JPH01139430U - - Google Patents

Info

Publication number

JPH01139430U

JPH01139430U JP3647188U JP3647188U JPH01139430U JP H01139430 U JPH01139430 U JP H01139430U JP 3647188 U JP3647188 U JP 3647188U JP 3647188 U JP3647188 U JP 3647188U JP H01139430 U JPH01139430 U JP H01139430U

Authority

JP

Japan

Prior art keywords

integrated circuit

circuit device

contacting

bonding

directly connected

Prior art date

1988-03-18

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000523 sample Substances 0.000 claims 1
• 229910052782 aluminium Inorganic materials 0.000 description 2
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
• 230000004888 barrier function Effects 0.000 description 1
• 238000009713 electroplating Methods 0.000 description 1
• 239000011229 interlayer Substances 0.000 description 1
• 239000010410 layer Substances 0.000 description 1
• 229910052751 metal Inorganic materials 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 230000001681 protective effect Effects 0.000 description 1
• 239000004065 semiconductor Substances 0.000 description 1
• 239000000758 substrate Substances 0.000 description 1