JPH01139429U - - Google Patents
Info
- Publication number
- JPH01139429U JPH01139429U JP1988034631U JP3463188U JPH01139429U JP H01139429 U JPH01139429 U JP H01139429U JP 1988034631 U JP1988034631 U JP 1988034631U JP 3463188 U JP3463188 U JP 3463188U JP H01139429 U JPH01139429 U JP H01139429U
- Authority
- JP
- Japan
- Prior art keywords
- component
- substrate
- board
- main surface
- surplus space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 4
- 238000001514 detection method Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988034631U JPH01139429U (US20030220297A1-20031127-C00074.png) | 1988-03-16 | 1988-03-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988034631U JPH01139429U (US20030220297A1-20031127-C00074.png) | 1988-03-16 | 1988-03-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01139429U true JPH01139429U (US20030220297A1-20031127-C00074.png) | 1989-09-22 |
Family
ID=31261331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988034631U Pending JPH01139429U (US20030220297A1-20031127-C00074.png) | 1988-03-16 | 1988-03-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01139429U (US20030220297A1-20031127-C00074.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023112366A1 (ja) * | 2021-12-17 | 2023-06-22 | パナソニックIpマネジメント株式会社 | 実装基板 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5973740A (ja) * | 1982-10-19 | 1984-04-26 | Nippon Denso Co Ltd | 化学及び物理量電気変換装置 |
-
1988
- 1988-03-16 JP JP1988034631U patent/JPH01139429U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5973740A (ja) * | 1982-10-19 | 1984-04-26 | Nippon Denso Co Ltd | 化学及び物理量電気変換装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023112366A1 (ja) * | 2021-12-17 | 2023-06-22 | パナソニックIpマネジメント株式会社 | 実装基板 |