JPH01137525U - - Google Patents
Info
- Publication number
- JPH01137525U JPH01137525U JP3304588U JP3304588U JPH01137525U JP H01137525 U JPH01137525 U JP H01137525U JP 3304588 U JP3304588 U JP 3304588U JP 3304588 U JP3304588 U JP 3304588U JP H01137525 U JPH01137525 U JP H01137525U
- Authority
- JP
- Japan
- Prior art keywords
- wafer support
- semiconductor wafer
- wafer
- gas
- supply plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 1
Description
第1図〜第3図はこの考案の一実施例によるウ
エハ支持治具を示す平面図、側面図および正面図
、第4図は第1図の―線における断面図、第
5図は第1図の―線における断面図、第6図
はこの考案のウエハ支持治具を用いた生成炉の断
面図、第7図〜第9図は従来のウエハ支持治具を
示す平面図、側面図および正面図、第10図は従
来のウエハ支持治具を用いた生成炉の断面図であ
る。
図において、1はウエハ支持棒、2はウエハ支
持溝、3はガス供給板、4は配管、5はガス導入
口、6は半導体ウエハ、8は多孔質板、10はプ
ロセスチユーブ、11はヒーター、12は遮蔽板
、13はローダーである。なお、図中、同一符号
は同一、または相当部分を示す。
1 to 3 are a plan view, a side view, and a front view showing a wafer support jig according to an embodiment of the invention, FIG. 4 is a cross-sectional view taken along the line -- in FIG. 1, and FIG. 6 is a sectional view of a production furnace using the wafer support jig of this invention, and FIGS. 7 to 9 are plan views, side views, and side views of conventional wafer support jig. The front view and FIG. 10 are cross-sectional views of a production furnace using a conventional wafer support jig. In the figure, 1 is a wafer support rod, 2 is a wafer support groove, 3 is a gas supply plate, 4 is a pipe, 5 is a gas inlet, 6 is a semiconductor wafer, 8 is a porous plate, 10 is a process tube, and 11 is a heater , 12 is a shielding plate, and 13 is a loader. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
ウエハ支持部に支持される半導体ウエハと対向す
るように配置され、半導体ウエハに対向する部分
にガスを出す穴を有するガス供給板と、このガス
供給板にガスを送るための配管とを備えたことを
特徴とするウエハ支持治具。 A wafer support part that supports a semiconductor wafer; a gas supply plate that is arranged to face the semiconductor wafer supported by the wafer support part and has a hole for releasing gas in a portion facing the semiconductor wafer; and this gas supply plate. A wafer support jig characterized by being equipped with piping for sending gas to.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3304588U JPH01137525U (en) | 1988-03-11 | 1988-03-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3304588U JPH01137525U (en) | 1988-03-11 | 1988-03-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01137525U true JPH01137525U (en) | 1989-09-20 |
Family
ID=31259680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3304588U Pending JPH01137525U (en) | 1988-03-11 | 1988-03-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01137525U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012015476A (en) * | 2010-06-30 | 2012-01-19 | Samsung Mobile Display Co Ltd | Apparatus for processing substrate |
-
1988
- 1988-03-11 JP JP3304588U patent/JPH01137525U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012015476A (en) * | 2010-06-30 | 2012-01-19 | Samsung Mobile Display Co Ltd | Apparatus for processing substrate |
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