JPH01137043A - Heat-insulating board for building and manufacture thereof - Google Patents

Abstract

PURPOSE: To easily provide a heat insulating board capable of simplifying heat insulation execution by laminating a protective layer using a caking additive made of a resin or the resin and cement at least on one face of a heat insulating layer made of a plate-like resin foam body, and forming an aggregate layer on the surface of the protective layer. CONSTITUTION: A protective layer 2 using a caking additive made of a resin or the resin and cement is integrally laminated at least on one face of a heat insulating layer 1 made of a plate-like resin foam body. Fine aggregates 31 are sprayed on the surface of the protective layer 2 to form an aggregate layer 3. Since the aggregate layer 3 is provided on the surface of a backing at the time of heat insulation execution, the impregnation finish of mortar or panels can be simply made.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a novel architectural insulation board used for insulating walls, floors, roofs, etc. of architectural structures, and an effective manufacturing method thereof. It is something.

(Conventional technology) Recently, in order to save energy, building structures have been equipped with wall surfaces,
Insulation is now being installed on floors, rooftops, and roofs. Architectural boards used for such insulation construction include: ■ Resin foam boards such as polystyrene, polyurethane, and polyethylene, ■ Fiber boards, rock wool boards, perlite fiber boards, and glass fiber boards, ■ Mortar insulation boards, perlite asphalt mortar. Boards and mortar boards mixed with lightweight aggregate, ■
Heat insulation boards from ■ to ■ above and gypsum board, plywood, wood wool cement board, Keikal board, flexible board, colored iron board, etc. are crimped together using an adhesive using a press or roll method, or those made of these boards Injecting resin between them and foaming them to form an integrated structure has been adopted.

(Problem to be solved by the invention) Among the various heat insulating boards mentioned above, the one with the best heat insulating properties is ■
Resin foam board (thermal conductivity: 0.018-0.03Kca
l/mhr r”c), and this has a specific gravity of 0.
04 or less, it is significantly lighter and easier to handle than other construction boards, and is also cheaper, making it the most popular.

However, this resin foam board is difficult to store because it easily deforms due to heat and moisture absorption, and there are also limitations on the areas where it can be installed and on the construction method. For example, in the exposure waterproofing method, if this resin foam board is used between the waterproof layer and the slab, the resin foam board will warp due to deformation, which will also deform the upper waterproof layer and cause blistering on the waterproof finished surface. .

In addition, it has poor heat resistance and fire resistance, so when asphalt is applied to the surface, it melts and deforms due to the heat, and if a solvent type adhesive is used, it melts and cannot be used, and cement paste or emulsion cement paste However, the adhesive force may be insufficient, and when used for internal insulation, toxic gas may be generated in the event of a fire. Furthermore, when applying a mortar finish to the external surface of the external insulation method, the adhesion with the mortar is poor, so it is necessary to apply adhesive to the surface of the underlying resin foam board and scatter aggregate, or to apply a lath net. There was the inconvenience of having to install it after the entire surface had been covered.

In order to solve these problems, the composite construction board described in (■) above has been developed and used, but such composite boards require compression processing using presses, rolls, etc., resulting in high processing costs. However, there was a drawback in terms of versatility. Furthermore, there were also problems such as heat loss and dew condensation due to thermal bridges caused by anchors for installation, and problems with fire running between the insulation material and the finishing board in the event of a fire.

In recent years, in Hokkaido, external insulation construction methods have been included in the design standards, but since there are no specific guidelines for the finishing methods, the above design standards are actually untrue. For this reason, there was an urgent need to develop a simple and reliable external insulation method using plastic foam insulation.

The present invention has been made in view of the above, and is a novel architectural insulation board that can be applied to any type of insulation construction and can be easily installed by taking advantage of the excellent insulation properties, lightweight, and inexpensive characteristics of resin foam. It is an object of the present invention to provide an effective and simple method for manufacturing the same.

(Means for Solving the Problems) The structure of the present invention for achieving the above object will be explained based on the attached embodiment diagrams. FIG. 1 is a longitudinal cross-sectional view showing an example of a heat insulating board for construction of the present invention, FIGS. 2 and 3 are similar views of other embodiments, and FIG. 4 is a flowchart showing an example of the manufacturing method of the present invention. . That is, the first gist of the present invention is to provide a heat insulating layer 1 made of a plate-shaped resin foam, and a protective layer 2 that is integrally cured and laminated on at least one side of the heat insulating layer 1 using a resin or a resin and cement as a binder. and an aggregate layer 3 spread and fixed on the surface of the protective layer 2.The second gist is that a resin-containing cement paste or resin paste 21 is provided on at least one side of the resin foam board 11. A construction comprising the steps of applying with a flow coater 4, immediately after this, spreading fine aggregate 31 on the surface of the applied paste 21 to laminate and fix it, and then drying and hardening it. In the manufacturing method of heat insulation board.

For convenience, the first and second inventions will be explained together.

As the resin foam board 11 forming the heat insulating layer 1, a plate-shaped resin foam made of polystyrene, polypropylene, polyvinyl chloride, polyurethane, polyethylene, a mixture or copolymer of two or more of these resins, etc. is used. In addition, the protective layer 2 is formed by coating at least one side of the resin foam board 11 with a resin-containing cement paste or a resin paste (hereinafter collectively referred to as resin-containing paste) 21 using a resin-containing cement paste or a resin paste as a binder using a flow coater 4. It is formed into a laminated body by applying the same. The resin-containing cement paste contains an emulsion or aqueous solution of any resin selected from ethylene vinyl acetate resin, acrylic resin, SBR%NBR, CR, carboxymethyl cellulose, methyl cellulose, etc., cement, and water. It is made by kneading fine aggregate with fine aggregate. The mixture is resin (solid content): cement: aggregate: water = 1-10:50-6
0:0 to 10:20 to 40 (parts by weight, the same applies hereinafter) is desirable. On the other hand, resin paste is made by kneading an alkali-resistant resin such as epoxy resin or liquid moisture-curing urethane with the same aggregate as above, and its composition is resin (solid content):
Aggregate=10: O-10 is desirable. These resin-containing pastes 21 are applied to the surface of the resin foam board 11 to a thickness of 0.05 to
Painted and formed in 5m. The aggregate layer 3 is a fine aggregate 31 such as a lightweight aggregate such as silica sand (for example, product numbers 3 to 6), pearlite, and shirasu foam on the surface of the uncured resin-containing paste 21 applied as described above. ... is uniformly spread through a sieve 5 or the like to form a fixed image. In the case of lightweight aggregate, this fine aggregate 31 is partially buried in the surface of the applied resin-containing paste 21, and in the case of a material with a high specific gravity such as silica sand, it is partially buried within the layer of paste 1-21. The aggregate layer 3 is fixed in a settled state, and the surface of the aggregate layer 3 is roughened by the exposed portions of the fine aggregates 31.

Ru.

(Function) When performing insulation work using the architectural insulation board with the above configuration, for example, when externally insulating a concrete structure, the fresh concrete is placed with the aggregate layer 3 in contact with the inner surface of the concrete panel. This can be done by removing the panel after curing, or by gluing and fixing it to the outer surface of an already constructed concrete wall so that the aggregate layer 3 is on the outside. When the protective layer 2 and the aggregate layer 3 are laminated on both sides, the adhesive fixation to the base surface can be done with ordinary mortar, cement paste, or solvent-containing adhesive without melting the heat insulating layer 1. It is possible.

Further, since the heat insulating layer 1 does not directly participate in adhesion, adhesion is possible even at high temperatures like blown asphalt, and there is no need to prepare straight asphalt. Then, mortar used as a base preparation material or ordinary mortar is sprayed on the surface of the aggregate layer 3 to a thickness of 1 to 2 rfn, and if necessary, ricin, tiles, etc. are added to finish it. Ru. In addition, in the case of internal insulation, it is attached to the inner surface of the concrete wall in the same way, and a construction panel is attached to the surface of the aggregate layer 3 with an adhesive or the like, or it is finished with mortar as described above. In this case, since the aggregate layer 3 with a rough surface serves as the base for the finishing material, the finishing materials such as mortar and panels are extremely firmly attached and integrated due to the anchoring effect of the rough surface.

Since the heat insulating layer 1 is made of the resin foam board 11, it has excellent heat insulating properties, and energy saving in the building structure can be extremely effectively achieved. Furthermore, since the surface of the heat insulating layer 1 is covered with the protective layer 2 and the aggregate layer 3, there is no need to worry about ignition during transportation or storage, or significant deterioration of physical properties due to ultraviolet rays. Since irradiation is blocked by the protective layer 2 and the aggregate layer 3, there is no fear that bubbles in the heat insulating layer 1 will expand and cause deformation.

Although the protective layer 2 is formed by a simple method such as a flow coater method, it is firmly laminated and integrated with the heat insulating layer 1 due to the caking property of the resin contained therein. Furthermore, due to the reinforcing effect of the aggregate layer 3 added to the resin-containing protective layer 2, the entire structure becomes extremely strong and deformation does not occur, so that stacking and storage is possible. In addition, the aggregate layer 3 is made of fine aggregate 31
Although it is formed by simply sprinkling ... on the surface of the uncured resin-containing paste 21, it is stably fixed and integrated on the surface due to the caking property of the resin contained in the paste 21.

(Example) Next, an example will be described.

(Example-1) Figures 1 to 3 show examples of the insulation board for construction of the present invention, and Figure 1 shows a resin-containing insulation board on one side of the insulation WJ1.
A gi layer 2 and an aggregate layer 3 are laminated. When performing insulation construction using this embodiment, the aggregate layer 3 is integrally attached to the surface of the concrete structure or other base as described above, and the surface of the aggregate layer 3 is covered with ordinary mortar. Finishing is done with architectural panels.

In the embodiment shown in FIG. 2, a resin-containing protective layer 2' and an aggregate layer 3' similar to those described above are further laminated on the surface of the aggregate layer 3 of the first embodiment to form a multilayer structure. The method of use in this case is the same as above, but the multi-layered structure increases its strength and is therefore preferably employed.

In the embodiment shown in FIG. 3, a protective layer 2 containing tallow fat and an aggregate layer 3 are integrally laminated on both sides of a heat insulating layer 1.

In this case, one of the aggregate layers 3 is attached to the base layer of the structure, and is attached integrally with the base layer of the structure through mortar, adhesive, or other adhesive means as described above. Since the coarse aggregate layer 3 is present in the base, strong adhesion and integration are guaranteed.

Further, since both sides of the heat insulating layer 1 are sandwiched between these layers 2.3, the strength is further increased as in the second embodiment.

Although not shown in the drawings, it is also possible to integrally laminate a decorative layer made of ordinary mortar or resin-containing mortar in place of the protective layer 2' and the aggregate layer 3' of the second embodiment. In this case, since this surface is treated as a finished surface immediately after construction, finishing construction using mortar or building panels as described above is not necessary.

(Example 2) FIG. 4 is a flowchart showing an example of the manufacturing method of the present invention. A resin foam board 11 is placed on the conveyor 6, and as it progresses, a resin-containing paste 21 is coated on the surface by a flow coater 4, and then immediately introduced under an aggregate spreader 50 containing a sieve 5, the above coated paste is applied. In this embodiment, the fine aggregate 31 is uniformly spread on the surface of the resin-containing paste 21.

Furthermore, in order to form a second protective layer 2' and an aggregate layer 3' on this surface (corresponding to the second embodiment described above), a second flow coater 4' and an aggregate spreader 50' are installed immediately thereafter. placed,
Application of resin-containing paste 21' and fine aggregate 31 as above
``... is spread and fixed.

After these steps are completed, they are piled up as they are and cured by natural drying to obtain the above-mentioned architectural heat insulating board.

(Example 3) A heat insulating board test piece was prepared according to the above method according to the following specifications.

(i) Materials used (a) Resin foam board; made by Nippon Styrene Paper ■, Miraform MIF, 25 x 910 x 1820 mm.

(b) Resin-containing paste; <Composition> Cement... 10 parts by weight SBR resin (manufactured by Nippon Latex Processing, Tomac Super)
... 1.5 Additives
...0.03# water
...... 4.7 (c) Aggregate; No. 3 silica sand (c) Aggregate; No. 3 silica sand (3X) Preparation of test piece The coating amount of resin-containing paste was 1.2k in wet condition.
g/i and 0.9 kg/-. In addition, the amount of aggregate to be spread was limited to 1 kg/%. Further, resin-containing paste and aggregate were coated and laminated on one and both sides of a resin foam board. However, when painting both sides, the opposite side was painted two days after painting one side.

When various performances were measured on the test piece prepared above, all of them were bending strength and impact strength.

It was found that it has excellent bending elastic modulus and heat resistance, and has sufficient mechanical strength required for construction boards. .

It should be noted that the present invention is not limited to the above embodiments, and the same effect can be obtained even if the resin foam board is a foam board other than a styrene foam board, for example. The same applies to the case where resin paste is laminated.

(Effects of the Invention) As mentioned above, the thermal insulation board for construction of the present invention has a resin foam board as the insulation layer, a protective layer containing resin on at least one side of the insulation layer, and a protective layer containing resin on the surface thereof. The protective layer contains a resin that firmly integrates each layer. When this is used to insulate a building structure, a rough aggregate layer will be present on the underlying surface, so the mortar and building panels can be attached and finished extremely easily and firmly. Moreover, since the heat insulating layer serving as the base layer is a resin foam board with extremely excellent heat insulating properties, the heat insulating effect is remarkable.

It is particularly suitable for external insulation of concrete structures.

This protects the concrete structure and greatly contributes to improving its durability. In addition, since the protective layer is laminated and integrated using a flow coater, continuous processing is possible, and together with the inexpensive characteristics of the resin foam, production can be achieved at extremely low cost. Furthermore, since the heat insulating layer is essentially protected by the protective layer, there is no fear of ignition or deterioration of physical properties due to ultraviolet rays.Moreover, since it is reinforced by the protective layer and the aggregate layer, warping and bending will not occur. There are no restrictions on construction methods or locations, allowing for a wide range of applications. In addition, since the light weight characteristic is maintained, the advantage of ease of handling is added.

The thermal insulation board for buildings of the present invention, which has many advantages as described above, is extremely useful, and its manufacturing method is simple, so it can be easily implemented without making major design changes to existing equipment. It will be done.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal cross-sectional view showing an example of a heat insulating board for construction of the present invention, FIGS. 2 and 3 are similar views of other embodiments, and FIG. 4 is a flowchart showing an example of the manufacturing method of the present invention. . (Explanation of symbols) 1... Heat insulation layer, 11... Resin foam board, 2... Protective layer,
21... Resin mixed cement paste or resin paste, 3... Aggregate layer, 31... Fine aggregate, 4... Flow coater. One or more applicants Central Engineering Co., Ltd. Agent
Patent attorney (6235) Hidehiko Matsuno

Claims (1)

[Claims] 1. A heat insulating layer (1) of a plate-shaped resin foam, and the heat insulating layer (1)
consisting of a protective layer (2) that is integrally cured and laminated using resin or resin and cement as a binder on at least one side of the protective layer, and an aggregate layer (3) that is spread and fixed on the surface of the protective layer (2). Architectural insulation board. 2. Applying resin-containing cement paste or resin paste (21) to at least one side of the resin foam board (11) using a flow coater (4), and immediately after this, applying the resin-containing cement paste or resin paste (21) to the surface of the applied paste (21). Fine aggregate (31...
) is applied, laminated and fixed, and then dried and hardened.