JPH01138750U - - Google Patents
Info
- Publication number
- JPH01138750U JPH01138750U JP1988035572U JP3557288U JPH01138750U JP H01138750 U JPH01138750 U JP H01138750U JP 1988035572 U JP1988035572 U JP 1988035572U JP 3557288 U JP3557288 U JP 3557288U JP H01138750 U JPH01138750 U JP H01138750U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- conductive
- substrate
- wiring
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 238000003491 array Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988035572U JPH01138750U (US06534493-20030318-C00166.png) | 1988-03-17 | 1988-03-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988035572U JPH01138750U (US06534493-20030318-C00166.png) | 1988-03-17 | 1988-03-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01138750U true JPH01138750U (US06534493-20030318-C00166.png) | 1989-09-21 |
Family
ID=31262217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988035572U Pending JPH01138750U (US06534493-20030318-C00166.png) | 1988-03-17 | 1988-03-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01138750U (US06534493-20030318-C00166.png) |
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1988
- 1988-03-17 JP JP1988035572U patent/JPH01138750U/ja active Pending