JPH01144221A - Substrate holding head - Google Patents

Abstract

PURPOSE:To easily and surely hold a substrate by simplifying structure by setting an interval between the L-shape grooves of a supporting member when both parallel flat springs are pressed in a prescribed direction larger than the interval at the time of recovering the flat spring. CONSTITUTION:The L-shape grooves 81, 81 are formed in the structure to be abutted with an edge part or a corner part confronting with the substrate 3. The depth of the grooves 81, 81 in a direction of arrow head Z regulates a thickness direction in which the substrate 3 is held. By pressing the parallel flat springs 70, 70, the interval T0 between the L-shape grooves 81, 81 is widened. By removing a pressing force or pressing a head frame body in the direction of arrow head Z in such state, the width of the substrate 3 goes to Tl, and the substrate 3 can be held. The optimum position adjustment of a photoreceiving sensor can be selected by holding the substrate 3 and moving it in directions of X and Y. After deciding the optimum position, the screws 4, 4 of the substrate 3 are tightened. Afterwards, the supporting members 80, 80 can be separated from the substrate 3 easily by pulling a head holding frame 60 to a side opposite to the direction of arrow head Z. In such a way, it is possible to realize a sure holding operation with simple structure.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a substrate holding head used, for example, to attach a light receiving sensor substrate to an optical head of an optical disc player.

Prior Art FIG. 4 is a perspective view showing an optical head. Optical head body 1
A light receiving sensor 2 is attached to.

The light receiving sensor 2 is for receiving the return light reflected from the optical disk by the optical head and extracting a data signal, a focus error signal, etc., and uses a multi-division photodiode. Therefore, when mounting the light receiving sensor 2, it is necessary to align the center with the optical axis of the light to be received.

As a means for attaching the optical sensor to the optical head body, first, the optical sensor 2 is fixed to the printed circuit board 3 by soldering. Next, this substrate 3 is temporarily fixed to the side surface of the optical head main body 1 using fixing screws 4. Next, the substrate 3 is supported by a holding head (not shown) and moved in the X1Y axis directions. In this case, the holding head is operated while observing the output signal of the light receiving sensor 2 with a measuring device. Once the optimum position is selected, tighten the fixing screw 4 with a screwdriver. As a result, the substrate 3 is fixed to the optical head main body 1, and the light receiving sensor 2 is mounted in the correct position.

In this case, position setting and fixing operations using the holding head and driver can be performed manually, but they can also be performed automatically using a robot.

There are various types of holding heads that have been used in the past, including mechanical hands with special structures used in robots.

Problems to be Solved by the Invention Conventional holding heads that have been used to adjust the mounting of circuit boards have not been suitable for work processes because they have caused wobbling during adjustment, have complicated structures, and are large and expensive. There wasn't.

The present invention aims to solve the above-mentioned conventional problems.

Means for Solving the Problems The substrate holding head of the present invention includes a head frame body having a pair of arms arranged at a predetermined distance apart, one end supported by each arm and the other ends facing each other. a pair of parallel plate springs extending into the space formed between the arms; and a support fixed to the other end of the parallel plate springs, each having an L-shaped groove that abuts opposite edges of the substrate for holding. The support member is characterized in that when both parallel leaf springs are biased in a predetermined direction, the spacing between the L-shaped grooves of the support member becomes larger than when the leaf springs are in their returned state.

Function: According to the substrate holding head of the present invention, the substrate can be held by the L-shaped groove supporting member by the restoring force of the parallel leaf spring. Further, the depth in the thickness direction of the substrate to be held is regulated by the L-shaped groove structure, and a reliable holding operation is achieved.

Embodiments Examples of the present invention will be described below with reference to the drawings.

1 and 2 are plan views of a substrate holding head according to an embodiment of the present invention, and FIG. 3 is a front view thereof.

Reference numeral 60 denotes a plate-shaped head frame body, and a pair of arms 8L6111 extending in the same direction are mounted on both sides of the head frame body. 70. 70 is a parallel plate spring formed by folding back, and its open end 7L
71 sandwich each arm 61.61 and are fixed by screws 73.73. Parallel leaf springs 70.70 are connected to the space 6 formed between the arms 61.61.
A pair of supporting members 80, 80 are fixed to the folded ends 72, 72 by adhesive, welding, or the like. The support members 80.80 each have L-shaped grooves 81.81, which grooves are parallel and parallel to the parallel plate springs 7.
In the return state of 0 and 70, they are placed facing each other with a predetermined distance To between them.

The L-shaped grooves 81.81 are structured to abut opposite edges or corners of the substrate 3. The depth of this groove 81.81 in the direction of arrow Z regulates the thickness direction in which the substrate 3 is held.

FIG. 1 shows the returned state of the parallel plate spring 70170, and the second
The figure shows a state in which the substrate 3 is clamped while being biased in the direction of arrow Z. When the parallel plate springs 70.70 are biased, the L-shaped groove 81.
The interval To of 81 has a spread To<Tz. In this state, if the biasing force is removed or the head frame is pressed in the direction of arrow Z, the width TI of the substrate 3 is achieved and the substrate 3 can be held.

By holding the substrate 3 and moving it in the X and Y directions as shown in FIG. 4, the optimum position adjustment of the light receiving sensor 2 can be selected. Decide on the optimum position and tighten the screws 4.4 on the board 3. Then go to retention.

When the frame body 60 is pulled in the direction opposite to the arrow Z direction, the support member 80
．． 80 can be easily removed from the board 3.

Here, the parallel leaf springs 70, 70 do not need to be completely parallel, but only need to be substantially parallel to the extent that the above-mentioned operation can be performed smoothly.

Effects of the Invention As can be understood from the description of the embodiments above, the substrate holding head of the present invention has a simple structure and can easily and reliably hold the substrate. In addition, it is possible to easily detach from the fixed substrate.

If a mechanical means for biasing the parallel plate springs is added to the structure of this substrate holding head, the mouth pot will be simplified! 1
It can also be used as a mechanical hand.

Further, by making the interval between the arms 6L81 variable, it is possible to hold substrates of various widths.

[Brief explanation of the drawing]

1 and 2 are both plan views of a substrate holding head according to an embodiment of the present invention, and FIG. 3 is a front view of the same embodiment.
FIG. 4 is a perspective view showing an optical head for explaining the present invention in detail. 3... Substrate, 60... Hend frame body, 70... Parallel leaf spring, 80... Support member, 81/11-L-shaped groove. Patent Applicant: NEC Home Electro Co., Ltd. Figure 1 Figure 4 Procedural Amendment Power / January 1985 / / Japan Director General Kunio Ogawa Name of the Invention To Retain the Substrate, Do 3, Relationship with the Person Who Makes the Amendment Case Patent Applicant Address: Mr. 3-5-24 Miyahara, Yodoyou-ku, Osaka City
Name (193) Takashi Murakami, Representative of NEC Home Electronics Co., Ltd.

Claims (1)

[Claims] (1) A head frame body having a pair of arms arranged at a predetermined distance apart, and a pair of arms having one end supported by each arm and the other ends facing each other and extending into the space formed between the arms. and support members each having an L-shaped groove abutting opposite edges of a substrate for holding, and each supporting member being fixed to the other end of the parallel plate spring; A substrate holding head characterized in that when the support member is biased in a predetermined direction, the distance between the L-shaped grooves of the support member is larger than that in the returned state of the leaf spring.