JPH01137525U - - Google Patents

Info

Publication number
JPH01137525U
JPH01137525U JP3304588U JP3304588U JPH01137525U JP H01137525 U JPH01137525 U JP H01137525U JP 3304588 U JP3304588 U JP 3304588U JP 3304588 U JP3304588 U JP 3304588U JP H01137525 U JPH01137525 U JP H01137525U
Authority
JP
Japan
Prior art keywords
wafer support
semiconductor wafer
wafer
gas
supply plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3304588U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3304588U priority Critical patent/JPH01137525U/ja
Publication of JPH01137525U publication Critical patent/JPH01137525U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図〜第3図はこの考案の一実施例によるウ
エハ支持治具を示す平面図、側面図および正面図
、第4図は第1図の―線における断面図、第
5図は第1図の―線における断面図、第6図
はこの考案のウエハ支持治具を用いた生成炉の断
面図、第7図〜第9図は従来のウエハ支持治具を
示す平面図、側面図および正面図、第10図は従
来のウエハ支持治具を用いた生成炉の断面図であ
る。 図において、1はウエハ支持棒、2はウエハ支
持溝、3はガス供給板、4は配管、5はガス導入
口、6は半導体ウエハ、8は多孔質板、10はプ
ロセスチユーブ、11はヒーター、12は遮蔽板
、13はローダーである。なお、図中、同一符号
は同一、または相当部分を示す。
1 to 3 are a plan view, a side view, and a front view showing a wafer support jig according to an embodiment of the invention, FIG. 4 is a cross-sectional view taken along the line -- in FIG. 1, and FIG. 6 is a sectional view of a production furnace using the wafer support jig of this invention, and FIGS. 7 to 9 are plan views, side views, and side views of conventional wafer support jig. The front view and FIG. 10 are cross-sectional views of a production furnace using a conventional wafer support jig. In the figure, 1 is a wafer support rod, 2 is a wafer support groove, 3 is a gas supply plate, 4 is a pipe, 5 is a gas inlet, 6 is a semiconductor wafer, 8 is a porous plate, 10 is a process tube, and 11 is a heater , 12 is a shielding plate, and 13 is a loader. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ウエハを支持するウエハ支持部と、この
ウエハ支持部に支持される半導体ウエハと対向す
るように配置され、半導体ウエハに対向する部分
にガスを出す穴を有するガス供給板と、このガス
供給板にガスを送るための配管とを備えたことを
特徴とするウエハ支持治具。
A wafer support part that supports a semiconductor wafer; a gas supply plate that is arranged to face the semiconductor wafer supported by the wafer support part and has a hole for releasing gas in a portion facing the semiconductor wafer; and this gas supply plate. A wafer support jig characterized by being equipped with piping for sending gas to.
JP3304588U 1988-03-11 1988-03-11 Pending JPH01137525U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3304588U JPH01137525U (en) 1988-03-11 1988-03-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3304588U JPH01137525U (en) 1988-03-11 1988-03-11

Publications (1)

Publication Number Publication Date
JPH01137525U true JPH01137525U (en) 1989-09-20

Family

ID=31259680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3304588U Pending JPH01137525U (en) 1988-03-11 1988-03-11

Country Status (1)

Country Link
JP (1) JPH01137525U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012015476A (en) * 2010-06-30 2012-01-19 Samsung Mobile Display Co Ltd Apparatus for processing substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012015476A (en) * 2010-06-30 2012-01-19 Samsung Mobile Display Co Ltd Apparatus for processing substrate

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