JPH01146606A - Drill - Google Patents
DrillInfo
- Publication number
- JPH01146606A JPH01146606A JP30331487A JP30331487A JPH01146606A JP H01146606 A JPH01146606 A JP H01146606A JP 30331487 A JP30331487 A JP 30331487A JP 30331487 A JP30331487 A JP 30331487A JP H01146606 A JPH01146606 A JP H01146606A
- Authority
- JP
- Japan
- Prior art keywords
- drill
- groove length
- tip
- length
- coating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims abstract description 23
- 239000011247 coating layer Substances 0.000 claims description 27
- 239000000463 material Substances 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 abstract description 4
- 229910010271 silicon carbide Inorganic materials 0.000 abstract description 4
- 150000004767 nitrides Chemical class 0.000 abstract description 3
- 239000002356 single layer Substances 0.000 abstract description 3
- 239000011195 cermet Substances 0.000 abstract description 2
- -1 nitride carbonate Chemical class 0.000 abstract description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract description 2
- 230000000737 periodic effect Effects 0.000 abstract description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 abstract 1
- 229910002090 carbon oxide Inorganic materials 0.000 abstract 1
- 238000003475 lamination Methods 0.000 abstract 1
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 description 12
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000005553 drilling Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910020630 Co Ni Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910002440 Co–Ni Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[発明の目的]
(産業上の利用分野)
本発明は細径のドリルに関し、更に詳しくは、耐摩耗性
が優れていると同時に、切削使用時における折損事故も
少なく、その結果、使用寿命が長くなるドリルに関する
。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a small diameter drill, and more specifically, the present invention relates to a small diameter drill, and more specifically, it has excellent wear resistance and at the same time has fewer breakage accidents during cutting. , as a result of which the drill has a longer service life.
(従来の技術)
プリント基板や各種の金属素材を穿孔する際には、その
切削工具として各種のドリルが使用される。穿設する孔
が小径になれば、当然のこととして用いるドリルは細径
となる。一般に、直径21以下の小孔を形成するための
ドリルはプリント基板用小径ドリルと指称されているが
、このようなドリルの1例を第3図に平面図として示す
。(Prior Art) When drilling printed circuit boards and various metal materials, various drills are used as cutting tools. If the hole to be drilled has a smaller diameter, the drill used will naturally have a smaller diameter. Generally, a drill for forming a small hole with a diameter of 21 mm or less is referred to as a small diameter drill for printed circuit boards, and one example of such a drill is shown in a plan view in FIG.
図において、全長Aはみぞ長Bとシャンク長Eとで構成
される。ドリルはシャンク長E部分で切削装置にチャフ
キングされ、その先端部を被削材に圧接して実用に供さ
れる。In the figure, the total length A is composed of the groove length B and the shank length E. The drill is chaffed by a cutting device at a portion of the shank length E, and its tip is pressed into contact with a workpiece for practical use.
このような細径ドリルの基体は、切削使用時における折
損事故を防止するために高靭性の材料、例えば、WC−
Go系合金のような超硬合金で構成されている。The base of such a small diameter drill is made of a highly tough material, such as WC-
It is made of cemented carbide such as Go-based alloy.
このような超硬合金製のドリルは折損事故の防止という
点では有効であるが、しかし一方では、被削材に対する
耐摩耗性という点では不充分であるため消耗が激しく、
ドリルの使用寿命が短いという問題がある。Such drills made of cemented carbide are effective in preventing breakage accidents, but on the other hand, they do not have sufficient wear resistance against the workpiece material, so they wear out rapidly.
There is a problem that the useful life of the drill is short.
このため、従来は、ドリルの切削作用面、すなわち前述
の図でいう先端部Cを含めたみぞ反部Bの全表面又は1
部の表面に、高硬度で耐摩耗性に優れる被覆層を形成す
ることが提案されている(特開昭56−3117号公報
、特開昭56−3119号公報及び特開昭57−184
616号公報)。For this reason, conventionally, the cutting surface of the drill, that is, the entire surface or one part of the groove part B including the tip part C in the above-mentioned figure.
It has been proposed to form a coating layer with high hardness and excellent wear resistance on the surface of the part (Japanese Patent Application Laid-Open Nos. 56-3117, 3119-1980, and 184-1984).
Publication No. 616).
(発明が解決しようとする問題点)
しかしながら、上記したようなドリルは次のような問題
を発生する0例えば、材料がWC−6%Coから成り、
直径0.35+am、みぞ長Bが10mraであるドリ
ル100本を製作し、その半数50本には先端部Cを含
むみぞ長Bの全面を厚み0.2μMのSiC層で被覆し
、これら2種類のドリルでプリント基板(ガラスm維補
強のエポキシ樹脂板)に同一切削条件で穿孔したところ
、前者のドリルの折損数は2本(折損奥故率4%)であ
ったにもかかわらず、後者のドリルの場合には40本の
折損数(折損事故率80%)であった、すなわち、ドリ
ル基体の切削作用面の全面に耐摩耗性の被覆層を形成し
たドリルは、あきらかに、折損事故を増大せしめてしま
うのである。(Problems to be Solved by the Invention) However, the above-mentioned drill has the following problems.For example, when the material is made of WC-6%Co,
We manufactured 100 drills with a diameter of 0.35+am and a groove length B of 10 mra, and half of 50 of them had the entire groove length B including the tip C covered with a 0.2 μM thick SiC layer. When drilling holes in a printed circuit board (an epoxy resin board reinforced with glass fibers) with the drill of In the case of the drill, 40 pieces were broken (breakage accident rate: 80%).In other words, drills with a wear-resistant coating layer formed on the entire cutting surface of the drill base clearly had no breakage accidents. This results in an increase in
しかも、この傾向は、第1図に示すようにドリルの直径
が細径化するほど顕著となるのである。すなわち、第1
図は、切削作用面の全面に被覆層を形成したドリルにお
ける、その直径と折損、V19故率との関係を示す図で
ある。Furthermore, as shown in FIG. 1, this tendency becomes more pronounced as the diameter of the drill becomes smaller. That is, the first
The figure shows the relationship between the diameter, breakage, and V19 failure rate of a drill in which a coating layer is formed over the entire cutting surface.
これらの事実から明らかなように、ドリルの耐摩耗性を
向上せしめるために切削作用面、特にみぞ長の全面に被
覆層を形成することは、ドリル基体が高靭性であるにも
かかわらず、被覆層を形成しない場合に比べてその事故
発生率が画然と増大してしまうのである。As is clear from these facts, in order to improve the wear resistance of a drill, it is important to form a coating layer on the cutting surface, especially the entire groove length, even though the drill base has high toughness. The accident rate increases significantly compared to the case where no layer is formed.
このことは、結果としてドリルの使用寿命を短くしてし
まうことである。This results in a shortened service life of the drill.
本発明は、ドリルの切削作用面に耐摩耗性の硬質被覆層
が形成されているにもかかわらず、上記したような問題
を生起することがなく、耐摩耗性も優れ、折損事故発生
も少ない細径のドリルの提供を目的とする。Although the present invention has a wear-resistant hard coating layer formed on the cutting surface of the drill, it does not cause the above-mentioned problems, has excellent wear resistance, and has fewer breakage accidents. The purpose is to provide a small diameter drill.
[発明の構成]
(問題点を解決するための手段・作用)本発明者らは上
記現象の原因を解明するために折損事故を起したドリル
につき、そのドリル先端から折損個所までの距離を測定
し、この距離と折損事故率(%)の関係をプロットした
。この結果を第2図に示す。[Structure of the invention] (Means and effects for solving the problem) In order to clarify the cause of the above phenomenon, the present inventors measured the distance from the tip of the drill to the broken point for the drill that caused the breakage accident. The relationship between this distance and the breakage accident rate (%) was plotted. The results are shown in FIG.
図から明らかなように、折損は首下に、連続するみぞの
切れ上がり部からみぞ長に入ったドリル軸に対して垂直
の断面積の最小の所B2で最も多く生起している。As is clear from the figure, most of the breakage occurs below the neck at a point B2 where the cross-sectional area perpendicular to the drill axis, which extends from the cut-out part of the continuous groove into the groove length, is the smallest.
これらの結果から、本発明者らは上記現象がいわゆる切
欠効果に基づく現象であるとの結論を得るに到った。す
なわち、切削作用面の全面に硬質被覆層が形成されてい
るドリルを被削材に一定の力で圧接して切削動作に供し
た場合、曲げモーメント及びトルクが最も集中し易すい
みぞ長の層部分からみぞ切れ上がり部の間において、例
えば、硬質被覆層に存在する微小欠陥部が起点となり、
その切欠底つまりドリル基体面と硬質被覆層との接合界
面に局部的応力が集中し、その結果、通常の測定におい
ては高靭性値を示すドリル基体であってもその切欠底か
ら折損が生起するのである。From these results, the present inventors came to the conclusion that the above phenomenon is based on the so-called notch effect. In other words, when a drill with a hard coating layer formed on the entire cutting surface is pressed against a workpiece with a constant force and subjected to cutting operation, the layer at the groove length where bending moment and torque are most likely to be concentrated. For example, a minute defect existing in the hard coating layer becomes the starting point between the groove cutout part and the groove cutout part,
Local stress concentrates at the bottom of the notch, that is, the bonding interface between the drill base surface and the hard coating layer, and as a result, breakage occurs from the bottom of the notch, even if the drill base shows a high toughness value in normal measurements. It is.
本発明者らは上記考案を基礎として、切削作用面の一部
のみに耐摩耗性の硬質被覆層を形成してその折損事故の
発生有無について試験したところ極めて良好な結果を得
、また先端部Cの耐摩耗性も満足すべき結果を得たこと
により、総合的にみて使用寿命が長期化する細径のドリ
ルを開発するに到った。Based on the above idea, the present inventors formed a wear-resistant hard coating layer only on a part of the cutting surface and tested the occurrence of breakage accidents, and obtained very good results. By obtaining satisfactory results regarding the wear resistance of C, we were able to develop a small-diameter drill that has a long service life overall.
すなわち、本発明のドリルは、ドリル基体の表面が硬質
被覆層で被覆されているドリルにおいて、硬質被覆層の
被覆個所が、ドリル基体のみぞ長の内、先端部を含めた
先端からの一部のみぞ長の表面であることを特徴とする
。That is, in the drill of the present invention, the surface of the drill base is coated with a hard coating layer, and the hard coating layer covers a part of the groove length of the drill base from the tip including the tip. It is characterized by a surface with long grooves.
まず、本発明ドリルの基体を構成する材料は、従来のプ
リント基板用小径ドリルの基体として採用されているよ
うな高靭性の材料であれば何であってもよいが1例えば
WC−Co系、WC−Co−Ni系、WC−Co−Cr
系、WC−G。First, the material constituting the base of the drill of the present invention may be any high-toughness material that has been adopted as the base of conventional small-diameter drills for printed circuit boards. -Co-Ni system, WC-Co-Cr
system, WC-G.
−N i −Cr系、WC−VC−Co系、WC−Cr
3 c2−Co系、WC−VC−Cr3 C2−Co系
、WC−TaC−VC−Co系、WC−TaC−Cr3
C2−Co系のような超硬合金;TiC−WC−Ti
N−Ni系、TiC−WC−TiN−Co系、 T i
C−WC−T aC−T i N−Ni系、のような
サーメットをあげることができる。-N i -Cr system, WC-VC-Co system, WC-Cr
3 c2-Co system, WC-VC-Cr3 C2-Co system, WC-TaC-VC-Co system, WC-TaC-Cr3
Cemented carbide such as C2-Co series; TiC-WC-Ti
N-Ni system, TiC-WC-TiN-Co system, Ti
Examples include cermets such as C-WC-T aC-T i N-Ni.
本発明のドリルは、先端部Cの全表面を含めそれに連ら
なリシャンク方向に延びるみぞ長の全表面のうち先端部
Cを含むみぞ長の1部の表面に後述する硬質被覆層が形
成されている。In the drill of the present invention, a hard coating layer, which will be described later, is formed on the surface of a portion of the groove length including the tip portion C, out of the entire surface of the groove length extending in the reshank direction, including the entire surface of the tip portion C. ing.
例えば、みぞ長の長さをBLとすると、硬質層であるよ
うな長さであることが好ましい、この被覆層の長さが上
記関係を逸脱する長さ、すなわち、BLの局より長くな
る場合は、切削使用時における折損事故が増加しはじめ
るので好ましくない。より好ましくは、先端部Cとマー
ジン長Bの全表面である。For example, if the length of the groove length is BL, it is preferable that the length is such that it is a hard layer.If the length of this coating layer deviates from the above relationship, that is, it is longer than the base of BL. This is not preferable because breakage accidents during cutting use begin to increase. More preferably, it is the entire surface of the tip C and the margin length B.
形成される硬質被覆層としては、その硬度がHv150
0以上、好ましくはHv2000以上となるような層が
、耐摩耗性を向上せしめるという点で好適である。The hard coating layer to be formed has a hardness of Hv150.
A layer having an Hv of 0 or more, preferably 2000 or more is suitable in terms of improving wear resistance.
例えば、周期律表TVa、Va、Vla族の各金属の炭
化物、窒化物、炭窒化物、炭酸化物、炭酸窒化物のそれ
ぞれ:炭化ケイ素、窒化ケイ素酸化アルミニウム;更に
はこれらの1種または2種以上の固溶体又は立方晶窒化
ホウ素、ダイヤモンドをあげることができ、具体的には
、TiC。For example, carbides, nitrides, carbonitrides, carbonates, and carbonitrides of metals in groups TVa, Va, and Vla of the periodic table: silicon carbide, silicon nitride, and aluminum oxide; and one or two of these. Examples include solid solution or cubic boron nitride and diamond, specifically TiC.
TiN、ZrC,TaC,TaN、WC,(Ti 。TiN, ZrC, TaC, TaN, WC, (Ti.
W)C,Ti (C,N)、Ti (C,O)。W) C, Ti (C, N), Ti (C, O).
Ti (N、O)、Ti (C,N、O)、(Ti
。Ti (N, O), Ti (C, N, O), (Ti
.
Ta、W)C5iC,Si3 Na 、AQ20s
+(St、A蓼)(0,N)CBN、ダイヤモンドから
なるものを代表例として挙げることができる。これらの
硬質被覆層は、結晶質や非晶質で形成される場合、又は
化学量論的化合物や非化学量論的化合物でなっている場
合でもよい。Ta, W) C5iC, Si3 Na, AQ20s
Typical examples include those made of +(St, A)(0,N) CBN and diamond. These hard coating layers may be made of crystalline or amorphous material, or may be made of stoichiometric or non-stoichiometric compounds.
また、硬質被覆層は上記した成分の単層であってもよい
し、それらを複aa層して成る積層構造であってもよい
、この後者の場合、まず最初にドリル基体となじみ易す
い硬質層をドリル基体の所定個所に形成し、更にその上
に高硬度の被覆層を形成した2層以上の構造のもの1例
えば、基体表面にTic、Si3 N4 、Ti (C
,N)TiNの層を形成し、その上に、酎すきとり摩耗
性にすぐれるSiC層、CBN層またはダイヤモンド状
カーボン層を被覆形成したものは好適である。In addition, the hard coating layer may be a single layer of the above-mentioned components, or may have a laminated structure consisting of multiple AA layers. A structure with two or more layers, in which a layer is formed at a predetermined location on the drill base, and a high hardness coating layer is further formed on the drill base.
, N) A TiN layer is preferably formed, and a SiC layer, a CBN layer, or a diamond-like carbon layer having excellent abrasion resistance is coated thereon.
硬質被覆層の厚みは、切欠効果を抑制するという点で考
えれば薄層であるほど好適であるがあまり薄くするとド
リルの耐摩耗性が劣化するので、0.01〜10−の範
囲内にあることが好ましい、更に好ましくは0.05〜
4−9とくに好ましくは0.1〜3.0−である。The thickness of the hard coating layer is preferably thinner in terms of suppressing the notch effect, but if it is too thin, the wear resistance of the drill will deteriorate, so it is within the range of 0.01 to 10. is preferable, more preferably 0.05~
4-9, particularly preferably 0.1-3.0-.
本発明のドリルは例えば次のようにして製造することが
できる。まず、所定の超硬合金やサーメットから図に示
したようなドリル基体を製作する。The drill of the present invention can be manufactured, for example, as follows. First, a drill base as shown in the figure is manufactured from a specified cemented carbide or cermet.
ついで、ドリル基体の表面のうち、硬質被覆層を形成し
ない部分に金属箔等でマスキングする。Next, parts of the surface of the drill base where the hard coating layer is not formed are masked with metal foil or the like.
このとき、マスキングしない部分は、先端部Cを含むみ
ぞ長の先端部側の表面との長さが、前記したB1.の1
/3以下となるようにする。At this time, the length of the unmasked portion with respect to the surface on the tip side of the groove length including the tip C is the above-mentioned B1. No. 1
/3 or less.
マスキングされたドリル基体を、常用のプラズマCVD
装置またはイオンブレーティング装置内にセットし、マ
スキングされていない部分に硬質被覆層を形成する。こ
のとき、反応ガスの種類;反応条件などを適宜に選定す
ることにより、所望する硬質被覆層を単層としてまた積
層構造として形成することができ、更に層厚を任意に設
定することもできる。The masked drill base is processed by regular plasma CVD.
It is set in the device or ion blating device, and a hard coating layer is formed on the unmasked areas. At this time, by appropriately selecting the type of reaction gas, reaction conditions, etc., the desired hard coating layer can be formed as a single layer or a laminated structure, and the layer thickness can also be set arbitrarily.
最後に上記装置からドリルを取りだし、マスキング部分
を除去すれば、先端部Cを含むみぞ長Bの一部のみに硬
質被覆層が形成されている本発明のドリルを得ることが
できる。Finally, by taking out the drill from the device and removing the masking portion, the drill of the present invention in which the hard coating layer is formed only on a part of the groove length B including the tip C can be obtained.
(発明の実施例)
直径0.35mm、逃げ角10度、先端部Cの長さ0.
6m11.みぞ長の長さ6.0+++m、全長38Iで
あるプリント基板用小径のドリルを用意した。ドリルの
材質はWC−4wt%CO合金である。(Embodiment of the invention) Diameter: 0.35 mm, relief angle: 10 degrees, length of tip C: 0.35 mm.
6m11. A small diameter drill for printed circuit boards with a groove length of 6.0 +++ m and a total length of 38 I was prepared. The material of the drill is WC-4wt%CO alloy.
このドリル基体の先端からXa+mの部分を露出させ、
他の部分はマスキング剤(材)樹脂で被覆した。Exposing the part Xa+m from the tip of this drill base,
Other parts were covered with masking agent (material) resin.
ついで、プラズマCVD装置にセットし、まず厚み0
、2%のTiN層をドリル基体のX部分に形成し、つい
で、反応ガスを切換えて厚み0.5μsのS’ i C
層を形成した。Next, set it in the plasma CVD equipment and first make the thickness 0.
, a 2% TiN layer was formed on the X portion of the drill body, and then the reactant gas was switched to form a 0.5 μs thick S' i C layer.
formed a layer.
装置からドリルを取出し、マスキング部分を除去した。The drill was removed from the device and the masking portion was removed.
得られた各ドリルを用いてガラスma補強のエポキシ樹
脂板から成るプリント基板に穿孔処理を施した。穿孔処
理時の条件は、ドリル回転速度80.00Orpm、送
り速度20 pxx / revであった。Using each of the drills obtained, a printed circuit board made of an epoxy resin plate reinforced with glass macera was subjected to a drilling process. The conditions during the drilling process were a drill rotation speed of 80.00 Orpm and a feed rate of 20 pxx/rev.
プリント基板2枚を重ねて穿設する過程でドリルの折損
数を計測し、それをXとの関係として第2図に示した。The number of broken drills was measured during the process of stacking two printed circuit boards and drilling them, and the number of broken drills is shown in FIG. 2 as a relationship with X.
[発明の効果]
以上の説明で明らかなように、本発明のドリルは全面に
被覆層を形成したドリルに比べその折損事故が著しく少
なく、また耐摩耗性という点でも遜色はない、したがっ
て、総合的にみて使用寿命は長くなりその工業的価値は
大である。[Effects of the Invention] As is clear from the above explanation, the drill of the present invention has significantly fewer breakage accidents than a drill with a coating layer formed on the entire surface, and is comparable in terms of wear resistance. Overall, it has a long service life and is of great industrial value.
第1図は層で被覆したドリルの直径と折損事故率との関
係を示す図である。第2図はドリル先端から折損個所ま
での距離と折損事故率との関係を示す図である。第3図
はドリルの平面図である。
第2図において
B、−先端、B4−3Ax(みぞ長)、B3−%×(み
ぞ長)、B2−みぞの切れ上がり部下の最小断面積部、
B!−みぞの切れ上がり部、El−首下
第3図において
A−全長、B−みぞ長、C−先端部、D−マージン長、
E−シャンク、El−首下、B1−みぞの切れ上がり部
、B2−みぞの切れ上がり部下の最小断面積部
0.2 0.4 Q6 0.B 1.0ドリル捺
(mm)
第1図
BS B4Ba ’+BIEf
!!L、埼)ろの距離(X閤)
第2図FIG. 1 is a diagram showing the relationship between the diameter of a drill coated with a layer and the breakage accident rate. FIG. 2 is a diagram showing the relationship between the distance from the tip of the drill to the breakage point and the breakage accident rate. FIG. 3 is a plan view of the drill. In Fig. 2, B, - tip, B4 - 3Ax (groove length), B3 - % x (groove length), B2 - minimum cross-sectional area below the groove cut-up,
B! - Rising part of the groove, El - Under the neck In Fig. 3, A - Overall length, B - Groove length, C - Tip, D - Margin length,
E-shank, El-below the neck, B1-groove cut-up part, B2-minimum cross-sectional area below the groove cut-out 0.2 0.4 Q6 0. B 1.0 drill stamp (mm) Fig. 1 BS B4Ba '+BIEf ! ! L, Saitou distance (X) Fig. 2
Claims (1)
おいて、 硬質被覆層の形成個所が、ドリル基体のみぞ長の内、先
端部を含めた先端からの一部のみぞ長の表面であること
を特徴とするドリル。 2、硬質被覆層の形成個所が、先端からの距離がみぞ長
の1/3以下の長さの表面部分である特許請求の範囲第
1項記載のドリル。 3、硬質被覆層が2層以上から成る積層構造である特許
請求の範囲第1項または第2項記載のドリル。[Claims] 1. In a drill in which a hard coating layer is formed on the drill base, the hard coating layer is formed in a part of the groove from the tip including the tip of the groove length of the drill base. A drill characterized by a long surface. 2. The drill according to claim 1, wherein the hard coating layer is formed on a surface portion whose distance from the tip is 1/3 or less of the groove length. 3. The drill according to claim 1 or 2, wherein the hard coating layer has a laminated structure consisting of two or more layers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62303314A JP2617326B2 (en) | 1987-12-02 | 1987-12-02 | Drill |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62303314A JP2617326B2 (en) | 1987-12-02 | 1987-12-02 | Drill |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01146606A true JPH01146606A (en) | 1989-06-08 |
JP2617326B2 JP2617326B2 (en) | 1997-06-04 |
Family
ID=17919472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62303314A Expired - Lifetime JP2617326B2 (en) | 1987-12-02 | 1987-12-02 | Drill |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2617326B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03170216A (en) * | 1989-11-28 | 1991-07-23 | Mitsubishi Materials Corp | Miniature drill of rigid surface layer coated cemented carbide |
US7018143B2 (en) * | 1996-08-15 | 2006-03-28 | Bitmoore, An Oregon General Partnership | Reduced energy consuming, lateral cutting twist drill |
US8328473B2 (en) | 2004-07-09 | 2012-12-11 | Ibiden Co., Ltd. | Drill and method of producing printed circuit board |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS563117A (en) * | 1979-06-25 | 1981-01-13 | Mitsubishi Metal Corp | Coated miniature drill made of hard alloy metal |
JPS6135710U (en) * | 1984-08-07 | 1986-03-05 | 株式会社 エフエスケ− | rotary cutting tool |
-
1987
- 1987-12-02 JP JP62303314A patent/JP2617326B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS563117A (en) * | 1979-06-25 | 1981-01-13 | Mitsubishi Metal Corp | Coated miniature drill made of hard alloy metal |
JPS6135710U (en) * | 1984-08-07 | 1986-03-05 | 株式会社 エフエスケ− | rotary cutting tool |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03170216A (en) * | 1989-11-28 | 1991-07-23 | Mitsubishi Materials Corp | Miniature drill of rigid surface layer coated cemented carbide |
US7018143B2 (en) * | 1996-08-15 | 2006-03-28 | Bitmoore, An Oregon General Partnership | Reduced energy consuming, lateral cutting twist drill |
US8328473B2 (en) | 2004-07-09 | 2012-12-11 | Ibiden Co., Ltd. | Drill and method of producing printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
JP2617326B2 (en) | 1997-06-04 |
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