JPH01152467U - - Google Patents
Info
- Publication number
- JPH01152467U JPH01152467U JP4966388U JP4966388U JPH01152467U JP H01152467 U JPH01152467 U JP H01152467U JP 4966388 U JP4966388 U JP 4966388U JP 4966388 U JP4966388 U JP 4966388U JP H01152467 U JPH01152467 U JP H01152467U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- clip
- tip
- attached
- flat package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4966388U JPH01152467U (enExample) | 1988-04-13 | 1988-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4966388U JPH01152467U (enExample) | 1988-04-13 | 1988-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01152467U true JPH01152467U (enExample) | 1989-10-20 |
Family
ID=31275750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4966388U Pending JPH01152467U (enExample) | 1988-04-13 | 1988-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01152467U (enExample) |
-
1988
- 1988-04-13 JP JP4966388U patent/JPH01152467U/ja active Pending
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