JPH01146666A - Abrasive cloth for fine polishing - Google Patents

Abrasive cloth for fine polishing

Info

Publication number
JPH01146666A
JPH01146666A JP62299998A JP29999887A JPH01146666A JP H01146666 A JPH01146666 A JP H01146666A JP 62299998 A JP62299998 A JP 62299998A JP 29999887 A JP29999887 A JP 29999887A JP H01146666 A JPH01146666 A JP H01146666A
Authority
JP
Japan
Prior art keywords
polishing
abrasive cloth
foam
average cell
cloth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62299998A
Other languages
Japanese (ja)
Other versions
JPH045687B2 (en
Inventor
Shigemi Mukoyama
滋美 向山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP62299998A priority Critical patent/JPH01146666A/en
Publication of JPH01146666A publication Critical patent/JPH01146666A/en
Publication of JPH045687B2 publication Critical patent/JPH045687B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To enable an abrasive cloth to obtain an excellent polishing characteristic by forming the abrasive cloth by a foam body with specific expansion ratios and specific average cell sizes. CONSTITUTION:An abrasive cloth for fine polishing is formed by a polyolefine resin foam body of cell-construction whose expansion ratios range from 1.5-30 and an average cell size in the section of the foam body is less than 300mum, preferably 1-90mum. When the expansion ratio is below 1.5, the abrasive cloth is hard, scratches caused by grits are not sufficiently smoothed out, and the surface being worked is subjected to damages, orange-peel, etc. On the other hand, when the expansion ratio exceeds 30, the abrasive cloth becomes too soft, an elastic deformation constant of the abrasive cloth becomes large, and flatness of the surface to be worked is reduced. Further, when an average cell size is larger than 300mum, the surface smoothness of the abrasive cloth becomes worse, surface defects such as scratches, orange-peels, etc. are easy to occur.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、研磨布に関するもので、シリコン単結晶ウェ
ハー、化合物半導体ウェハー、アルミディスク基板、ブ
ラウン管、光学レンズ、光学結晶等の精密研磨用研磨布
、特に鏡面仕上げ用として優れた研磨特性を有するポリ
オレフィン系樹脂発泡体からなる研磨布に関するもので
ある。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a polishing cloth, which is used for precision polishing of silicon single crystal wafers, compound semiconductor wafers, aluminum disk substrates, cathode ray tubes, optical lenses, optical crystals, etc. The present invention relates to a polishing cloth made of a polyolefin resin foam having excellent polishing properties, especially for mirror finishing.

〔従来の技術〕[Conventional technology]

近年、IC基板の大半を占めるシリコンウェハー基板で
は、集積回路の高集積度化に伴う回路線幅の縮小、高密
度化に加え、ウェハー径の拡大も進み、シリコンウェハ
ーの鏡面仕上げ精度への要求は、−層厳しさを増してき
ている。
In recent years, in silicon wafer substrates, which make up the majority of IC substrates, in addition to shrinking circuit line widths and increasing densities due to the increase in the degree of integration of integrated circuits, the diameter of the wafers has also increased, and the demand for mirror-finishing precision of silicon wafers has increased. is becoming increasingly severe.

又、GaAsに代表される化合物半導体は、シリコン半
導体に比べ、加工上傷付き易いと云う欠点を有し、更に
使われ方が多岐に亙るため、その鏡面仕上げ加工には、
シリコン基板以上の細心の注意と工夫が必要になる。
In addition, compound semiconductors such as GaAs have the disadvantage of being easily damaged during processing compared to silicon semiconductors, and since they are used in a wide variety of ways, it is necessary to process them for mirror finishing.
This requires even more care and ingenuity than silicon substrates.

このような加工物品(ウェハー等)への厳しい要求は、
当然、その一部が工具への要求の高度化となって現れて
(る、研磨工具は、支持・駆動装置と研磨布(ポリフシ
中−)及び研磨剤からなり、夫々新しい要求に応えるべ
く改善、改良されてきており、研磨布とりわけ鏡面仕上
げ用の研磨布では、従来のピッチやワックス・ポリシャ
ーから、ポリエステル基布上にポリウレタン発泡層を積
層させた研摩布に代わってきている。
These strict requirements for processed products (wafers, etc.)
Naturally, some of these changes have arisen as demands on tools have become more sophisticated (polishing tools consist of a supporting/driving device, a polishing cloth (in the polisher), and an abrasive agent, each of which has been improved to meet new demands. Polishing cloths, especially polishing cloths for mirror finishing, have been replaced by polishing cloths made of a polyester base fabric laminated with a polyurethane foam layer, in place of conventional pitch and wax polishers.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ポリエステル基布にポリウレタン発泡層を含浸ないし積
層させた研摩布は、■基布層の緻密度のバラツキ、■発
泡層の気泡の大きさ、密度のバラツキにより研磨の仕上
り面の均一性、平面度にバラツキが出易い、0表面の研
磨に働く層が薄く、耐久力に乏しく、交換作業が頻繁に
なり、作業効率が悪い、等の問題があった。
Polishing cloth, which is made by impregnating or laminating a polyurethane foam layer on a polyester base fabric, has problems with the uniformity and flatness of the polished surface due to variations in the density of the base fabric layer, and variations in the size and density of the bubbles in the foam layer. There were problems such as the surface polishing layer being thin and having poor durability, frequent replacement work, and poor work efficiency.

更に、従来用いられてきたポリウレタン発泡層の構造に
ついて、その研摩面となる発泡体断面でのセル径でその
適性を厳密に規定したものはなく、又、他樹脂発泡体で
は、研磨布適性を充分評価した例は無かった。
Furthermore, regarding the structure of the conventionally used polyurethane foam layer, there is no strict regulation of its suitability based on the cell diameter in the cross section of the foam that serves as the polishing surface, and for other resin foams, the suitability of the polishing cloth is not determined. There were no cases that were fully evaluated.

〔問題点を解決するための手段〕[Means for solving problems]

本発明者らは、上記問題点を解決するため鋭意研究した
結果、発泡倍率が1.5〜30倍で、平均セル径が30
0μm以下の発泡体が、従来にない優れた研磨特性を示
すことを見いだし、本発明を完成するに至った。
As a result of intensive research to solve the above problems, the present inventors found that the foaming ratio is 1.5 to 30 times and the average cell diameter is 30 times.
It has been discovered that a foam with a diameter of 0 μm or less exhibits unprecedented polishing properties, leading to the completion of the present invention.

即ち、本発明は、発泡倍率が1.5倍以上30倍以下で
、発泡体の断面における平均セル径が300μm以下で
あるセル構造を有するポリオレフィン系樹脂発泡体から
なる精密研摩用研磨布に関するものである。
That is, the present invention relates to a polishing cloth for precision polishing made of a polyolefin resin foam having a cell structure in which the expansion ratio is 1.5 times or more and 30 times or less, and the average cell diameter in the cross section of the foam is 300 μm or less. It is.

本発明の発泡体は、発泡倍率が1.5倍以上30倍以下
のものである。発泡倍率が1.5倍未満のものは、硬く
、研磨布の使命である砥粒の引掻作用の緩和が充分でな
く、加工面に加工損傷やオレンジピール等の欠陥を発生
させ好ましくない。又′、30倍を超える高発泡体は逆
に柔らかくなりすぎ、研磨布としての弾性変形定数(一
定荷重下での変形量)が太き(なり、加工面の平面度が
低下し、更に充分な加工圧力をとれないため、加工速度
も著しく低下し、好ましくない。
The foam of the present invention has an expansion ratio of 1.5 times or more and 30 times or less. If the foaming ratio is less than 1.5 times, it is hard and does not sufficiently alleviate the scratching action of abrasive grains, which is the mission of an abrasive cloth, and causes processing damage and defects such as orange peel on the processed surface, which is undesirable. In addition, a highly foamed material that exceeds 30 times becomes too soft and has a large elastic deformation constant (amount of deformation under a constant load) as a polishing cloth, which reduces the flatness of the machined surface and makes it difficult to Since the processing pressure cannot be maintained, the processing speed is also significantly reduced, which is undesirable.

本発明の発泡体は、平均セル径が300μm以下のもの
である。平均セル径が300μmより大きいと、研磨布
の表面平滑性が悪くなり、砥粒の局在化、加工面へのス
クラッチ傷、オレンジビール等の欠陥が起こり易く、研
磨布としての摩擦係数、摩耗係数のバランスがくずれ、
加工物の過度の温度上昇、研磨布の寿命短縮が起こり、
好ましくない。
The foam of the present invention has an average cell diameter of 300 μm or less. If the average cell diameter is larger than 300 μm, the surface smoothness of the polishing cloth will deteriorate, and defects such as localization of abrasive grains, scratches on the machined surface, orange beer, etc. will easily occur, and the coefficient of friction and wear as a polishing cloth will deteriorate. The coefficients become unbalanced,
Excessive temperature rise of the workpiece and shortened polishing cloth life may occur.
Undesirable.

本発明のポリオレフィン系樹脂とは、例えば、ポリエチ
レン、ポリプロピレン、ポリ−4−メチル−1−ペンテ
ン、アイオノマー樹脂などから選ばれた1種或いは2種
以上の混合物である。又、樹脂は、必要に応じ、共重合
したものでも良い。
The polyolefin resin of the present invention is, for example, one or a mixture of two or more selected from polyethylene, polypropylene, poly-4-methyl-1-pentene, ionomer resin, and the like. Further, the resin may be copolymerized, if necessary.

又、本発明の発泡体としては、非架橋の発泡体、架橋し
た発泡体の何れの場合でも良いが、研磨時の耐久性から
考えた場合、架橋した発泡体が好ましい。その際の架橋
工程は、発泡工程の前でも、又、同時でも良い。
The foam of the present invention may be either a non-crosslinked foam or a crosslinked foam, but a crosslinked foam is preferred in terms of durability during polishing. The crosslinking step at that time may be performed before or simultaneously with the foaming step.

本発明の発泡体の内、発泡倍率が1.5倍以上15倍以
下で、発泡体の断面における平均セル径が1μm以上9
0μm以下であるものが、研磨特性のバランスが良(、
特に好ましい。
Among the foams of the present invention, the expansion ratio is 1.5 times or more and 15 times or less, and the average cell diameter in the cross section of the foam is 1 μm or more and 9
If the diameter is 0 μm or less, the polishing properties are well balanced (,
Particularly preferred.

本発明の発泡体は樹脂に、化学発泡剤、物理発泡剤或い
は不活性気体を均一に混合し発泡させることにより製造
されるが、加工物表面への汚染を少な(する点から、物
理発泡剤、例えば、ジクロロジフルオロメタン、トリク
ロロフルオロメタン、ジクロロフルオロメタン、トリク
ロロトリフルオロエタン、ジクロロテトラフルオロエタ
ン等の]飄ロゲン化炭化水素、ブタン、ペンタン等の炭
化水素等を使用して発泡させる方法が好ましい。発泡方
法は押出発泡方法、型内発泡方法、常圧発泡方法等が使
用され得る。又、熱可塑性樹脂をシート或いはフィルム
状に成形し、これに電離性放射線、例えば、γ線、電子
線等の照射により架橋し、発泡体を製造する方法も使用
され得る。
The foam of the present invention is produced by uniformly mixing a chemical foaming agent, a physical foaming agent, or an inert gas with a resin and foaming it. For example, a method of foaming using a chlorogenated hydrocarbon such as dichlorodifluoromethane, trichlorofluoromethane, dichlorofluoromethane, trichlorotrifluoroethane, dichlorotetrafluoroethane, etc., or a hydrocarbon such as butane or pentane is preferable. As the foaming method, extrusion foaming method, in-mold foaming method, normal pressure foaming method, etc. may be used.Also, thermoplastic resin is molded into a sheet or film shape, and then ionizing radiation, such as γ rays, electron beams, etc. A method of crosslinking and producing a foam by irradiation can also be used.

更に、ポリマー溶液からの、ゲルー熔液相分離による発
泡体の製造方法(例えば、J、 CELLULARPL
ASTICS、第23巻、第55頁)も使用される。
Furthermore, methods for producing foams from polymer solutions by gel-liquid phase separation (e.g., J. CELLULARPL
ASTICS, Vol. 23, p. 55) are also used.

本発明の精密研磨用研磨布は、上記発泡体を切断、スラ
イス、引裂き、研削加工等により所望の形状に加工し、
かつ、表面に発泡体のセル断面を露出させて使用される
。その形状は、研磨物の形状、研磨目的、研冴方法等に
より適宜選択されるが、一般に平面研磨の場合には、シ
ート状のものが使用される。これら研磨布の表面の平滑
性は技研廖物の表面粗さ、うねり等に影響するため精密
に制御することが重要であり、表面のセル膜の切断面に
接する曲線又は直線の凹凸(単位長さ間での山部と谷部
の差)が、その長さ2IIII11当り50μ腸以下、
好ましくは25μm以下のものが使用される。
The polishing cloth for precision polishing of the present invention is produced by processing the foam into a desired shape by cutting, slicing, tearing, grinding, etc.
In addition, it is used with the cell cross section of the foam exposed on the surface. Its shape is appropriately selected depending on the shape of the object to be polished, the purpose of polishing, the polishing method, etc., but generally, in the case of surface polishing, a sheet-like one is used. It is important to precisely control the smoothness of the surface of these polishing cloths, as it affects the surface roughness, waviness, etc. of the polishing cloth. The difference between the peak and the valley between the intestines) is 50μ or less per 2III11 of its length,
Preferably, those having a diameter of 25 μm or less are used.

本発明の精密研磨用研磨布は、その表面が、上記発泡体
の均一なセル構造断面のままでも、或いはその研磨方法
に応じ、表面に、幅0.1〜2IIIIm、深さ0.1
〜2IIIIIlの溝が1〜501I1m間隔で格子状
、菱形状、又は梨地状に規則正しく形成されたものが使
用される。
The polishing cloth for precision polishing of the present invention can have a surface with a width of 0.1 to 2IIIm and a depth of 0.1m depending on the polishing method, whether the surface remains the uniform cross-section of the cell structure of the above-mentioned foam, or depending on the polishing method.
A material in which grooves of ~2III1 are regularly formed at intervals of 1 to 50111 m in a lattice, diamond, or satin pattern is used.

本発明の精密研磨用研磨布は、上記発泡体を単独で使用
しても良く、目的に応じ、裏面或いは表面に、発泡倍率
の異なる発泡体或いは他の素材からなる補強材、クツシ
ラン層、剛性付与層を接合して使用しても良い、一般に
研磨布の表面硬度が90〜30 (JIS A法)のも
のが使用される。
The polishing cloth for precision polishing of the present invention may use the above-mentioned foam alone, and depending on the purpose, it may have a foam with a different expansion ratio or a reinforcing material made of another material, a Kutsusilane layer, or a stiffening material on the back or front surface. A polishing cloth having a surface hardness of 90 to 30 (JIS A method) is generally used, and may be used by bonding the application layer.

本発明の精密研磨用研磨布は、従来公知の発泡体研磨布
と異なり、その断面内におけるセル構造が均一で、大き
なボイド状のセルのない非常に均質のもので、このセル
構造の均質性が、研磨特性例えば、表面粗さ、うねり等
に影響しているものと考えられる。
The polishing cloth for precision polishing of the present invention, unlike conventionally known foam polishing cloths, has a uniform cell structure in its cross section and is very homogeneous without large void-like cells. This is thought to have an effect on polishing properties such as surface roughness and waviness.

〔実施例〕〔Example〕

以下、本発明を実施例で詳細に説明するが、本発明にお
ける各種特性値は以下の方法で求めたものである。
Hereinafter, the present invention will be explained in detail with reference to Examples, and various characteristic values in the present invention were determined by the following methods.

■セル径 ここで云うセルとは、気泡とそれを囲む気泡膜(壁)か
らなるもので、セル径は電子顕微鏡(SEM)又は光学
顕微鏡による発泡体断面写真にて任意の一定長の直線を
引き其処を横切るセルの個数より算出した。
■Cell diameter The cell referred to here consists of a bubble and a cell membrane (wall) surrounding it. It was calculated from the number of cells that cross the area.

■発泡倍率 次式により算出した。■Foaming ratio Calculated using the following formula.

■セル構造 発泡体の断面を電子顕微鏡又は光学顕微鏡で観察し断面
内におけるセルの大きさの分布、ボイドの有無を観察し
て評価した。セルの大きさが揃っていて、ボイド状の大
きな空孔が無いものを均一な構造とした。
(2) A cross section of the cell structure foam was observed using an electron microscope or an optical microscope, and the distribution of cell sizes within the cross section and the presence or absence of voids were observed and evaluated. A uniform structure is one in which the cells are uniform in size and have no large void-like pores.

0表面平滑性 研磨布の断面について、その表面層を拡大観察し、その
表面の外接線の凹凸(単位長さ間での山部と谷部の差)
を211II11間隔で測定し、その平均値で評価した
0 Surface Smoothness Regarding the cross section of the polishing cloth, the surface layer was observed under magnification, and the unevenness of the external tangent line of the surface (difference between peaks and valleys between unit lengths) was observed.
was measured at 211II11 intervals, and the average value was used for evaluation.

■耐薬品性 研磨布又はその発泡体層を、Br−メタノール溶液、濃
度0.1〜5%、温度25〜60℃の範囲で90時間浸
漬試験を行い、研磨布或いは発泡体の変色、寸法変化、
引張強度変化、セル構造変化を測定、観察し、変化が認
められないものを良好とした。
■ A chemical-resistant polishing cloth or its foam layer was subjected to a 90-hour immersion test in a Br-methanol solution at a concentration of 0.1 to 5% and a temperature range of 25 to 60°C. change,
Changes in tensile strength and cell structure were measured and observed, and those with no observed change were evaluated as good.

■研磨特性 前加工として、平均粒子径が5μ■のアルミナ砥粒を用
いてラッピングしたGaAs単結晶ウェハーを、修正輪
型研磨機(例えば、特開昭61−61764号公報に記
載されている研磨機構を有するもの)を使用して研磨し
、ウェハー表面の外観、粗さを評価した。又、研磨布の
研磨後の表面状態を拡大観察し、セル構造の変化を評価
した。
■ As a pre-processing for polishing properties, a GaAs single crystal wafer lapped using alumina abrasive grains with an average particle size of 5μ The appearance and roughness of the wafer surface were evaluated. In addition, the surface condition of the polishing cloth after polishing was observed under magnification, and changes in the cell structure were evaluated.

研磨は、研磨布を貼り付けた定盤の上に、研磨工程の進
行に伴って被研磨面と研磨面とを僅かずつ離し、この両
面を接触状態と非接触状態との状態に連続して或いは交
互に変化させる研磨治具にウェハーを固定し、Brの0
.25%メタノール溶液(メタノール80%、エチレン
グリコール20%の混合溶媒)を供給しながら、両面を
互いに摺接しようとする方向に移動させて研磨した。
During polishing, as the polishing process progresses, the surface to be polished and the polished surface are slightly separated from each other on a surface plate to which a polishing cloth is attached, and both surfaces are continuously brought into a contact state and a non-contact state. Alternatively, fix the wafer on a polishing jig that alternately changes the Br to 0.
.. While supplying a 25% methanol solution (a mixed solvent of 80% methanol and 20% ethylene glycol), both surfaces were moved in a direction in which they were intended to come into sliding contact with each other, and polishing was performed.

ウェハー表面の外観、粗さ等は、SEMI規格に記載の
方法に準じて行った。
The appearance, roughness, etc. of the wafer surface were determined according to the method described in the SEMI standard.

実施例1 ポリプロピレン系樹脂(旭化成工業■製、PP−M2S
O4)を押出成形装置に供給して押出成形した厚さ1m
II+のシートを、オートクレーブに入れ、ジクロロジ
フルオロメタンを圧入し、80℃で1時間合浸し、発泡
性シートを得た。この発泡性シートを4.0 Kg/c
iGのスチームで15秒間加熱し、発泡倍率8倍、肉厚
2mmの発泡体シートを得た。この発泡体を、スライサ
ー(西独フォーチュナー社製、へシー320−D)にて
1mm厚みに両面スライスした該発泡シートのスライス
面での平均セル径は35μmであった。該スライスシー
トを、直径300mmφの円形に打抜き研磨布とし、前
述の方法にて、研磨特性を調べた。結果は第1表に示し
たとうりで、該発泡シートは、GaAsウェハーの研磨
表面の品質を損なうことなく高い研摩能力を有するもの
であった。
Example 1 Polypropylene resin (manufactured by Asahi Kasei Kogyo ■, PP-M2S
O4) was supplied to an extrusion molding device and extruded to a thickness of 1 m.
The II+ sheet was placed in an autoclave, dichlorodifluoromethane was press-injected, and the mixture was soaked at 80° C. for 1 hour to obtain a foamable sheet. This foam sheet is 4.0 Kg/c
It was heated with iG steam for 15 seconds to obtain a foam sheet with an expansion ratio of 8 times and a wall thickness of 2 mm. This foam was sliced on both sides to a thickness of 1 mm using a slicer (Hessy 320-D, manufactured by Fortuner AG, West Germany), and the foam sheet had an average cell diameter of 35 μm on the sliced surface. The sliced sheet was punched out into a circular shape with a diameter of 300 mm to obtain an abrasive cloth, and its abrasive properties were examined using the method described above. The results are shown in Table 1, and the foamed sheet had high polishing ability without impairing the quality of the polished surface of GaAs wafers.

実施例2 4−メチル−1−ペンテン樹脂(三井石油化学工業■製
、DX−845)をデュレンに、180℃にて熔解させ
、5重量%のポリマー溶液を調製した後、140℃まで
徐々に冷却し発泡体を析出させた。次に、溶媒であるデ
ュレンを50℃にて減圧で除去し、目的の発泡体を得た
。この発泡体の平均セル径は、10μmであり、発泡倍
率は15倍であった。該発泡体を実施例1と同様の方法
で研磨布性能を調べたところ、結果は第1表に示したと
うりで高い研磨能力を有するものであった。
Example 2 4-Methyl-1-pentene resin (manufactured by Mitsui Petrochemical Industries Ltd., DX-845) was melted in Durene at 180°C to prepare a 5% by weight polymer solution, and then gradually heated to 140°C. It was cooled to precipitate a foam. Next, the solvent Durene was removed under reduced pressure at 50°C to obtain the desired foam. The average cell diameter of this foam was 10 μm, and the expansion ratio was 15 times. When the polishing cloth performance of the foam was examined in the same manner as in Example 1, the results were as shown in Table 1, and it was found to have high polishing ability.

実施例3 低密度ポリエチレン(Mr 1.7)にアゾビスホルム
アミド9重量部を均一に混練し、シート状に押出成形し
、電子線照射して、ゲル分70%に架橋し、200℃に
加熱発泡させたポリエチレン架橋発泡シートを、実施例
1と同様の方法でスライスして研磨布を作成した。
Example 3 9 parts by weight of azobisformamide were uniformly kneaded into low density polyethylene (Mr 1.7), extruded into a sheet, irradiated with electron beam to crosslink to a gel content of 70%, and heated to 200°C. The foamed polyethylene crosslinked foam sheet was sliced in the same manner as in Example 1 to prepare an abrasive cloth.

この研磨布の研磨特性を調べた結果は、第1表に示した
とうりであった。
The results of examining the polishing properties of this polishing cloth are shown in Table 1.

実施例4 アイオノマー樹脂(ハイミラン[F] 1601 ) 
100M量部とタルク0.5重量部を押出発泡装置に供
給し、ジクロロジフルオロメタン32重量部を圧入し、
高温高圧下均一に混合し、119℃に冷却し、サーキュ
ラ−ダイを付したノズルから大気中に押出発泡させて発
泡シートを得た。
Example 4 Ionomer resin (Himilan [F] 1601)
100M parts and 0.5 parts by weight of talc were supplied to an extrusion foaming device, and 32 parts by weight of dichlorodifluoromethane was press-fitted.
The mixture was uniformly mixed under high temperature and high pressure, cooled to 119° C., and extruded into the atmosphere through a nozzle equipped with a circular die to obtain a foamed sheet.

得られた発泡体は、発泡倍率28倍、平均セル径90μ
m、セル膜に1〜10μmの微細な孔を有する連続気泡
体であった。
The obtained foam had a foaming ratio of 28 times and an average cell diameter of 90μ.
m, the cell membrane was an open-celled body with fine pores of 1 to 10 μm.

この発泡シートを実施例1と同様の方法でスライスし、
研磨特性を調べた。この結果を第1表に示した。
This foam sheet was sliced in the same manner as in Example 1,
The polishing properties were investigated. The results are shown in Table 1.

実施例5 実施例1において、ジクロロジフルオロメタンを含浸し
た発泡性シートを、3.8 Kg/cIAGのスチーム
で15秒間加熱し、発泡倍率4倍、平均セル径33μm
の発泡体シートを得た。
Example 5 In Example 1, a foamable sheet impregnated with dichlorodifluoromethane was heated for 15 seconds with steam at 3.8 Kg/cIAG to obtain a foaming ratio of 4 times and an average cell diameter of 33 μm.
A foam sheet was obtained.

この発泡体シートを実施例1と同様の方法でスライスし
、研磨特性を調べ、その結果を第1表に示した。
This foam sheet was sliced in the same manner as in Example 1, and its polishing properties were examined. The results are shown in Table 1.

実施例6 超高分子量ポリエチレン(分子量約300万)をテトラ
リンに150℃で熔解し、9重量%の溶液とした。次い
で、10℃/minの速度で冷却し、ポリマーを析出・
ゲル化させ、減圧下でテトラリンを除去し、発泡体を得
た。この発泡体の平均セル径は1μmであり、発泡倍率
は約8倍であった。得られた発泡体を実施例1と同様の
方法でスライスして、研磨特性を評価した。結果を第1
表に示す。
Example 6 Ultra-high molecular weight polyethylene (molecular weight approximately 3 million) was dissolved in tetralin at 150°C to form a 9% by weight solution. Next, it is cooled at a rate of 10°C/min to precipitate the polymer.
After gelation, the tetralin was removed under reduced pressure to obtain a foam. The average cell diameter of this foam was 1 μm, and the expansion ratio was about 8 times. The obtained foam was sliced in the same manner as in Example 1, and its polishing properties were evaluated. Results first
Shown in the table.

実施例7 実施例3において、化学発泡剤の量を4M量部にした以
外は同じ方法で得た発泡倍率8倍、平均セル径90μm
のポリエチレン架橋発泡シートを使用して、実施例1と
同様の方法で研磨布を作成し、研磨特性を評価した。結
果を第1表に示した。
Example 7 A foaming ratio of 8 times and an average cell diameter of 90 μm obtained in the same manner as in Example 3 except that the amount of chemical blowing agent was changed to 4 M parts.
A polishing cloth was prepared in the same manner as in Example 1 using the crosslinked polyethylene foam sheet, and its polishing properties were evaluated. The results are shown in Table 1.

比較例1 押出発泡ポリエチレンの発泡倍率8倍、平均セル径40
0μmのボード(旭化成工業■製、サンチックフオーム
)を、実施例1と同様の方法でスライスし、研磨布とし
て評価した。耐薬品性は良好であるが、ウェハーの表面
粗さ、うねりが大きく、研磨性能に劣るものであった。
Comparative Example 1 Expanded polyethylene foam, expansion ratio 8 times, average cell diameter 40
A 0 μm board (manufactured by Asahi Kasei Corporation, Santic Foam) was sliced in the same manner as in Example 1 and evaluated as an abrasive cloth. Although the chemical resistance was good, the surface roughness and waviness of the wafer were large, and the polishing performance was poor.

比較例2 市販の発泡倍率33倍、平均セル径90μmのポリエチ
レン架橋発泡シート(バーキュレス社製、ミニセルL−
200)を実施例1と同様の方法でスライスし、研磨布
として評価した。表面粗さ、うねりが太き(、セル構造
も研磨後大きく変形していた。
Comparative Example 2 A commercially available polyethylene crosslinked foam sheet with an expansion ratio of 33 times and an average cell diameter of 90 μm (manufactured by Vercules, Minicell L-
200) was sliced in the same manner as in Example 1 and evaluated as an abrasive cloth. The surface roughness and waviness were large (and the cell structure was also significantly deformed after polishing.

比較例3 市販のポリウレタン製研磨布を使用して研磨特性を評価
した。研磨布はポリエステル基布にポリウレタン発泡層
を積層した構造で、ポリウレタン発泡層は厚み方向に1
00〜200μmの大きさでナス形をした空孔があり、
表面層10〜30μmの部分はセル径30μm程度の微
細セル構造となっているもので、厚み方向のセル構造は
不均一で、基布による影響と思える表面の凹凸が大きく
、平滑性に劣るもので、又、耐薬品性に劣るものであっ
た。
Comparative Example 3 Polishing properties were evaluated using a commercially available polyurethane polishing cloth. The polishing cloth has a structure in which a polyurethane foam layer is laminated on a polyester base cloth, and the polyurethane foam layer has one layer in the thickness direction.
There are eggplant-shaped pores with a size of 00 to 200 μm,
The 10 to 30 μm surface layer has a fine cell structure with a cell diameter of about 30 μm, and the cell structure in the thickness direction is uneven, and the surface has large irregularities that seem to be caused by the base fabric, resulting in poor smoothness. Moreover, the chemical resistance was poor.

研磨特性は、表面粗さが著しく劣り、目視でウェハー表
面の不良が判別できる程研磨特性の劣るものであった。
The polishing properties were extremely poor in surface roughness, and were so poor that defects on the wafer surface could be visually identified.

(以下余白)(Margin below)

Claims (2)

【特許請求の範囲】[Claims] (1)発泡倍率が1.5倍以上30倍以下で、発泡体の
断面における平均セル径が300μm以下であるセル構
造を有するポリオレフィン系樹脂発泡体からなる精密研
磨用研磨布。
(1) A polishing cloth for precision polishing made of a polyolefin resin foam having a cell structure with an expansion ratio of 1.5 times or more and 30 times or less and an average cell diameter in the cross section of the foam of 300 μm or less.
(2)発泡倍率が1.5倍以上15倍以下で、発泡体の
断面における平均セル径が1μm以上90μm以下であ
るセル構造を有するポリオレフィン系樹脂発泡体からな
る特許請求の範囲第1項記載の精密研磨用研磨布。
(2) Claim 1 comprising a polyolefin resin foam having a cell structure in which the expansion ratio is 1.5 times or more and 15 times or less, and the average cell diameter in the cross section of the foam is 1 μm or more and 90 μm or less. Abrasive cloth for precision polishing.
JP62299998A 1987-11-30 1987-11-30 Abrasive cloth for fine polishing Granted JPH01146666A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62299998A JPH01146666A (en) 1987-11-30 1987-11-30 Abrasive cloth for fine polishing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62299998A JPH01146666A (en) 1987-11-30 1987-11-30 Abrasive cloth for fine polishing

Publications (2)

Publication Number Publication Date
JPH01146666A true JPH01146666A (en) 1989-06-08
JPH045687B2 JPH045687B2 (en) 1992-02-03

Family

ID=17879503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62299998A Granted JPH01146666A (en) 1987-11-30 1987-11-30 Abrasive cloth for fine polishing

Country Status (1)

Country Link
JP (1) JPH01146666A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5114438A (en) * 1990-10-29 1992-05-19 Ppg Industries, Inc. Abrasive article
JP2000343413A (en) * 1999-06-09 2000-12-12 Toray Ind Inc Polishing pad
KR100341850B1 (en) * 1999-06-25 2002-06-26 박종섭 Method of manufacturing a polishing pad
JP2004223701A (en) * 2002-11-29 2004-08-12 Mitsui Chemicals Inc Abrasive

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5114438A (en) * 1990-10-29 1992-05-19 Ppg Industries, Inc. Abrasive article
JP2000343413A (en) * 1999-06-09 2000-12-12 Toray Ind Inc Polishing pad
JP4501175B2 (en) * 1999-06-09 2010-07-14 東レ株式会社 Polishing pad manufacturing method
KR100341850B1 (en) * 1999-06-25 2002-06-26 박종섭 Method of manufacturing a polishing pad
JP2004223701A (en) * 2002-11-29 2004-08-12 Mitsui Chemicals Inc Abrasive

Also Published As

Publication number Publication date
JPH045687B2 (en) 1992-02-03

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