JPH01140878U - - Google Patents
Info
- Publication number
- JPH01140878U JPH01140878U JP3726988U JP3726988U JPH01140878U JP H01140878 U JPH01140878 U JP H01140878U JP 3726988 U JP3726988 U JP 3726988U JP 3726988 U JP3726988 U JP 3726988U JP H01140878 U JPH01140878 U JP H01140878U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor element
- wiring board
- printed wiring
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3726988U JPH01140878U (en:Method) | 1988-03-22 | 1988-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3726988U JPH01140878U (en:Method) | 1988-03-22 | 1988-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140878U true JPH01140878U (en:Method) | 1989-09-27 |
Family
ID=31263849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3726988U Pending JPH01140878U (en:Method) | 1988-03-22 | 1988-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140878U (en:Method) |
-
1988
- 1988-03-22 JP JP3726988U patent/JPH01140878U/ja active Pending