JPH01137538U - - Google Patents
Info
- Publication number
- JPH01137538U JPH01137538U JP1988033936U JP3393688U JPH01137538U JP H01137538 U JPH01137538 U JP H01137538U JP 1988033936 U JP1988033936 U JP 1988033936U JP 3393688 U JP3393688 U JP 3393688U JP H01137538 U JPH01137538 U JP H01137538U
- Authority
- JP
- Japan
- Prior art keywords
- package
- protrusion
- semiconductor element
- metal base
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005219 brazing Methods 0.000 claims 2
- 229910001080 W alloy Inorganic materials 0.000 claims 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988033936U JPH01137538U (US07223432-20070529-C00017.png) | 1988-03-15 | 1988-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988033936U JPH01137538U (US07223432-20070529-C00017.png) | 1988-03-15 | 1988-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01137538U true JPH01137538U (US07223432-20070529-C00017.png) | 1989-09-20 |
Family
ID=31260657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988033936U Pending JPH01137538U (US07223432-20070529-C00017.png) | 1988-03-15 | 1988-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01137538U (US07223432-20070529-C00017.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS613663A (ja) * | 1984-06-16 | 1986-01-09 | Narumi China Corp | 金属部材の鑞付け前処理方法 |
| JPS6252949A (ja) * | 1985-08-30 | 1987-03-07 | Nec Corp | 積層型セラミツクパツケ−ジ |
-
1988
- 1988-03-15 JP JP1988033936U patent/JPH01137538U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS613663A (ja) * | 1984-06-16 | 1986-01-09 | Narumi China Corp | 金属部材の鑞付け前処理方法 |
| JPS6252949A (ja) * | 1985-08-30 | 1987-03-07 | Nec Corp | 積層型セラミツクパツケ−ジ |
