JPH01140620U - - Google Patents
Info
- Publication number
- JPH01140620U JPH01140620U JP3781088U JP3781088U JPH01140620U JP H01140620 U JPH01140620 U JP H01140620U JP 3781088 U JP3781088 U JP 3781088U JP 3781088 U JP3781088 U JP 3781088U JP H01140620 U JPH01140620 U JP H01140620U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- mounting hole
- positioning surface
- positioning
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims 2
Landscapes
- Moving Of The Head For Recording And Reproducing By Optical Means (AREA)
- Optical Head (AREA)
Description
第１図は本考案に係る半導体レーザの取付け機
構の第１実施例を示す断面図、第２図は半導体レ
ーザがシヤーシに固定される状態を示す斜視図、
第３図は第１実施例においてシヤーシに形成され
た取付け穴を示す正面図、第４図は本考案の第２
実施例を示す取付け穴の正面図、第５図は本考案
の第３実施例を示す断面図、第６図は従来の半導
体レーザの取付け機構を示す断面図、第７図は半
導体レーザの位置決め部を拡大して示す断面図で
ある。
１…半導体レーザ、２ａ…フランジ、Ａ…フラ
ンジの前面、Ｂ…フランジの外周面、１０…シヤ
ーシ、２０…取付け穴、２２ａ，３４…第１の位
置決め面、２３，３２…第２の位置決め面、２４
，３３…凹部。
FIG. 1 is a sectional view showing a first embodiment of a semiconductor laser mounting mechanism according to the present invention, and FIG. 2 is a perspective view showing a state in which the semiconductor laser is fixed to a chassis.
Figure 3 is a front view showing the mounting holes formed in the chassis in the first embodiment, and Figure 4 is the second embodiment of the present invention.
A front view of the mounting hole showing the embodiment, FIG. 5 is a sectional view showing the third embodiment of the present invention, FIG. 6 is a sectional view showing the conventional semiconductor laser mounting mechanism, and FIG. 7 is the positioning of the semiconductor laser. FIG. DESCRIPTION OF SYMBOLS 1... Semiconductor laser, 2a... Flange, A... Front surface of flange, B... Outer peripheral surface of flange, 10... Chassis, 20... Mounting hole, 22a, 34... First positioning surface, 23, 32... Second positioning surface , 24
, 33... recess.
Claims (1)
ザが挿入されており、取付け穴の内方には半導体
レーザの基部フランジの外周面が挿入される第１
の位置決め面と、取付け穴の内方にて半導体レー
ザの発光光軸に直交して形成され且つ半導体レー
ザの基部フランジの前面が当接される第２の位置
決め面とが形成されており且つ、上記第１の位置
決め面と第２の位置決め面とが凹部によつて隔絶
されて成る光学装置における半導体レーザの取付
け機構。 ２ 第１の位置決め面は取付け穴の内周面から内
方へ突出した突起の先端面に形成されており且つ
、凹部は第１の位置決め面に連続し且つ第２の位
置決め面よりも取付け穴の内方へ延びて形成され
ている請求項１記載の光学装置における半導体レ
ーザの取付け機構。[Claims for Utility Model Registration] 1. A semiconductor laser is inserted into a mounting hole formed in the chassis, and the outer peripheral surface of the base flange of the semiconductor laser is inserted into the mounting hole.
and a second positioning surface that is formed inside the mounting hole and perpendicular to the light emission axis of the semiconductor laser and that is in contact with the front surface of the base flange of the semiconductor laser, and A mounting mechanism for a semiconductor laser in an optical device, wherein the first positioning surface and the second positioning surface are separated by a recess. 2. The first positioning surface is formed on the tip surface of the protrusion that protrudes inward from the inner peripheral surface of the mounting hole, and the recess is continuous with the first positioning surface and is closer to the mounting hole than the second positioning surface. 2. A mounting mechanism for a semiconductor laser in an optical device according to claim 1, which is formed to extend inwardly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3781088U JPH01140620U (en) | 1988-03-22 | 1988-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3781088U JPH01140620U (en) | 1988-03-22 | 1988-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140620U true JPH01140620U (en) | 1989-09-26 |
Family
ID=31264386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3781088U Pending JPH01140620U (en) | 1988-03-22 | 1988-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140620U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244430A (en) * | 1993-02-16 | 1994-09-02 | Fuji Electric Co Ltd | Semiconductor device |
| JPH0684517U (en) * | 1993-04-22 | 1994-12-02 | 株式会社三協精機製作所 | Optical pickup device |
| JP2020057760A (en) * | 2018-10-01 | 2020-04-09 | 創威光電股▲ふん▼有限公司 | Optical sub-assembly module and cap thereof |
-
1988
- 1988-03-22 JP JP3781088U patent/JPH01140620U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244430A (en) * | 1993-02-16 | 1994-09-02 | Fuji Electric Co Ltd | Semiconductor device |
| JPH0684517U (en) * | 1993-04-22 | 1994-12-02 | 株式会社三協精機製作所 | Optical pickup device |
| JP2020057760A (en) * | 2018-10-01 | 2020-04-09 | 創威光電股▲ふん▼有限公司 | Optical sub-assembly module and cap thereof |