JPH01146538U - - Google Patents

Info

Publication number
JPH01146538U
JPH01146538U JP1988042624U JP4262488U JPH01146538U JP H01146538 U JPH01146538 U JP H01146538U JP 1988042624 U JP1988042624 U JP 1988042624U JP 4262488 U JP4262488 U JP 4262488U JP H01146538 U JPH01146538 U JP H01146538U
Authority
JP
Japan
Prior art keywords
semiconductor device
metallized surface
stem
lead
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988042624U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988042624U priority Critical patent/JPH01146538U/ja
Publication of JPH01146538U publication Critical patent/JPH01146538U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP1988042624U 1988-03-30 1988-03-30 Pending JPH01146538U (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988042624U JPH01146538U (https=) 1988-03-30 1988-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988042624U JPH01146538U (https=) 1988-03-30 1988-03-30

Publications (1)

Publication Number Publication Date
JPH01146538U true JPH01146538U (https=) 1989-10-09

Family

ID=31269033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988042624U Pending JPH01146538U (https=) 1988-03-30 1988-03-30

Country Status (1)

Country Link
JP (1) JPH01146538U (https=)

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