JPH01143144U - - Google Patents
Info
- Publication number
- JPH01143144U JPH01143144U JP3931088U JP3931088U JPH01143144U JP H01143144 U JPH01143144 U JP H01143144U JP 3931088 U JP3931088 U JP 3931088U JP 3931088 U JP3931088 U JP 3931088U JP H01143144 U JPH01143144 U JP H01143144U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor element
- heat radiation
- circuit pattern
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3931088U JPH01143144U (no) | 1988-03-24 | 1988-03-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3931088U JPH01143144U (no) | 1988-03-24 | 1988-03-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01143144U true JPH01143144U (no) | 1989-10-02 |
Family
ID=31265820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3931088U Pending JPH01143144U (no) | 1988-03-24 | 1988-03-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01143144U (no) |
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1988
- 1988-03-24 JP JP3931088U patent/JPH01143144U/ja active Pending