JPH01145173U - - Google Patents
Info
- Publication number
- JPH01145173U JPH01145173U JP4176488U JP4176488U JPH01145173U JP H01145173 U JPH01145173 U JP H01145173U JP 4176488 U JP4176488 U JP 4176488U JP 4176488 U JP4176488 U JP 4176488U JP H01145173 U JPH01145173 U JP H01145173U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- protective film
- solder resist
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4176488U JPH01145173U (no) | 1988-03-29 | 1988-03-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4176488U JPH01145173U (no) | 1988-03-29 | 1988-03-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01145173U true JPH01145173U (no) | 1989-10-05 |
Family
ID=31268193
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4176488U Pending JPH01145173U (no) | 1988-03-29 | 1988-03-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01145173U (no) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6011468B2 (ja) * | 1976-02-06 | 1985-03-26 | 株式会社日立製作所 | 加熱テ−ブル |
-
1988
- 1988-03-29 JP JP4176488U patent/JPH01145173U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6011468B2 (ja) * | 1976-02-06 | 1985-03-26 | 株式会社日立製作所 | 加熱テ−ブル |