JPH01139401U - - Google Patents
Info
- Publication number
- JPH01139401U JPH01139401U JP3618188U JP3618188U JPH01139401U JP H01139401 U JPH01139401 U JP H01139401U JP 3618188 U JP3618188 U JP 3618188U JP 3618188 U JP3618188 U JP 3618188U JP H01139401 U JPH01139401 U JP H01139401U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- resistive film
- opening
- silver
- membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
第１図ないし第３図は本考案の実施例に係り、
第１図は抵抗膜接続構造の一実施例を示す縦断側
面図、第２図はその一部破断平面図であり、第３
図はその変形例を示す一部破断平面図である。ま
た、第４図および第５図のそれぞれは、抵抗膜接
続構造の従来例を示す縦断側面図である、
図における符号１は樹脂回路基板、２は配線パ
ターン、３は絶縁膜、４は開口部、５は接続電極
、６は抵抗膜である。
Figures 1 to 3 relate to embodiments of the present invention,
FIG. 1 is a longitudinal sectional side view showing one embodiment of a resistive film connection structure, FIG. 2 is a partially cutaway plan view thereof, and FIG.
The figure is a partially cutaway plan view showing a modification thereof. 4 and 5 are vertical side views showing conventional examples of resistive film connection structures. In the figures, 1 is a resin circuit board, 2 is a wiring pattern, 3 is an insulating film, and 4 is an opening. 5 is a connection electrode, and 6 is a resistive film.
Claims (1)
ンの端部と、これらの端部間とを覆う絶縁膜を形
成し、かつ、この絶縁膜の前記端部位置それぞれ
に開口部を設けるとともに、 この開口部それぞれに前記端部と導通する銀系
材料からなる接続電極を配設し、かつ、これらの
接続電極を互いに抵抗膜で接続してなることを特
徴とする抵抗膜接続構造。[Claims for Utility Model Registration] An insulating film is formed to cover the ends of a pair of wiring patterns that are formed facing each other and between these ends, and the insulating film is provided at each of the end positions. A resistor characterized in that an opening is provided, a connecting electrode made of a silver-based material is provided in each of the openings and conductive to the end, and these connecting electrodes are connected to each other by a resistive film. Membrane-connected structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036181U JPH0631683Y2 (en) | 1988-03-17 | 1988-03-17 | Resistive film connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036181U JPH0631683Y2 (en) | 1988-03-17 | 1988-03-17 | Resistive film connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01139401U true JPH01139401U (en) | 1989-09-22 |
| JPH0631683Y2 JPH0631683Y2 (en) | 1994-08-22 |
Family
ID=31262797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988036181U Expired - Lifetime JPH0631683Y2 (en) | 1988-03-17 | 1988-03-17 | Resistive film connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0631683Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007242916A (en) * | 2006-03-09 | 2007-09-20 | Toppan Printing Co Ltd | Printed wiring board, and manufacturing method therefor |
| JP2011129772A (en) * | 2009-12-18 | 2011-06-30 | Fujikura Ltd | Printed wiring board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4886342U (en) * | 1972-01-24 | 1973-10-19 | ||
| JPS5436291A (en) * | 1977-07-20 | 1979-03-16 | Asahi Chem Ind Co Ltd | Preparation of theobromine derivative |
| JPS59145056U (en) * | 1983-03-18 | 1984-09-28 | カシオ計算機株式会社 | printed wiring board |
| JPS61180496A (en) * | 1985-02-06 | 1986-08-13 | 住友電気工業株式会社 | Formation of circuit board |
| JPS63314888A (en) * | 1987-06-17 | 1988-12-22 | Cmk Corp | Printed wiring board and manufacture thereof |
-
1988
- 1988-03-17 JP JP1988036181U patent/JPH0631683Y2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4886342U (en) * | 1972-01-24 | 1973-10-19 | ||
| JPS5436291A (en) * | 1977-07-20 | 1979-03-16 | Asahi Chem Ind Co Ltd | Preparation of theobromine derivative |
| JPS59145056U (en) * | 1983-03-18 | 1984-09-28 | カシオ計算機株式会社 | printed wiring board |
| JPS61180496A (en) * | 1985-02-06 | 1986-08-13 | 住友電気工業株式会社 | Formation of circuit board |
| JPS63314888A (en) * | 1987-06-17 | 1988-12-22 | Cmk Corp | Printed wiring board and manufacture thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007242916A (en) * | 2006-03-09 | 2007-09-20 | Toppan Printing Co Ltd | Printed wiring board, and manufacturing method therefor |
| JP2011129772A (en) * | 2009-12-18 | 2011-06-30 | Fujikura Ltd | Printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0631683Y2 (en) | 1994-08-22 |