JPH01145181U - - Google Patents
Info
- Publication number
- JPH01145181U JPH01145181U JP4065588U JP4065588U JPH01145181U JP H01145181 U JPH01145181 U JP H01145181U JP 4065588 U JP4065588 U JP 4065588U JP 4065588 U JP4065588 U JP 4065588U JP H01145181 U JPH01145181 U JP H01145181U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- cable
- fixed
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4065588U JPH01145181U (no) | 1988-03-28 | 1988-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4065588U JPH01145181U (no) | 1988-03-28 | 1988-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01145181U true JPH01145181U (no) | 1989-10-05 |
Family
ID=31267121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4065588U Pending JPH01145181U (no) | 1988-03-28 | 1988-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01145181U (no) |
-
1988
- 1988-03-28 JP JP4065588U patent/JPH01145181U/ja active Pending