JPH01143761A - Jet type soldering device - Google Patents

Abstract

PURPOSE:To improve maintainability by integrally forming a no nozzle tank part for a pump tank part and respectively arranging a face fitting heater to the pump tank, nozzle tank and on the outer face of a duct part. CONSTITUTION:A nozzle tank part 25 is integrally formed to a pump tank part 24 on a solder tank 21 and a duct part 26 is composed at the bottom part of the nozzle tank part 25. Face fitting heaters 81, 82, 83, 84 are respectively arranged on the outer face of the pump tank part 24, nozzle tank part 25 and duct part 26. The melting state of the solder forcibly fed to a nozzle 23 is maintained well and each heater is fitted to the outer face of each tank in all, so the inspection and repair of the heater 81-84 are facilitated. The bottom part of the nozzle tank part 25 and duct part 26 are integrated and the number of parts is reduced. Consequently the maintainability of the soldering device is improved.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a jet soldering device.

(Prior Art) As shown in FIG. 5, a conventional jet soldering apparatus includes a nozzle 12 provided inside a solder bath 11, a duct 13 provided below this nozzle 12, and a duct 13 provided at the bottom of this nozzle 12. A pump casing 14 is connected and communicated with the pump casing 14, and an impeller 16 rotated by a motor 15 is provided inside the pump casing 14. A suction port 17 is provided in the pump casing 14 below the impeller 1G. .

Furthermore, a 1-minute heater insertion interval is provided between the lower surfaces of the duct 13 and pump casing 14 and the bottom surface portion 11a of the solder bath 11, and a large number of rod-shaped heaters 18 are inserted into this portion.

Then, the solder melted by this heater 18 is sucked into the pump casing 14 from the suction port 17 by the action of the rotary impeller 16, is forced into the duct 13, and is completely removed by the equalizing plate 19 in the duct 13. Uniform flow and pressure across the cross section! The workpiece (printed wiring board, etc.) conveyed on this nozzle 12 is soldered.

(Problems to be Solved by the Invention) In this way, the conventional jet soldering device
A large number of rod-shaped heaters 18 are inserted between the lower surface of the pump casing 14 and the bottom surface 11a of the solder bath 11. Difficult to drop.

This is because the heater 18 is located below the nozzle 12, duct 13, and pump casing 14, and even if the members above these are removed, the heater 18
This is because dirt on the lower surface of the heater cannot be removed unless the heater itself is disassembled and taken out. Further, even if this heater 18 breaks down, it is not easy to repair it for the same reason.

As described above, the conventional jet soldering apparatus has problems in maintenance.

SUMMARY OF THE INVENTION An object of the present invention is to facilitate maintenance of the heater by making it possible to attach the heater to the outside of the solder bath.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides solder l! In a jet soldering apparatus, a pump 22 and a nozzle 23 for jetting the molten solder pumped by the pump 22 are provided inside the pump 21. A nozzle tank 25 is integrally formed with a nozzle tank 23, and the bottom of the nozzle tank 25 is formed by a duct part 26 that guides the molten solder pumped from the pump 22 to the nozzle 23. A surface-mounted heater 81.8 is mounted on the outer surface of the tank section 25 and the duct section 26.
2.83.84 are provided.

(Function) The present invention melts the solder in the tank by the surface-mounted heaters 81, 82, 83, 84 provided outside the solder tank 21.
Surface-mounted heaters 83 and 84 provided on the outer surface of the nozzle 6 keep the solder fed to the nozzle 23 in a good melted state. Maintenance of the heaters 81, 82, 83, 84 can be performed independently of the pump 22, nozzle 23, molten solder, etc. in the solder bath 21.

(Example) Hereinafter, the present invention will be explained in detail with reference to the example shown in FIGS. 1 to 4.

As shown in Figure 1, is lυdI! Inside 21,
A pump 22 and a nozzle 23 that jets the molten solder pumped by the pump 22 are provided.

As shown in FIG. 4, the solder bath 21 is connected to the nozzle 2 with respect to the pump bath section 24 in which the pump 22 is provided.
3 is integrally formed, and the bottom of this nozzle tank 25 is fed under pressure from the pump 22 w.
It is formed by a duct portion 26 that guides the J@solder to the nozzle 23.

The pump 22, as shown in FIGS. 1 and 2,
An impeller 33 fixed to the lower end of the pump shaft 32 is rotatably provided inside the pump casing 31, and the suction port 3 is connected to the pump casing 31 under the impeller 33.
4, and a discharge port 35 is provided on the circumferential surface of the pump casing 31 in a tangential direction to the circumferential surface.

As shown in FIGS. 1 and 2, the mounting structure of this pump 22 is such that a rectangular tube 3G fitted into the discharge port 35 is removably fitted into the inlet recess of the duct portion 26. At the same time, a flange 37 provided at the opening of the discharge port 35 is secured to the side wall of the pump tank FIS 24, and a mounting support member 38 is fixed to the side wall of the pump casing 31 opposite to the square tube 36. A horizontal plate portion 39 integrally provided at the upper end of the mounting support member 38 is fixed to the frontage flange 42 of the Iυ tank 21 by two bolts 41. As shown in FIG. 2, a solder temperature detector mounting machine 43 is fixed with bolts 44 near the horizontal plate part 39, and a heater control glue and mostat 45 are inserted into the solder bath 21 from this mounting machine 43. and a thermocouple 46 is inserted vertically.

The nozzle 23 is mounted on a mounting board 51 as shown in FIG.
It is fixedly supported via an L-shaped mounting plate 54 by a pair of support plates 53 fixed to the left and right sides of the body by bolts 52.

Mounting supports 55 and 56 bent into substantially concave shapes are fixed to the left and right ends of the mounting board 51 by welding, and are integrally provided at the upper ends of the mounting supports 55 and 56. As shown in FIG.
It is fixed at 2.

Further, as shown in FIG. 1, a plurality of flow equalizing plates 63 are provided inside the square hole 61 bored in the mounting board 51 via the mounting plate 62 and gradually become longer as the distance from the pump 22 increases. Further, a ]-shaped duct end member 64 extending over the entire width of the duct portion 26 is fixed to the lower surface of the left side of the mounting board 51 with a bolt 65, and the lower end of this duct end member 64 is in contact with the bottom surface of the duct portion 26. Further, a mouth-shaped cross-sectional partition member 66 extending over the entire width of the duct portion 26 is fixed to the right side of the mounting board 51 and the lower surface of the mounting support member 56 by bolts 67, and the lower part of this partition member 66 is Square tube 36 of pump outlet 35
and 7 langes 37 so as to be able to move toward and away from the duct portion 26.
The square tube 36 fitted into the inlet recess is pressed down from above to fix the pump casing 31.

When disassembling each component inside the solder tank 21 for reasons such as cleaning the inner wall of the solder tank 21, first, the bolts 58 installed on the frontage flange 42 of the solder tank 21 are
Remove and remove the support material 55.56, pull up the mounting board 51 that is integrated with this mounting support US5.56, and remove the nozzle 23, flow equalizing plate 63,
The duct end member 64 and the partition wall member 66 are not taken out from the solder bath 21 together with the mounting board 51 at the same time. Next, remove the bolts 44 provided on the opening flange 42 of the solder bath 21, take out the thermostat 45 and thermocouple 46 from the solder Wi21, and then move the impeller 33 together with the pump shaft 32 above the solder bath 21. Then, the bolts 41 provided on the opening flange 42 of the solder bath 21 are removed, and the pump casing 31 is taken out. By doing so, all the members inside the solder bath 21 can be easily taken out to the outside. Also, when assembling, it can be easily assembled in the reverse order.

Next, the pump tank section 24 and the nozzle tank section 2 shown in FIG.
5 and the outer surfaces 71, 72, 73, 74 degrees 75 and 76 of the duct portion 26 are provided with the following surface-mounted heaters.

That is, as shown in FIGS. 1 and 3, a surface-mounted heater 81 is attached to the side surface of the pump tank section 24 on the side opposite to the nozzle, and as shown in FIGS. A pair of surface-mounted heaters 82 are installed from the side surfaces of the workpiece loading side and the workpiece unloading side of the tank section 25 to the upper side surface of the pump tank section 24, and below the pair of surface-mounted heaters 82, both sides of the duct section 26 are installed. A pair of surface-mounted heaters 83 are attached to the surface, and further, as shown in FIGS. 1 and 3, a surface-mounted heater 84 is attached to the lower surface of the duct portion 26.

The surface-mounted heaters 81, 82, 83, and 84 have electric heaters cast into square plate-shaped iron heater bodies, and are arranged so that the heater bodies are in close contact with each outer surface of the solder bath 21. It is attached by bolt 85 to.

Then, the solder in the tank is melted by surface-mounted heaters 81, 82, 83, 84 provided on the outer surface of the solder tank 21, and this molten solder is transferred to the impeller 33, which is rotated via the pump shaft 32 by a motor (not shown). It is pumped to the discharge port 35 by the centrifugal force generated from the duct part 2
It is pressurized and supplied to the nozzle 23 through the equalizing plate 63 of No. 6, and is jetted from the upper part of the nozzle 23.
Soldering is performed on the work (printed wiring board) carried on the solder tank 3 and circulated in the solder bath 21.

In such a flow of molten solder, in particular, surface-mounted heaters 83 and 84 provided on the outer surface of the duct portion 26 constituting the bottom of the nozzle tank portion 25 improve the melting state of the solder that is force-fed to the nozzle 23. keep. Each surface-mounted heater 81.
For replacement J3 and inspection of 82.83.84, use bolt 85.
Just by removing it, it can be installed outside the tank 21! ! II
Therefore, maintenance can be easily carried out without any delay, such as nozzle 23, pump 22, melting of solder 4921, etc.

〔Effect of the invention〕

According to the present invention, by integrating the bottom part of the first part of the nozzle 41' and the duct part, it becomes possible to provide a surface-mounted heater on the outer surface of the solder bath, and maintenance regarding this heater can be performed easily.

Furthermore, since the bottom of the nozzle tank is raised up to the duct, the solder capacity can be reduced accordingly, which is economical. Furthermore, by integrating the bottom part of the nozzle tank part and the duct part, the number of parts is reduced, costs can be reduced, and maintenance is also easy.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing one embodiment of the jet soldering device of the present invention, FIG. 2 is a plan view of the nozzle removed, and FIG.
1, FIG. 4 is a perspective view of a solder bath, and FIG. 5 is a sectional view of a conventional jet-type soldering apparatus. 21...Solder bath, 22...Pump, 23...Nozzle,
24... Pump tank section, 25... Nozzle 1lPJ, 2G...
・Duct part, 81.82.83.84...Surface heater. J Henmi

Claims (1)

[Claims] (1) In a jet soldering device in which a pump and a nozzle for jetting molten solder pumped by the pump are provided inside a soldering bath, the nozzle A nozzle tank section is integrally formed with A jet soldering device characterized in that a surface-mounted heater is provided on the outer surface of the part.