JPH01140697A - Soldering method for printed board - Google Patents
Soldering method for printed boardInfo
- Publication number
- JPH01140697A JPH01140697A JP29747187A JP29747187A JPH01140697A JP H01140697 A JPH01140697 A JP H01140697A JP 29747187 A JP29747187 A JP 29747187A JP 29747187 A JP29747187 A JP 29747187A JP H01140697 A JPH01140697 A JP H01140697A
- Authority
- JP
- Japan
- Prior art keywords
- heated
- soldering
- printed circuit
- printed board
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 22
- 239000006071 cream Substances 0.000 claims abstract description 17
- 238000009835 boiling Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims description 12
- 230000002950 deficient Effects 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 241001230284 Theclini Species 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント基板のはんだ付け方法、特にクリーム
はんだが塗布されたプリント基板を高沸点溶液の蒸気中
で加熱することによりはんだ付けを行う方法に間する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for soldering printed circuit boards, particularly a method for soldering a printed circuit board coated with cream solder by heating it in vapor of a high boiling point solution. in between.
（従来の技術〕
クリームはんだを塗布したプリント基板のはんだ付け方
法としては、コンベアが走行するトンネルの上下部に赤
外線ヒーターを設置゛したりフロー炉で加熱する方法や
、はんだ付け部にレーザー光線を当てて加熱する方法や
、高沸点ｉｉＪ液の蒸気で加熱する方法等がある。(Prior technology) Soldering methods for printed circuit boards coated with cream solder include installing infrared heaters at the top and bottom of the tunnel in which the conveyor runs, heating in a flow furnace, and applying laser beams to the soldering area. There are two methods: heating with water, heating with steam of high boiling point IIJ liquid, etc.
リフロー炉で加熱する方法は、リフロー炉内の温度分布
を均一にすることが難しいためプリント基板全体の均一
加熱ができないばかりか、加熱が赤外線の輻射で行うた
め、電子部品の影となるところは加熱されずはんだ付け
不良を起こすという不都合がある。In the method of heating in a reflow oven, it is difficult to make the temperature distribution inside the reflow oven uniform, so not only is it impossible to uniformly heat the entire printed circuit board, but also the heating is done using infrared radiation, so there are no shadows on the electronic components. This has the disadvantage that it does not heat up and causes soldering defects.
レーザー光線による加熱はプリント基板全体を加熱する
ことができないため、多数の電子部品を搭載したプリン
ト基板のはんだ付けには時間がかかり大量生産には向か
ないものである。Heating with a laser beam cannot heat the entire printed circuit board, so soldering a printed circuit board with many electronic components takes time and is not suitable for mass production.
一方、高沸点溶液の蒸気で加熱する方法（ペーパー・フ
ェイズ・ソルダリング；以下■ＰＳ方法という）は、プ
リント基板を高温となった蒸気中に置いて該蒸気で加熱
するため、プリント基板の均一加熱が容易でしかも全体
を素早く加熱できるという優れた特長を有している。On the other hand, in the method of heating with the vapor of a high-boiling point solution (paper phase soldering; hereinafter referred to as the PS method), the printed circuit board is placed in high-temperature steam and heated by the steam, so that the printed circuit board is evenly distributed. It has the excellent feature of being easy to heat and being able to heat the entire area quickly.
従来の■ＰＳ方法では、クリームはんだを塗布したプリ
ント基板を直接蒸気中に挿入して蒸気をプリント基板全
面ばかりでなく全ての電子部品にまで接触させることに
より加熱を行っていたものである。In the conventional PS method, a printed circuit board coated with cream solder is directly inserted into steam, and the steam is brought into contact with not only the entire surface of the printed circuit board but also all electronic components, thereby heating the circuit board.
ところで、高沸点溶液の蒸気は熱伝達係数が大きいため
加熱が早く行えるものであるが、クリームはんだを塗布
したプリント基板においては、この熱伝達係数の大きい
ことがかえって災いとなり、はんだ付け不良を発生させ
ることがあった。該はんだ付け不良とは、第４図に示す
ようにプリント基板のはんだ部には、はんだが付かず、
リード部だけにはんだが付着してしまうＪ型リード付き
電子部品２におけるウィッキング現象であり、また第５
図に示すようにチップ部品３が立上ってしまうマンハッ
タン現象である。By the way, the vapor of a high boiling point solution has a large heat transfer coefficient, so it can be heated quickly, but for printed circuit boards coated with cream solder, this large heat transfer coefficient can actually be a disaster, causing soldering defects. There were times when I was forced to do so. As shown in Figure 4, this soldering failure means that solder does not stick to the solder parts of the printed circuit board.
This is a wicking phenomenon in electronic component 2 with a J-type lead, in which solder adheres only to the lead part, and the fifth
As shown in the figure, this is a Manhattan phenomenon in which the chip component 3 stands up.
本発明者らが従来のｖＰＳ方法における上記問題点につ
いて、その原因を追求してみたところ、熱伝達係数の大
きい高沸点溶液の蒸気は被加熱物を急加熱し過ぎるため
であること、加熱直後では容量の大きい樹脂材料上のは
んだ付け部よりも容量の小さい電子部品のリード部の方
′が先に加熱されるため、溶融したはんだは先にはんだ
付け温度まで加熱された電子部品のリード部だけに付着
してしまいウィッキング現象を起こしてしまうものであ
る。また、チップ部品では、クリニムはんだが急加熱さ
れるため瞬時に溶融したはんだの表面張力が、小さくて
軽いチップ部品を一方に引っ張りチップ部品を立上がら
せるというマンハッタン現象を起こしてしまうものであ
る。When the present inventors investigated the cause of the above-mentioned problems in the conventional vPS method, they found that the vapor of the high-boiling point solution with a large heat transfer coefficient heated the heated object too rapidly, and that In this case, the lead part of the electronic component with a smaller capacitance is heated earlier than the soldered part on the resin material with a larger capacitance, so the molten solder is heated first to the lead part of the electronic component that is heated to the soldering temperature. It sticks to the surface of the surface and causes the wicking phenomenon. In addition, in the case of chip components, because the Clini solder is heated rapidly, the surface tension of the instantly melted solder pulls the small, light chip components to one side, causing the Manhattan phenomenon, where the chip components stand up.
そこで本発明者らは、リード部だけを先に加熱したり、
クリームはんだを瞬時に溶解させないようにすれば上記
はんだ付σ不良を起こさせないことに着目して本発明を
完成させた。Therefore, the present inventors heated only the lead part first,
The present invention was completed by focusing on the fact that the soldering σ defect described above can be prevented by preventing cream solder from melting instantaneously.
本発明の特徴とするところは、プリント基板にクリーム
はんだを塗布後、クリームはんだ塗布面を遮蔽物で囲っ
てから高沸点溶液の蒸気で加熱するプリント基板のはん
だ付け方法である。The feature of the present invention is a printed circuit board soldering method in which cream solder is applied to a printed circuit board, the cream solder coated surface is surrounded with a shield, and then heated with vapor of a high boiling point solution.
ＶＰＳ方法においてプリント基板のクリームはんだ塗布
面を遮蔽物で囲っておくと、電子部品のはんだ付け部は
高沸点蒸気と直接接触することはなくなり、急加熱され
ずにすむ。In the VPS method, if the cream solder applied surface of the printed circuit board is surrounded by a shield, the soldered parts of electronic components will not come into direct contact with high boiling point vapor, and will not be heated rapidly.
以下、図面に基づいて本発明を説明する。 Hereinafter, the present invention will be explained based on the drawings.
プリント基板ｌに搭載されたＪ型リード付き電子部品２
やチップ部品３のはんだ付け部にはクリームはんだ４が
塗布されており、該クリームはんだ塗布面５は遮蔽物６
で囲まれている。Electronic component 2 with J type lead mounted on printed circuit board l
Cream solder 4 is applied to the soldered portions of chip components 3, and the cream solder application surface 5 is covered with a shield 6.
surrounded by
実施例に示す遮蔽物とは一つのＪ型リード付き電子部品
やいくつかまとまった電子部品を囲うことのできる箱状
のものである。プリント基板に搭載された電子部品を遮
蔽物で囲ってから該プリント基板を■ＰＳ装置７の高沸
点溶液の蒸気８で加熱する。この時、該蒸気は電子部品
を直接加熱せず、プリント基板だけを加熱するようにな
る。つまり、電子部品のはんだ付け部はプリント基板が
加熱されることによる熱伝導で加熱されるわけである。The shield shown in the embodiment is a box-shaped object that can surround one electronic component with a J-type lead or a group of electronic components. After surrounding the electronic components mounted on the printed circuit board with a shield, the printed circuit board is heated with vapor 8 of a high boiling point solution from the PS device 7. At this time, the steam does not directly heat the electronic components, but only the printed circuit board. In other words, the soldered portion of the electronic component is heated by heat conduction caused by the heating of the printed circuit board.
実施例では、電子部品を小さな遮蔽物で囲っているが、
プリント基板全体を大きな遮蔽物で囲うこともできる。In the example, the electronic components are surrounded by a small shield,
It is also possible to surround the entire printed circuit board with a large shield.
小さな遮蔽物を使用するのは、プリント基板の一側にコ
ネクター９のようなものが設置されていて全体を大きな
遮蔽物で囲うことができない場合である。A small shield is used when something like the connector 9 is installed on one side of a printed circuit board and it is not possible to surround the entire board with a large shield.
本発明によれば、クリームはんだ塗布面を遮蔽物で囲っ
ているため、高温となった蒸気が直接はんだ付け部を加
熱せず、プリント基板からの間接加熱となる。従って、
はんだ付け部は急加熱されることがなく、ウィッキング
現象やマンハッタン現象等のはんだ付け不良が皆無とな
り、信頼あるはんだ付け部が得られるものである。According to the present invention, since the cream solder application surface is surrounded by a shield, the high-temperature steam does not directly heat the soldering part, but indirectly heats the printed circuit board. Therefore,
The soldered part is not heated rapidly, there is no soldering defect such as wicking phenomenon or Manhattan phenomenon, and a reliable soldered part can be obtained.
第１図はプリント基板のクリームはんだ付は面を遮蔽物
で囲う説明図、第２図は要部拡大断面図、第３図はプリ
ント基板を高沸点溶液の蒸気で加熱する説明図、第４図
はＪ型リード付き電子部品におけるウィッキング現象を
説明する図、第５図はチップ部品におけるマンハッタン
現象を説明する図である。Figure 1 is an illustration of cream soldering a printed circuit board by surrounding the surface with a shield, Figure 2 is an enlarged sectional view of the main part, Figure 3 is an illustration of heating the printed circuit board with vapor of a high boiling point solution, and Figure 4 The figure is a diagram for explaining the wicking phenomenon in an electronic component with a J-type lead, and FIG. 5 is a diagram for explaining the Manhattan phenomenon in a chip component.
Claims (1)
の蒸気で加熱することを特徴とするプリント基板のはん
だ付け方法。[Claims:] A method for soldering a printed circuit board, which comprises applying cream solder to a printed circuit board, surrounding the surface to which the cream solder is applied with a shield, and then heating it with vapor of a high boiling point solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29747187A JPH01140697A (en) | 1987-11-27 | 1987-11-27 | Soldering method for printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29747187A JPH01140697A (en) | 1987-11-27 | 1987-11-27 | Soldering method for printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140697A true JPH01140697A (en) | 1989-06-01 |
Family
ID=17846925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29747187A Pending JPH01140697A (en) | 1987-11-27 | 1987-11-27 | Soldering method for printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140697A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1870190A1 (en) * | 2006-06-22 | 2007-12-26 | Linde Aktiengesellschaft | Vapour phase soldering of electronic components having a coating for protection against overheating; Electronic component with a coating for protection against overheating |
-
1987
- 1987-11-27 JP JP29747187A patent/JPH01140697A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1870190A1 (en) * | 2006-06-22 | 2007-12-26 | Linde Aktiengesellschaft | Vapour phase soldering of electronic components having a coating for protection against overheating; Electronic component with a coating for protection against overheating |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Lee | Optimizing the reflow profile via defect mechanism analysis | |
| KR880010645A (en) | Bulk soldering reflow apparatus and method | |
| JP2014197631A5 (en) | ||
| JPH01140697A (en) | Soldering method for printed board | |
| JP7198583B2 (en) | LASER SOLDERING METHOD AND LASER SOLDERING APPARATUS | |
| JPS6228069A (en) | Laser beam soldering method | |
| Esfandyari et al. | Energy efficiency investigation on high-pressure convection reflow soldering in electronics production | |
| JPH05245624A (en) | Device and method for reflowing solder | |
| US20070181640A1 (en) | Lead-free solder reworking system and method thereof | |
| JP2538130B2 (en) | Optical beam soldering method | |
| JPH022560Y2 (en) | ||
| JP2006222170A (en) | Method of soldering | |
| JPS59150665A (en) | Soldering method | |
| JP2007096134A (en) | Manufacturing equipment and method for printed circuit board | |
| JPH03114288A (en) | Soldering of semiconductor device by infrared heating | |
| JPS61289967A (en) | Continuous heater | |
| JPS54107257A (en) | Semiconductor device mounting method | |
| RU1816583C (en) | Method of soldering radioelectronic elements to printing circuit boards by light beam with soldering temperature controlling | |
| Flanagan et al. | Finite element thermal modelling of the laser soldering process | |
| JPH0575197B2 (en) | ||
| Obenland | Pin grid arrays. Final report | |
| JPS6037284A (en) | Laser joining method | |
| JPH0444391A (en) | Reflow soldering | |
| JPS63286271A (en) | Vapor phase reflowing device | |
| JPH01144582A (en) | Manufacture of hybrid integrated circuit |