JPH01141948A - Self-bonding resin composition - Google Patents
Self-bonding resin compositionInfo
- Publication number
- JPH01141948A JPH01141948A JP30204987A JP30204987A JPH01141948A JP H01141948 A JPH01141948 A JP H01141948A JP 30204987 A JP30204987 A JP 30204987A JP 30204987 A JP30204987 A JP 30204987A JP H01141948 A JPH01141948 A JP H01141948A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- self
- resin composition
- bonding
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 10
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 10
- 239000013034 phenoxy resin Substances 0.000 claims abstract description 8
- 229920006287 phenoxy resin Polymers 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims abstract description 5
- 239000002904 solvent Substances 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 claims description 2
- -1 polyethylene Polymers 0.000 abstract description 9
- 238000005299 abrasion Methods 0.000 abstract description 7
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 abstract description 4
- 239000004698 Polyethylene Substances 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- 229920000573 polyethylene Polymers 0.000 abstract description 3
- 239000004743 Polypropylene Substances 0.000 abstract description 2
- 229920001155 polypropylene Polymers 0.000 abstract description 2
- HMOZDINWBHMBSQ-UHFFFAOYSA-N 2-[3-(4,5-dihydro-1,3-oxazol-2-yl)phenyl]-4,5-dihydro-1,3-oxazole Chemical compound O1CCN=C1C1=CC=CC(C=2OCCN=2)=C1 HMOZDINWBHMBSQ-UHFFFAOYSA-N 0.000 abstract 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 abstract 2
- 229930185605 Bisphenol Natural products 0.000 abstract 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 1
- 229920000877 Melamine resin Polymers 0.000 description 8
- 230000004927 fusion Effects 0.000 description 7
- 239000005011 phenolic resin Substances 0.000 description 6
- 239000004640 Melamine resin Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004135 Bone phosphate Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- YDSWCNNOKPMOTP-UHFFFAOYSA-N mellitic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(O)=O)=C(C(O)=O)C(C(O)=O)=C1C(O)=O YDSWCNNOKPMOTP-UHFFFAOYSA-N 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012772 electrical insulation material Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000012793 heat-sealing layer Substances 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003049 inorganic solvent Substances 0.000 description 1
- 229910001867 inorganic solvent Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- ABBSXDLFMMKRKR-UHFFFAOYSA-N phosphorous acid;triphenylene Chemical compound OP(O)O.C1=CC=C2C3=CC=CC=C3C3=CC=CC=C3C2=C1 ABBSXDLFMMKRKR-UHFFFAOYSA-N 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Organic Insulating Materials (AREA)
- Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
（発明の技術分野）
本発明は、特に電気絶縁材料及び耐熱材料の分野におい
て有用な用途を有する樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD OF THE INVENTION The present invention relates to resin compositions that have particularly useful applications in the fields of electrical insulation materials and heat-resistant materials.
（発明の技術的背景およびギの問題点）従来から、導体
上に絶縁層を介して熱融着性の被膜を設けてなる自己融
着性絶縁電線がある。この自己融着性絶縁電線の熱融着
層としては、ポリビニルブチラール樹脂、ポリアミド樹
脂、フェノキシ樹脂等が多用されているが、このような
熱可塑性樹脂は、１５０℃以下で軟化してしまうので、
実際上コイルに過負荷電流が流れた場合や、高温雰囲気
中に置かれた場合に、融着強度が著しく低下してしまう
という難点があった。(Technical Background of the Invention and Problems) Conventionally, there have been known self-bonding insulated wires in which a heat-fusible coating is provided on a conductor via an insulating layer. Polyvinyl butyral resin, polyamide resin, phenoxy resin, etc. are often used as the heat sealing layer of this self-bonding insulated wire, but such thermoplastic resins soften at 150°C or lower, so
In practice, there is a problem in that the fusion strength decreases significantly when an overload current flows through the coil or when it is placed in a high temperature atmosphere.
又、アルコール可溶性ナイロン樹脂は高温において高い
接着力を有しているが、実際の使用にあたってその絶縁
ｍｓの温度に対する寿命である接着層の熱劣化特性は１
０５°Ｃ程度と低い。In addition, alcohol-soluble nylon resin has high adhesive strength at high temperatures, but in actual use, the thermal deterioration property of the adhesive layer, which is the life span of the insulation ms at a temperature, is 1.
The temperature is as low as 0.05°C.
さらに、ポリスルホン樹脂は高温における接着力は問題
ないが、コイル成形時に充分な接着力を保持するために
は２５０℃以上の加熱が長時間必要となり作業性が悪い
という欠点を有している。Furthermore, although polysulfone resin has no problems with adhesive strength at high temperatures, it has the disadvantage of poor workability because heating at 250° C. or higher is required for a long time in order to maintain sufficient adhesive strength during coil forming.
そこで本発明者らは、これらの欠点を解消するために２
．２’（１，３−フエエレン）ヒ゛ス（２−オキサゾリ
ン）（以下、ＰＢＯと略す）を用いた自己融着性樹脂組
成物を提案した（特開昭６２−９１５５６号公報参照）
。しかしながら、ＰＢＯを用いた組成物は優れた融着性
を持つ反面、耐摩耗性が充分でなかった。Therefore, in order to eliminate these drawbacks, the present inventors made two
．． proposed a self-fusing resin composition using 2'(1,3-phelene)hes(2-oxazoline) (hereinafter abbreviated as PBO) (see JP-A-62-91556).
. However, although compositions using PBO had excellent fusion properties, they did not have sufficient wear resistance.
耐摩耗性を大きくするためには、従来から潤滑油を電線
表面に塗布する方法があるが、塗布量の均一化が困難で
あるため、効果が小さい。又、ポリアミド樹脂層を電線
被覆上にオーバーコートする方法もあるが、この場合は
被覆作業が増えコストが高くなる等の問題があった。さ
らに、ポリエチレン等の微粉末を添加した組成物を用い
る方法も提案されているが、この方法では得られる組成
物の化学的な安定性が悪いという問題があった。In order to increase wear resistance, there is a conventional method of applying lubricating oil to the surface of the wire, but it is difficult to make the amount of application uniform, so the effect is small. There is also a method of overcoating the wire coating with a polyamide resin layer, but in this case there are problems such as increased coating work and increased cost. Furthermore, a method using a composition to which fine powder of polyethylene or the like is added has been proposed, but this method has a problem in that the resulting composition has poor chemical stability.
（発明の目的）
以上の点に着目し、融着性に優れ、かつ耐摩耗性を大幅
に向上させた自己融着性樹脂組成物を提供することを目
的とした。(Objective of the Invention) Focusing on the above-mentioned points, the present invention aimed to provide a self-fusing resin composition that has excellent fusing properties and significantly improved abrasion resistance.
（発明の概要）
本発明は即ち、（イ）フェノキシ樹脂又は、フェノキシ
樹脂とエポキシ樹２の混合物と、（ｔ＝） Ｐ Ｂ Ｏ
又はその誘導体と、（ハ）フッ素樹脂で表面コーティン
グされた平均粒子径２０μｍ以下の有機樹脂粉末から成
り、前記（イ）と（ロ）の合計ｆｔ１ｏＯ重量部に対し
て（ハ）を０．０１〜１５重量部添加したものを溶剤に
溶解せしめてなる自己融着性樹脂組成物に関する。(Summary of the Invention) The present invention includes (a) a phenoxy resin or a mixture of a phenoxy resin and an epoxy tree 2, and (t=) P B O
or a derivative thereof, and (c) an organic resin powder whose surface is coated with a fluororesin and has an average particle diameter of 20 μm or less, and (c) is 0.01 parts by weight per ft1oO of the total of (a) and (b). It relates to a self-fusing resin composition obtained by dissolving in a solvent 15 parts by weight of the present invention.
本発明に使用される（イ）のフェノキシ樹脂としては、
分子中に水酸基を含有する化合物であり、分子量２００
００〜３００００の、例えばＰＫＨＨｌＰＫＨＪ（米国
ユニオンカーバイド社製 商品名）等がある。As the phenoxy resin (a) used in the present invention,
A compound containing a hydroxyl group in the molecule, with a molecular weight of 200
00 to 30,000, for example, PKHHlPKHJ (trade name, manufactured by Union Carbide Company, USA).
本発明に用いる（イ）の工ざキシ樹脂としては、分子中
にエポキシ基を２個以上含有する化合物であり、例えば
ビスフェノール型エポキシ樹脂、ポリオール型エポキシ
樹脂、ノボラック型エポキシ樹脂、多価カルボン酸型エ
ポキシ樹脂、トリアジン型エポキシ樹脂、ポリオレフィ
ン型エポキシ樹脂、指環型エポキシ樹脂のいずれも使用
することができる。The engineered resin (a) used in the present invention is a compound containing two or more epoxy groups in the molecule, such as bisphenol-type epoxy resin, polyol-type epoxy resin, novolac-type epoxy resin, polycarboxylic acid Any of a type epoxy resin, a triazine type epoxy resin, a polyolefin type epoxy resin, and a ring type epoxy resin can be used.
本発明に使用される（口）のＰＢＯは、の構造を有する
化合物であり、公知のものを使用できる。The (oral) PBO used in the present invention is a compound having the structure, and any known one can be used.
又、ＰＢＯの誘導体は、ＰＢＯと多価カルボン酸とを無
機溶剤又は溶媒中でトリフェニレンホスファイトを触媒
として、少くとも１００℃以上の温度で反応させること
により得られる。本発明に用いるＰＢＯの誘導体として
は、多価カルボン酸がＰＢＯとの開票反応に寄与するも
ので、例えばテレフタル醗、イソフタル酸等の二塩基酸
、無水フタル酸等の二塩基酸無水物、トリメリット酸等
の三塩基酸及び三塩基酸無水物、ピロメリット酸等の四
塩基酸及び四塩基酸無水物であるものを使用できる。Further, the derivative of PBO can be obtained by reacting PBO and a polycarboxylic acid in an inorganic solvent or a solvent using triphenylene phosphite as a catalyst at a temperature of at least 100° C. or higher. The derivatives of PBO used in the present invention include polyhydric carboxylic acids that contribute to the counting reaction with PBO, such as dibasic acids such as terephthalic acid and isophthalic acid, dibasic acid anhydrides such as phthalic anhydride, and dibasic acid anhydrides such as phthalic anhydride. Tribasic acids and tribasic acid anhydrides such as mellitic acid, and tetrabasic acids and tetrabasic acid anhydrides such as pyromellitic acid can be used.
本発明に用いるＧ／今のフッ素樹脂で表面コーティング
された有機樹脂粉末としては、テフロン等のフッ素樹脂
で表面コーティングされたポリエチレン粉末、ポリプロ
ピレン粉末、ナイロン樹脂粉末等がある。これらの有機
樹脂粉末は平均粒子径が２０μ票以下のものを、前記ピ
）と（ロ）の合計Ｍ１００重量部あたり０．０１〜１５
麓量部配合する。平均粒子径が２０μ鯛 を越えると、
組成物中での分散が不均一になり、焼付後の外観が悪く
なる。配合量が０．０１重量部未満では耐摩耗性の効果
がほとんど無く、１５重量部を越えると焼付後の外観が
悪くなる。Examples of the organic resin powder whose surface is coated with a fluororesin used in the present invention include polyethylene powder, polypropylene powder, and nylon resin powder whose surface is coated with a fluororesin such as Teflon. These organic resin powders have an average particle diameter of 20 μm or less, and are 0.01 to 15 parts by weight per 100 parts by weight of the total M of (P) and (B) above.
Add the base amount. When the average particle size exceeds 20μ,
Dispersion in the composition becomes uneven, resulting in poor appearance after baking. If the amount is less than 0.01 parts by weight, there will be little effect on wear resistance, and if it exceeds 15 parts by weight, the appearance after baking will be poor.
又、本発明においては組成物の熱・軟化温度を上げる目
的で、メラミン樹脂やフェノール系樹脂を配合すること
ができる。使用できるメラミン樹脂としては、メラミン
−ホルムアルデヒド樹脂、ブチル化メラミン樹脂等があ
り、フェノール系樹脂としては、フェノール−ホルムア
ルデヒド樹脂等がある。Furthermore, in the present invention, a melamine resin or a phenolic resin may be blended for the purpose of increasing the heat/softening temperature of the composition. Melamine resins that can be used include melamine-formaldehyde resins and butylated melamine resins, and examples of phenolic resins that can be used include phenol-formaldehyde resins.
本発明の自己融着性樹脂組成物において、メラミン樹脂
やフェノール樹脂を配合しない場合の前記（イ）、（ロ
）の配合割合は、（イ）と（ロ）の合計量に対し←）を
５〜９５重量％、（ロ）を９５〜５重量外の割合で配合
するのが望ましい。この範囲外では融着力が低下する。In the self-bonding resin composition of the present invention, when melamine resin or phenol resin is not blended, the blending ratio of (a) and (b) above is ←) relative to the total amount of (a) and (b). It is desirable to mix 5 to 95% by weight, and (b) in a proportion other than 95 to 5% by weight. Outside this range, the fusion strength decreases.
又、メラミン樹脂やフェノール系樹脂を配合する場合に
は、（イ）と（ロ）とメラミン樹脂又はフェノール系樹
脂との合計量に対しくイ）を５〜９５重量％、（ロ）を
１〜６０重量％、メラミン樹脂やフェノール樹脂を５〜
５０重ｊｉ１％配合するのが望ましい。この範囲外では
融着力が低下するとともに、透明な溶液が得られない。In addition, when blending melamine resin or phenolic resin, 5 to 95% by weight of (a) and 1% of (b) based on the total amount of (a), (b), and melamine resin or phenol resin. ~60% by weight, 5~5% of melamine resin and phenolic resin
It is desirable to mix 1% of 50% by weight. Outside this range, the fusion strength decreases and a transparent solution cannot be obtained.
なお、本発明に用いる溶剤としては、クレゾール、ナフ
サ等の低沸点石油系炭化水素、シクロヘキサノン等の脂
環式炭化水素等があり、各成分を溶解させる温度は、組
成物中の各成分との反応が生起しない１００°Ｃ以下が
好ましい。Note that the solvent used in the present invention includes low boiling point petroleum hydrocarbons such as cresol and naphtha, and alicyclic hydrocarbons such as cyclohexanone. The temperature is preferably 100°C or lower, at which no reaction occurs.
（発明の実ｍ例） 本発明の詳細な説明する。(Example of invention) The present invention will be described in detail.
実施例１
第１表の実施例１に示す配合により混合し、ミキサーで
充分攪拌した。得られた自己融着性樹脂組成物は淡黄色
であった。直径１．０１１ｍの銅線上にポリエステルイ
ミド層、ポリアミドイミド層を順次被覆してなるエナメ
ル＃４ｍ上に、得られた自己融着性樹脂組成物を炉温２
００″０１線速１４ｍ／分で塗布焼付けて、膜厚５７μ
ｍの絶縁電線を得たＯ
実施例２〜７
第１表に示す配合で、実施１例１と同様にして自己融着
性樹脂組成物を製造し、絶縁電線を得た０比較例１〜４
第１表に示す配合で、実施例１と同様にして自己融着性
樹脂組成物を製造し、絶縁電線を得た。Example 1 The compositions shown in Example 1 in Table 1 were mixed and sufficiently stirred with a mixer. The obtained self-fusing resin composition was pale yellow in color. The obtained self-bonding resin composition was placed on enamel #4m, which was made by sequentially coating a polyesterimide layer and a polyamideimide layer on a copper wire with a diameter of 1.011m, at a furnace temperature of 2.
00″01 Coated and baked at a linear speed of 14 m/min to a film thickness of 57 μm.
Comparative Examples 1 to 7 A self-fusing resin composition was produced in the same manner as in Example 1 with the formulation shown in Table 1, and an insulated wire of m was obtained. 4 A self-bonding resin composition was produced in the same manner as in Example 1 using the formulations shown in Table 1, and an insulated wire was obtained.
得られた絶縁電線を用いて、次のとおり試験を行った。Using the obtained insulated wire, a test was conducted as follows.
外観試験は巻枠に巻いたまま、汚れや傷などを目視によ
り調べた。In the appearance test, the tape was visually inspected for dirt, scratches, etc. while it was still wound on the reel.
融着力は、直径６．４１１１１のマンドレルに絶縁電線
を５０回巻き付けて得られたコイルを加熱硬化させ、こ
れを室温及び８０℃で荷重をかけて融着力を測定した。The fusion strength was measured by heating and curing a coil obtained by winding an insulated wire 50 times around a mandrel having a diameter of 6.41111 mm, applying a load to the coil at room temperature and 80° C., and measuring the fusion strength.
すべり性は、静摩擦試験機を用いて静摩擦係数を測定し
た。The slip property was determined by measuring the coefficient of static friction using a static friction tester.
耐摩耗性は、７０（ｌ荷重をかけてＪＩ８ ０３００３
−１９７６ １０．１に従って測定した。Abrasion resistance is 70 (JI8 03003 with 1 load applied)
-1976 Measured according to 10.1.
第１表に示されるように、実施Ｒ１〜７は良好な融着力
を持ち、かつ耐摩耗性に浸れている。As shown in Table 1, runs R1-7 have good fusing strength and are highly abrasion resistant.
比較例１及び２は、フッ素樹脂で表面コーティングを°
行っていない有機樹脂粉末を添加しており、耐摩耗性及
びすべり性が不充分である。また、比較例３及び４は、
フッ素樹脂で表面コーティングした有機樹脂粉末を過剰
量添加した場合であり、外観が悪くなっている。Comparative Examples 1 and 2 were surface coated with fluororesin.
Organic resin powder is added, which has not been done before, and the abrasion resistance and slip properties are insufficient. In addition, Comparative Examples 3 and 4 are
This is a case where an excessive amount of organic resin powder whose surface is coated with fluororesin is added, resulting in a poor appearance.
以 下 余 白
（発明の効果）
本発明の自己融着性樹脂組成物は、融着性、耐熱性を低
下させることなく、耐摩耗性が大幅に向上している。Margins below (Effects of the Invention) The self-bonding resin composition of the present invention has significantly improved abrasion resistance without deteriorating fusion properties and heat resistance.
Claims (1)
樹脂の混合物と、（ロ）２，２′−（１，３−フエエレ
ン）ビス（２−オキサゾリン）又はその誘導体と、（ハ
）フッ素樹脂で表面コーティングされた平均粒子径２０
μｍ以下の有機樹脂粉末から成り、前記（イ）と（ロ）
の合計量１００重量部に対して（ハ）を０．０１〜１５
重量部添加したものを溶剤に溶解せしめてなる自己融着
性樹脂組成物。(a) Surface coating with phenoxy resin or a mixture of phenoxy resin and epoxy resin, (b) 2,2'-(1,3-phelene)bis(2-oxazoline) or its derivative, and (c) fluororesin. Average particle size 20
Consisting of organic resin powder of micrometers or less, the above (a) and (b)
0.01 to 15 of (c) per 100 parts by weight of the total amount of
A self-fusing resin composition prepared by dissolving the added part by weight in a solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62302049A JP2624490B2 (en) | 1987-11-30 | 1987-11-30 | Self-fusing resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62302049A JP2624490B2 (en) | 1987-11-30 | 1987-11-30 | Self-fusing resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01141948A true JPH01141948A (en) | 1989-06-02 |
| JP2624490B2 JP2624490B2 (en) | 1997-06-25 |
Family
ID=17904296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62302049A Expired - Lifetime JP2624490B2 (en) | 1987-11-30 | 1987-11-30 | Self-fusing resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2624490B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03285915A (en) * | 1990-03-09 | 1991-12-17 | Teijin Ltd | Production of crosslinked resin |
| US5997944A (en) * | 1994-03-15 | 1999-12-07 | Henkel Kommanditgesellschaft Auf Aktien | Flow controllers for powder lacquers |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6291556A (en) * | 1985-10-18 | 1987-04-27 | Showa Electric Wire & Cable Co Ltd | Self-weldable resin composition |
-
1987
- 1987-11-30 JP JP62302049A patent/JP2624490B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6291556A (en) * | 1985-10-18 | 1987-04-27 | Showa Electric Wire & Cable Co Ltd | Self-weldable resin composition |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03285915A (en) * | 1990-03-09 | 1991-12-17 | Teijin Ltd | Production of crosslinked resin |
| US5997944A (en) * | 1994-03-15 | 1999-12-07 | Henkel Kommanditgesellschaft Auf Aktien | Flow controllers for powder lacquers |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2624490B2 (en) | 1997-06-25 |
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