JPH01145203U - - Google Patents
Info
- Publication number
- JPH01145203U JPH01145203U JP4033188U JP4033188U JPH01145203U JP H01145203 U JPH01145203 U JP H01145203U JP 4033188 U JP4033188 U JP 4033188U JP 4033188 U JP4033188 U JP 4033188U JP H01145203 U JPH01145203 U JP H01145203U
- Authority
- JP
- Japan
- Prior art keywords
- shoe
- cutout hole
- sole
- plate material
- durability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
第１図は本考案の第１実施例に係る靴の下底の
下面図、第２図はその断面図、第３図はプレート
材と基板材の下面図、第４図は第３図のＡ―Ａ線
断面図、第５図はプレート材が分離されている状
態の靴の下底の斜視図であり、第６図は本考案の
第２実施例に係る靴の下底を示す下面図、第７図
はその断面図、第８図はプレート材の下面図、第
９図は第８図のＡ―Ａ線断面図である。
１，１ａ……下底材、２……踵部、５……前方
接地部、６……第１の切抜孔、６ａ……切抜孔、
８……第２の切抜孔、９……第１のプレート材、
９ａ……プレート材、１０……第２のプレート材
。
FIG. 1 is a bottom view of the sole of the shoe according to the first embodiment of the present invention, FIG. 2 is a sectional view thereof, FIG. 5 is a perspective view of the lower sole of the shoe with the plate material separated, and FIG. 6 is a lower surface showing the lower sole of the shoe according to the second embodiment of the present invention. 7 is a sectional view thereof, FIG. 8 is a bottom view of the plate material, and FIG. 9 is a sectional view taken along the line A--A in FIG. 8. 1, 1a... Lower sole material, 2... Heel part, 5... Front ground contact part, 6... First cutout hole, 6a... Cutout hole,
8... Second cutout hole, 9... First plate material,
9a... Plate material, 10... Second plate material.
Claims (1)
形成し、該切抜孔の上方から該切抜孔の形状と同
形に予め形成されプレート材を挿入接着するとと
もに該プレート材を該下底材よりも高摩擦抵抗と
高耐久性を有する素材から形成してなることを特
徴とする靴底構造。 A cutout hole is formed by cutting out a part of the ground-contacting part of the lower sole material of the shoe, and a plate material pre-formed in the same shape as the cutout hole is inserted and bonded from above the cutout hole, and the plate material is attached to the lower part of the shoe. A shoe sole structure characterized by being formed from a material that has higher frictional resistance and durability than the sole material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4033188U JPH01145203U (en) | 1988-03-29 | 1988-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4033188U JPH01145203U (en) | 1988-03-29 | 1988-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01145203U true JPH01145203U (en) | 1989-10-05 |
Family
ID=31266802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4033188U Pending JPH01145203U (en) | 1988-03-29 | 1988-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01145203U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS448777Y1 (en) * | 1965-06-04 | 1969-04-09 | ||
| JPS5411064U (en) * | 1977-06-24 | 1979-01-24 | ||
| JPS5916404B2 (en) * | 1975-09-10 | 1984-04-16 | 日本電気株式会社 | semiconductor equipment |
-
1988
- 1988-03-29 JP JP4033188U patent/JPH01145203U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS448777Y1 (en) * | 1965-06-04 | 1969-04-09 | ||
| JPS5916404B2 (en) * | 1975-09-10 | 1984-04-16 | 日本電気株式会社 | semiconductor equipment |
| JPS5411064U (en) * | 1977-06-24 | 1979-01-24 |