JPH01142199A - Method of fixing construction of anchor bolt - Google Patents

Abstract

PURPOSE: To easily execute the operation by injecting one liquid-type epoxy resin composition including a hardener inert at a normal temperature, into a pierced hole, and heating an inserted anchor bolt to harden the epoxy resin composition. CONSTITUTION: A hole for anchor bolt 7 is formed on a base material 9 such as concrete and the like by a boring machine such as a hammer drill and the like, and the chip in the hole is removed. Then one liquid-type exposy resin composition 10 is injected into the hole, and the anchor bolt 7 is inserted. The bolt 7 is heated by, for example, a high frequency dielectric heater 6, the composition is hardened by the heat conduction from the bolt 7, and the bolt 7 is firmly fixed to the base material 9. Accordingly the work can be easily executed.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method of fixing an anchor bolt to a base material such as concrete or rock using a resin.

<Prior Art> Conventionally, a method of fixing an anchor bolt to a hole formed in rock, concrete, etc. using a resin is known.

In this construction method, a curable resin composition containing a hardening agent is uniformly mixed in the hole of the anchor bolt using a rotating means such as an electric motor, and the resin is cured, thereby fixing the buried part of the anchor bolt in a relatively short time. As the resin, unsaturated polyester resin, epoxy resin, urethane resin, epoxy acrylate resin, etc. are used. In recent years, a capsule adhesive in which a resin and a curing agent are sealed in a breakable container such as glass without contacting each other has been used as a fixing material in this method.

Japanese Patent Laid-Open No. 57-161297 also discloses a construction method in which thermoplastic resin is injected in a molten state into the borehole to compact the base of the anchor bolt.
It is stated in the No. JP-A-60-15700 describes a fixing method in which an anchor bolt inserted into a hole is electromagnetically heated to promote curing of a curable resin.

<Problems to be solved by the invention> The anchor bolt fixing method using a capsule-type fixing agent requires breaking the capsule and mixing the resin and hardening agent, making the construction operation complicated and requiring an anchor bolt rotating device. It is. When fixing specially shaped anchor bolts such as L-shaped anchor bolts and anchors with hooks because the anchor bolts are rotated, there are difficulties in designing the construction method such as drilling conditions and construction conditions.

There is a need to develop a fixing method that is not limited by the shape of the anchor bolt and does not necessarily require a rotating device.

<Means for Solving the Problems> The present inventors have solved the above-mentioned problem by injecting a one-component epoxy resin composition into the borehole, heating the inserted anchor bolt, and dissolving the molded epoxy resin composition. He discovered that the problem could be solved by curing the anchor bolt, and completed the present invention.In other words, the present invention provides the following advantages: As a fixing agent, at room temperature (e.g. below 40°C),
An anchor bolt fixing method characterized by using a one-component epoxy resin composition containing an inert curing agent as a component and heating the anchor bolt to cure the molded epoxy resin composition. Description of the EAK of the present invention The one-component epoxy resin composition used in the present invention is a mixture of an epoxy resin that is liquid at room temperature and a curing agent that is inactive at room temperature. Epoxy resin is liquid at room temperature and has epoxy groups f.
:, There is no particular restriction as long as it has two or more. Examples of such compounds include bis-epi type epoxy compounds obtained from bisphenol A and epichlorohydrin, novolak type epoxy compounds obtained from phenol resin and shrimp chlorohydrin, and epoxidation of the double bond portion of polybutadiene with peracetic acid, etc. polybutadiene-type epoxy compounds obtained from 10genated bisphenol A and epichlorohydrin, polyalkylene ether-type epoxy compounds obtained from polyethylene glycol, polypropylene glycol, etc. and epichlorohydrin,
Methyl-substituted epoxy compounds obtained from β-methylepichlorohydrin, polyhydric phenols, polyhydric alcohols, polyhydric carboxylic acids, etc., other urethane-modified epoxy resins, vinyl compounds such as glycidyl methacrylate copolymers, and mixtures thereof, etc. be able to.

The curing agent that is inactive at room temperature used in the present invention is an adduct of an epoxy compound and an imidazole compound or a carboxylate of an imidazole compound, or a mixture of the adduct and a compound having an isocyanate group. Examples of the O polyepoxy compound, which may be a monoepoxy compound or a polyepoxy compound, include a glycidyl ether type epoxy resin of bisphenol A. An imidazole compound refers to a compound having an active hydrogen at the nitrogen of the imidazole ring. For example, carboxylate salts of ξidazoyl compounds such as imidazole, 2-methylimidazole, 2-ethylimidazole, etc. can also be used. Acids that form such salts include, for example, acetic acid,
Examples include lactic acid, salicylic acid, and cono-phosphoric acid.

The reaction ratio between the epoxy compound and the imidazole compound or the carboxylic acid salt of the imidazole compound is such that the number of epoxy groups is 0.8 to t, S per active hydrogen of the imidazole compound.The zero addition reaction is carried out without a solvent. However, by dissolving the imidazole compound in a suitable solvent,
Examples of compounds having an isocyanate group to which an epoxy compound may be added include tetramethylene diisocyanate, hexamethylene diisocyanate,
Examples of polyisocyanate compounds such as tolylene diisocyanate include monoisocyanate compounds.

In the present invention, an epoxy resin is cured by the catalytic action of a tertiary amine of an adduct of an imidazole compound (or a carboxylate of an imidazole compound) and an epoxy compound during heating, and the compound having an isocyanate group is The adduct of the imidazole compound usually reacts with the hydroxyl group of the adduct of the compound and prevents the reaction in m) IC.

The blending composition is preferably 1 to 100 parts by weight of an adduct of an epoxy compound and an imidazole compound or a carboxylate of an imidazole compound, and 0 to 100 parts by weight of an isocyanate compound, per 100 parts by weight of the epoxy resin.

Other curing agents that are inactive at room temperature include, for example, latent curing agents such as BF, amine complexes, dicyandiamide, organic acid hydrazide, and imidazole compounds, microcapsules of amine curing agents, and molecular curing agents. There are some that have a hardening agent adsorbed to the sieve to prevent contact between the hardening agent and the epoxy resin. Alternatively, a mixture of an epoxy resin and an amine curing agent can be used, which is immediately frozen to stop the reaction.

Furthermore, the molded epoxy resin composition contains a curing agent that is inactive at room temperature as a component, and contains inorganic fillers such as calcium carbonate powder and silica powder, and magnesia clinker to prevent resin shrinkage and increase adhesive strength. 1. Aggregates such as silica stone and natural stone may be mixed, and metal powders such as iron powder and copper powder may be mixed.

This is to increase heating efficiency when the heating means uses an electromagnetic method.

Next, an embodiment of the construction method will be described.

After drilling a hole in concrete, rock, etc. (hereinafter referred to as base material) with a drilling machine such as a hammer drill, and removing chips in the hole, injecting the one-component epoxy resin composition of the present invention into the hole,
Further, when inserting the anchor bolt, the anchor bolt is heated and the one-component epoxy resin composition is cured by heat conduction from the anchor bolt, thereby firmly fixing the anchor bolt to the base material.

The molded epoxy resin composition may be injected into the hole as it is, or it may be placed in a container made of glass, plastic, ceramics, etc., and inserted into the hole together with the container. .

The container is crushed when the anchor bolt is inserted, and after the cut-out epoxy resin bottom has hardened, it acts as an aggregate.

The heating means for the anchor bolt includes high frequency induction heating, high frequency dielectric heating, microwave heating, ultrasonic heating, heater heating, etc., and high frequency induction heating is most preferred.

A high-frequency induction heating device oscillates high-frequency power, generates a high-frequency magnetic flux f through an induction coil, generates a waste current and an induced current in the object to be heated (an anchor bolt in this case), and heats the object by the heat generated. .

As the high frequency power source, there are an electron tube type, a transistor inverter type, etc., but a transistor inverter type is preferable.

Heating conditions are not particularly limited, but for example, the output is 20 to 30 ffl, preferably 5
00W~5 approval, oscillation frequency is 0,1 KHz~500
KHz, preferably 10 KHz = 50 K
Hz is good.

<Effects of the Invention> The present invention injects a one-component epoxy resin composition into the borehole, heats the inserted anchor bolt, hardens the molded epoxy resin composition, and fixes the anchor bolt to the base material. Since it is a construction method, it is not limited by the shape of the anchor bolt, does not necessarily require an anchor bolt rotation device, is easy to construct, and can securely and firmly fix the anchor bolt to the base material.〈Example〉 The present invention will be explained below by giving examples, but the scope of the present invention is not limited by these examples.

Example 1 Uncured epoxy resin (manufactured by Asahi Chiba, trade name: AER-33
1J) 0.1 part by weight of hexamethylene diisocyanate was added to 100 parts by weight, mixed uniformly, and then finely divided triethylenetetramine-epoxy resin (manufactured by Asahi Chipa, AER-661J) adduct (reaction molar ratio) with a particle size of 20 microns or less was added. A one-component epoxy resin composition was prepared by adding 50 parts by weight of 2:1) and mixing well, and stored at room temperature for 14 days.

Next, a concrete block with a compressive strength of 250 Kg/cd was drilled with holes having the diameter and length shown in Table 1, and after removing chips, the pre-molded epoxy resin composition prepared above was injected, and the rated Output 5■, power input rating 200V, 6.5K
High frequency induction heating device (manufactured by Shimada Rika Kogyo ■, model T)
-5), oscillation frequency 23KHz, output voltage 45V
At an output current of 10 A, the anchor bolt was inserted into the hole through the induction coil, and induction heating was continued for about 5 minutes.

One hour after completion of the induction heating, the anchor bolt was subjected to a pull-out test to measure the fixation strength. Furthermore, the curing state of the molded epoxy resin composition was observed, and the results are shown in Table IK.

Example 2 2-ethyl-4-methylimidazole and APR661 (
Asahi Kasei Kogyo@, bispheno-/L/A g x oxy resin, adduct with epoxy (reaction molar ratio 2:1) (reaction molar ratio 2:1) was coarsely ground to about 20 meshes and then finely ground to obtain an average particle size. A surface treated compound with a diameter of 3.0 μm was obtained.

The melting point of this product is 100°C.

100 parts of this surface treatment compound was dispersed in 200 parts of xylene, and 4 parts of succinic acid chloride was added while stirring at 50°C. This continued for 2 hours, after which time the yarn was vacuumed to remove the xylene and provide a surface treated compound. The melting point of this thing is 1
The temperature is 25°C.

AER331 (manufactured by Mukasei Kogyo), bisphenol A
An anchor bolt was made in the same manner as in Example 1, except that 4 parts of the above surface treatment compound and 8 parts of dicyandiamide were mixed with 100 parts of the molded epoxy resin (epoxy equivalent: 189) to prepare a molded epoxy resin composition. It was fixed to a concrete block by heating, and 1 hour after the fixing was completed, a pull-out test was conducted to measure the fixing strength. The results are shown in Table 1.

Example 3 The liquid epoxy resin composition used in Example 1 was injected into the hole, an anchor bolt with an L-shaped tip was inserted, and induction heating was performed in the same manner as in Example 1. One hour after the completion of heating, the anchor bolt was subjected to a pull-out test to measure the fixation strength. The results are shown in Table 1.

Comparative Example 1 Immediately after 14 parts by weight of triethylenetetramine was thoroughly mixed with uncured epoxy resin AER-331J 1 G 0 parts by weight, it was injected into the hole, an anchor bolt was inserted, and 1 hour later, the anchor bolt was pulled out. The adhesion strength was measured. The results are shown in Table IK.

Comparative Example 2 When the epoxy resin mixture of Comparative Example 1 was stored at room temperature for 4 days, it hardened and could not be injected into the holes.

Comparative Example 3 Capsule-type adhesive containing unsaturated polyester resin and benzoyl peroxide (AR manufactured by Asahi Kasei Corporation)
Chemical setters RG-1o and RG-12) were inserted into the holes in the same manner as in Example 1, and the bolts were embedded while being struck with a hammer. The anchor bolt was subjected to a pull-out test for 1 hour to measure the fixation strength.

The results are shown in Table 1.

Margin table below 1 Note) The anchor bolt is a fully threaded bolt, and the material is 5NB7.
゜

[Brief explanation of the drawing]

Fig. 1 shows the principle of high frequency induction heating, and Figs. 2 and 3 show one embodiment of the present invention. l...High frequency current 2...High frequency voltage 3...High frequency magnetic flux 4...Induction coil 5...Heated object 6... High frequency induction heating device 7 Anchor bolt 8 Induction coil 9 Base material 1G Liquid epoxy resin composition 11・・・
...L-shaped anchor bolt patent applicant Asahi Kasei Corporation

Claims (3)

[Claims] (1) When inserting an anchor bolt into a hole made in rock, concrete, etc. and fixing it with a fixing agent, use a one-component epoxy resin composition containing a curing agent that is inactive at room temperature as a component, An anchor bolt fixing method characterized by heating the anchor bolt and curing a one-component epoxy resin composition. (2) The curing agent that is inactive at room temperature is an adduct of an epoxy compound and an imidazole compound or a carboxylic acid salt of an imidazole compound, or a mixture of the adduct and a compound having an isocyanate group. Anchor bolt fixing method described in section (3) An anchor bolt fixing method according to claim 1, wherein the heating means is high-frequency induction heating.