JPH01143128U - - Google Patents
Info
- Publication number
- JPH01143128U JPH01143128U JP3850188U JP3850188U JPH01143128U JP H01143128 U JPH01143128 U JP H01143128U JP 3850188 U JP3850188 U JP 3850188U JP 3850188 U JP3850188 U JP 3850188U JP H01143128 U JPH01143128 U JP H01143128U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- view
- semiconductor integrated
- inner lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 3
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3850188U JPH01143128U (sv) | 1988-03-24 | 1988-03-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3850188U JPH01143128U (sv) | 1988-03-24 | 1988-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143128U true JPH01143128U (sv) | 1989-10-02 |
Family
ID=31265045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3850188U Pending JPH01143128U (sv) | 1988-03-24 | 1988-03-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143128U (sv) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04123536U (ja) * | 1991-04-26 | 1992-11-09 | サンケン電気株式会社 | 電子部品 |
| JP2011216918A (ja) * | 2011-08-01 | 2011-10-27 | Dainippon Printing Co Ltd | 樹脂封止型半導体装置および半導体装置用回路部材 |
-
1988
- 1988-03-24 JP JP3850188U patent/JPH01143128U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04123536U (ja) * | 1991-04-26 | 1992-11-09 | サンケン電気株式会社 | 電子部品 |
| JP2011216918A (ja) * | 2011-08-01 | 2011-10-27 | Dainippon Printing Co Ltd | 樹脂封止型半導体装置および半導体装置用回路部材 |