JPH01139367U - - Google Patents
Info
- Publication number
- JPH01139367U JPH01139367U JP3578788U JP3578788U JPH01139367U JP H01139367 U JPH01139367 U JP H01139367U JP 3578788 U JP3578788 U JP 3578788U JP 3578788 U JP3578788 U JP 3578788U JP H01139367 U JPH01139367 U JP H01139367U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- metal plate
- substrate
- communication path
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3578788U JPH01139367U (da) | 1988-03-17 | 1988-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3578788U JPH01139367U (da) | 1988-03-17 | 1988-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01139367U true JPH01139367U (da) | 1989-09-22 |
Family
ID=31262424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3578788U Pending JPH01139367U (da) | 1988-03-17 | 1988-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01139367U (da) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62108594A (ja) * | 1985-11-06 | 1987-05-19 | 株式会社日立製作所 | 混成集積回路 |
-
1988
- 1988-03-17 JP JP3578788U patent/JPH01139367U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62108594A (ja) * | 1985-11-06 | 1987-05-19 | 株式会社日立製作所 | 混成集積回路 |