JPH01139427U - - Google Patents
Info
- Publication number
- JPH01139427U JPH01139427U JP3563388U JP3563388U JPH01139427U JP H01139427 U JPH01139427 U JP H01139427U JP 3563388 U JP3563388 U JP 3563388U JP 3563388 U JP3563388 U JP 3563388U JP H01139427 U JPH01139427 U JP H01139427U
- Authority
- JP
- Japan
- Prior art keywords
- cover
- window
- solder
- top plate
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 3
- 229910000679 solder Inorganic materials 0.000 claims 3
- 230000032258 transport Effects 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- 230000001590 oxidative effect Effects 0.000 claims 2
- 239000008188 pellet Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3563388U JPH01139427U (enrdf_load_stackoverflow) | 1988-03-16 | 1988-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3563388U JPH01139427U (enrdf_load_stackoverflow) | 1988-03-16 | 1988-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01139427U true JPH01139427U (enrdf_load_stackoverflow) | 1989-09-22 |
Family
ID=31262276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3563388U Pending JPH01139427U (enrdf_load_stackoverflow) | 1988-03-16 | 1988-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01139427U (enrdf_load_stackoverflow) |
-
1988
- 1988-03-16 JP JP3563388U patent/JPH01139427U/ja active Pending