JPH01137595U - - Google Patents

Info

Publication number
JPH01137595U
JPH01137595U JP3346288U JP3346288U JPH01137595U JP H01137595 U JPH01137595 U JP H01137595U JP 3346288 U JP3346288 U JP 3346288U JP 3346288 U JP3346288 U JP 3346288U JP H01137595 U JPH01137595 U JP H01137595U
Authority
JP
Japan
Prior art keywords
heat sink
heating element
substrate
attached
ventilation hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3346288U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3346288U priority Critical patent/JPH01137595U/ja
Publication of JPH01137595U publication Critical patent/JPH01137595U/ja
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す斜視図、第2
図は同上の作用説明のための断面図、第3図は従
来のヒートシンクに取り付けられた発熱素子を示
す斜視図、第4図は同上の作用説明図である。 1……ヒートシンク、2……発熱素子、3……
ヒートシンクの下面開口、4……基板、5……通
気用孔。
Fig. 1 is a perspective view showing one embodiment of the present invention;
FIG. 3 is a perspective view showing a heat generating element attached to a conventional heat sink, and FIG. 4 is a diagram illustrating the operation of the same. 1...Heat sink, 2...Heating element, 3...
Opening on the lower surface of the heat sink, 4... board, 5... ventilation hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上端部及び下面に開口を有する略筒状のヒート
シンクの側壁部内面に発熱素子を取り付け、前記
ヒートシンクの下面開口を基板に開口された通気
用孔に一致させるようにして基板の上面にヒート
シンクを取り付けて成ることを特徴とする発熱素
子の放熱構造。
A heating element is attached to the inner surface of the side wall of a substantially cylindrical heat sink having openings at the upper end and lower surface, and the heat sink is attached to the upper surface of the substrate so that the lower opening of the heat sink matches the ventilation hole opened in the substrate. A heat dissipation structure for a heating element characterized by comprising:
JP3346288U 1988-03-14 1988-03-14 Pending JPH01137595U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3346288U JPH01137595U (en) 1988-03-14 1988-03-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3346288U JPH01137595U (en) 1988-03-14 1988-03-14

Publications (1)

Publication Number Publication Date
JPH01137595U true JPH01137595U (en) 1989-09-20

Family

ID=31260142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3346288U Pending JPH01137595U (en) 1988-03-14 1988-03-14

Country Status (1)

Country Link
JP (1) JPH01137595U (en)

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