづく送給抵抗が大きくなる。 前述のように、メツキ後の伸縮によつてメツキ
層の多孔度が低下するので、必要な多孔度を確保
するためには、伸線の減面率をあまり高くとるこ
とができない。通常は60%以下に止めるべきであ
る。 他方、メツキ後に酸洗をすると、前述のとおり
メツキ層の多孔度が高まるので、この工程を加え
た場合は伸線の減面率に対する制約は緩和され、
上限の80%程度まで高くとることができる。 上記いずれの場合も、伸線の減面率は10%以上
にえらぶべきである。10%に満たない低い減面率
では、一般に、ワイヤ表面に形成した多孔質のメ
ツキ層の多孔度を、前記した上限値50%より低く
することが困難である。
The present inventors have obtained the following knowledge as a result of research aimed at solving the above-mentioned problems. First, for stable wire feeding, it is more important whether the wire surface is uniformly coated with lubricant than whether it is microscopically smooth. Even if the wire surface is smooth and a microscopically sufficient amount of lubricant is applied, uneven adhesion, especially breaks in the lubricant coating, will deteriorate feeding performance. A uniform coating of lubricant can be obtained by making the wire surface moderately porous and allowing the lubricant to exist there, rather than by making the wire surface dense and smooth. Second, in the plating process that is often carried out in wire manufacturing, depending on the plating conditions, it is possible to provide a plating layer with the above-mentioned appropriate porosity. The porosity of this layer decreases, and the degree of porosity increases as the area reduction rate increases, and the porosity can be increased by pickling after plating. By utilizing these facts, the porosity of the plating layer on the wire surface can be controlled to a desired level. As is clear from the examples shown later, when the porosity of the plating layer is as low as 5%, the effect of providing a base for the lubricant is insufficient.On the other hand, when the porosity is higher than 50%, the surface The feeding resistance increases due to the roughness of the feed. As mentioned above, the porosity of the plating layer decreases due to expansion and contraction after plating, so in order to ensure the necessary porosity, the area reduction rate of wire drawing cannot be set too high. Normally it should be kept below 60%. On the other hand, if pickling is performed after plating, the porosity of the plating layer will increase as mentioned above, so if this step is added, the restrictions on the area reduction rate during wire drawing will be relaxed,
It can be set as high as 80% of the upper limit. In any of the above cases, the area reduction rate for wire drawing should be selected to be 10% or more. At a low area reduction rate of less than 10%, it is generally difficult to reduce the porosity of the porous plating layer formed on the wire surface to less than the above-mentioned upper limit of 50%.

【実施例】 Si Mn Fe 0.03 0.79 1.56 0.009 0.014 残余 上記の組成(%)をもつ材料を使用し、第1表
に掲げた製造工程に従つて加工して、ワイヤとし
た。メツキとそれに続く酸洗の条件は、第2表に
示すとおりである。得られたワイヤの特性を、第
3表に示す。潤滑剤としてはナタネ油を用い、付
着量をコントロールするためペンタンで種々の割
合に稀釈した。 比較のため示したNo.1は、減面率が低すぎて多
孔度が上限を越えた場合、またはNo.8は、減面率
が高すぎて多孔度が極端に低くなつた場合の例で
ある。
[Example] C Si Mn P S Fe 0.03 0.79 1.56 0.009 0.014 Remainder A wire having the above composition (%) was used and processed according to the manufacturing process listed in Table 1. The conditions for plating and subsequent pickling are shown in Table 2. The properties of the obtained wire are shown in Table 3. Rapeseed oil was used as a lubricant and diluted in various proportions with pentane to control the amount of adhesion. No. 1 shown for comparison is an example where the area reduction rate is too low and the porosity exceeds the upper limit, and No. 8 is an example where the area reduction rate is too high and the porosity becomes extremely low. It is.

【表】【table】

【表】【table】

【表】【table】

【表】 ** 最終伸線後に脱脂したもの
次に、これらの供試ワイヤを用いて下記の溶接
条件で溶接試験を実施し、ワイヤ500Kg使用の時
点におけるコンジツトチユーブ内でのワイヤ送給
抵抗を測定した。 溶接機(容量):半自動溶接機(500A) コンジツトチユーブ:チユーブ長3m、内径3mm 溶接電流:350A アーク電圧:35V 溶接速度:28cm/min シールドガス:CO220/min 多孔度とワイヤ送給抵抗との関係を第1図に、
また、多孔度と伸線時の傾面率との関係を第2図
に、それぞれ示す。 第1図のグラフは、ワイヤ表面層の多孔度が5
〜50%の範囲にある限り(No.2〜No.7およびNo.
9)、潤滑剤量の多少にかかわらず、送給抵抗は
常に低く(2.3〜3.7Kg)なること、そして多孔度
がこの範囲により高くても(No.2)低くても(No.
8)、送給抵抗は高く(5Kgまたはそれ以上)な
ること、を示している。潤滑剤についていえば、
従来は、ワイヤによい送給性を確保するためには
ワイヤ10Kgあたり0.5g以上の潤滑剤が必要であ
るとされていたが、本発明によればそれ以下の少
量で足りることがわかる。 また第2図のグラフは、ワイヤ表面の多孔度が
減面率の増大につれて低くなることを示してい
る。これまで送給性が良好とされていた、表面が
ち密で平滑なワイヤを得るためには、80〜90%ま
たはそれ以上の高い減面率(No.8)が必要である
が、本発明のワイヤを得るには、10〜60%範囲の
減面率(No.2〜7、No.9)が適当であることが、
第2図からわかる。また、メツキ後に酸洗工程を
加えた場合は、80%程度の高い減面率も使用可能
であることもわかる。(No.7) ワイヤが他物と接触することがあつても、付着
した潤滑剤が拭い去られないことが望ましいの
で、その点をしらべるため、各ワイヤの表面を乾
いたガーゼでふきとつて、残留する潤滑剤の量を
測定した。その結果を4表に示す。第4表のデー
タは、表面多孔度がごく低いワイヤ(No.8)にお
いては、他物との接触により潤滑油が容易に拭い
去られてしまうことを示している。
[Table] ** Degreased after final wire drawing Next, a welding test was conducted using these sample wires under the following welding conditions, and the wire feeding resistance within the conduit tube when 500 kg of wire was used. was measured. Welding machine (capacity): Semi-automatic welding machine (500A) Conduit tube: Tube length 3m, inner diameter 3mm Welding current: 350A Arc voltage: 35V Welding speed: 28cm/min Shielding gas: CO 2 20/min Porosity and wire feeding The relationship with resistance is shown in Figure 1.
Furthermore, the relationship between porosity and slope ratio during wire drawing is shown in FIG. The graph in Figure 1 shows that the porosity of the wire surface layer is 5.
As long as it is within the range of ~50% (No. 2 to No. 7 and No.
9) Regardless of the amount of lubricant, the feeding resistance will always be low (2.3-3.7Kg), and even if the porosity is higher (No. 2) or lower (No. 2) than this range.
8) indicates that the feed resistance will be high (5Kg or more). Speaking of lubricants,
Conventionally, it was thought that 0.5 g or more of lubricant was required per 10 kg of wire to ensure good wire feedability, but according to the present invention, it has been found that a smaller amount is sufficient. The graph in FIG. 2 also shows that the porosity of the wire surface decreases as the area reduction increases. In order to obtain a wire with a dense and smooth surface, which has been thought to have good feedability, a high area reduction rate (No. 8) of 80 to 90% or more is required, but the present invention In order to obtain a wire of
This can be seen from Figure 2. It can also be seen that if a pickling process is added after plating, an area reduction rate as high as 80% can be used. (No. 7) Even if the wires come into contact with other objects, it is desirable that the attached lubricant is not wiped off, so to check this, wipe the surface of each wire with dry gauze. , the amount of remaining lubricant was measured. The results are shown in Table 4. The data in Table 4 shows that in the wire (No. 8) with very low surface porosity, the lubricating oil is easily wiped off by contact with other objects.

【表】 別に、本発明のワイヤの表面を走査型電子顕微
鏡写真にとつて、従来のち密平滑表面を有するワ
イヤと比較観察した。第3図A〜Cおよび第4図
がその写真であつて、前者にはいずれも細孔が分
布していて潤滑剤の拠点となり得ることがわかる
が、後者にはそのような細孔が見当らない。 発明の効果 本発明のガスシールドアーク溶接用のワイヤ
は、溶接に対して全く悪影響のない程度に少量の
潤滑剤を表面に有するだけで、送給性がすぐれて
いる。これにより、ボイラまたはその他の圧力容
器、各種化学反応容器などを製作する際の溶接作
業が、安定して、スパツタの発生少なく実施で
き、欠陥のない良好な溶接部を得ることができ
る。 そしてこのようなワイヤは、本発明に従つて多
孔質メツキ層を特定の減面率で伸線することによ
つて得られる。
[Table] Separately, the surface of the wire of the present invention was photographed using a scanning electron microscope and compared with a conventional wire having a dense and smooth surface. Figures 3A to 3C and Figure 4 are photographs of the same, and it can be seen that the former have pores distributed and can serve as bases for lubricant, but no such pores are found in the latter. do not have. Effects of the Invention The wire for gas-shielded arc welding of the present invention has excellent feedability because it has only a small amount of lubricant on the surface to the extent that it has no adverse effect on welding. As a result, welding work when manufacturing boilers or other pressure vessels, various chemical reaction vessels, etc. can be carried out stably and with less spatter, and a good welded part without defects can be obtained. Such a wire can be obtained by drawing a porous plating layer at a specific reduction in area according to the present invention.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、溶接用ワイヤの表面の多孔度と、そ
の500Kgを使用した時点での溶接装置のコンジツ
トチユーブ内の送給抵抗との関係を示すグラフで
ある。第2図は、ワイヤの製造時に行なう伸線の
減面率(%)に対するワイヤ表面の多孔度(%)
を示すグラフである。第3図A,BおよびCは、
いずれも本発明によるワイヤの表面の電子顕微鏡
写真(倍率1000)であり、第4図は従来のワイヤ
の表面の同様な電子顕微鏡写真(倍率1000)であ
る。
FIG. 1 is a graph showing the relationship between the porosity of the surface of the welding wire and the feeding resistance in the conduit tube of the welding device when 500 kg of the welding wire is used. Figure 2 shows the porosity (%) of the wire surface relative to the area reduction rate (%) of wire drawing performed during wire manufacturing.
This is a graph showing. Figure 3 A, B and C are
Both are electron micrographs (magnification: 1000) of the surface of the wire according to the present invention, and FIG. 4 is a similar electron micrograph (magnification: 1000) of the surface of a conventional wire.

Claims (1)

【特許請求の範囲】 1 溶接用ワイヤ材料の表面を多孔度5〜50%の
多孔質銅メツキ層で被覆し、このメツキ層に潤滑
剤を含ませて成るガスシールドアーク溶接用ワイ
ヤ。 2 溶接用ワイヤ素材の表面に多孔質のメツキ層
を与える条件で銅メツキを施し、このメツキ層に
潤滑剤を塗布して減面率60〜10%の条件で伸線を
行ない、所望のワイヤ径にするとともにメツキ層
の多孔度を5〜50%の範囲に調節することからな
るガスシールドアーク溶接用ワイヤの製造法。 3 溶接用ワイヤ素材の表面に多孔質のメツキ層
を与える条件で銅メツキを施し、このメツキ層を
酸洗処理したのち、潤滑剤を塗布して減面率80〜
10%の条件で伸線を行ない、所望のワイヤ径にす
るとともにメツキ層の多孔度を5〜50%の範囲に
調節することからなるガスシールドアーク溶接用
ワイヤの製造法。
[Scope of Claims] 1. A gas-shielded arc welding wire comprising a welding wire material whose surface is coated with a porous copper plating layer having a porosity of 5 to 50%, and this plating layer contains a lubricant. 2 Copper plating is applied to the surface of the welding wire material under conditions that provide a porous plating layer, a lubricant is applied to this plating layer, and wire drawing is performed under conditions of an area reduction rate of 60 to 10% to form the desired wire. A method for manufacturing a wire for gas shielded arc welding, which comprises adjusting the diameter and the porosity of the plating layer to a range of 5 to 50%. 3 Copper plating is applied to the surface of the welding wire material under conditions that provide a porous plating layer, and after this plating layer is pickled, a lubricant is applied to increase the area reduction rate to 80~
A method for manufacturing a wire for gas shielded arc welding, which comprises drawing the wire under conditions of 10% to obtain a desired wire diameter and adjusting the porosity of the plating layer to a range of 5 to 50%.
JP6500379A 1979-05-28 1979-05-28 Gas shielded arc welding wire and its production Granted JPS55156691A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6500379A JPS55156691A (en) 1979-05-28 1979-05-28 Gas shielded arc welding wire and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6500379A JPS55156691A (en) 1979-05-28 1979-05-28 Gas shielded arc welding wire and its production

Publications (2)

Publication Number Publication Date
JPS55156691A JPS55156691A (en) 1980-12-05
JPH0115356B2 true JPH0115356B2 (en) 1989-03-16

Family

ID=13274381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6500379A Granted JPS55156691A (en) 1979-05-28 1979-05-28 Gas shielded arc welding wire and its production

Country Status (1)

Country Link
JP (1) JPS55156691A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05314645A (en) * 1992-05-06 1993-11-26 Matsushita Electric Ind Co Ltd Rotation driving device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58217190A (en) * 1982-06-10 1983-12-17 三洋電機株式会社 Drier
JP2556847B2 (en) * 1986-12-10 1996-11-27 株式会社神戸製鋼所 Gas shield welding wire
JPH082514B2 (en) * 1988-09-27 1996-01-17 松下電器産業株式会社 Gas shielded arc welding wire manufacturing method
JP4791218B2 (en) * 2006-03-15 2011-10-12 株式会社神戸製鋼所 Steel wire for gas shielded arc welding

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4913055A (en) * 1972-05-17 1974-02-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4913055A (en) * 1972-05-17 1974-02-05

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05314645A (en) * 1992-05-06 1993-11-26 Matsushita Electric Ind Co Ltd Rotation driving device

Also Published As

Publication number Publication date
JPS55156691A (en) 1980-12-05

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