JPH01136429U - - Google Patents

Info

Publication number
JPH01136429U
JPH01136429U JP3197288U JP3197288U JPH01136429U JP H01136429 U JPH01136429 U JP H01136429U JP 3197288 U JP3197288 U JP 3197288U JP 3197288 U JP3197288 U JP 3197288U JP H01136429 U JPH01136429 U JP H01136429U
Authority
JP
Japan
Prior art keywords
vibration sensor
polarized
emitter
bonding
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3197288U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3197288U priority Critical patent/JPH01136429U/ja
Publication of JPH01136429U publication Critical patent/JPH01136429U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す斜視図、第2
図はその回路図、第3図及び第4図は振動センサ
回路の出力特性線図、第5図は温度補償特性線図
である。 1……金属薄板、2……圧電セラミツクス板、
5……抵抗器、6……増幅素子。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a circuit diagram thereof, FIGS. 3 and 4 are output characteristic diagrams of the vibration sensor circuit, and FIG. 5 is a temperature compensation characteristic diagram. 1... Metal thin plate, 2... Piezoelectric ceramic plate,
5...Resistor, 6...Amplification element.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属薄板に、両面に電極が形成され厚さ方向に
分極された圧電セラミツクス薄板を接着した圧電
振動子と、増幅素子のベース、エミツタ間に感温
抵抗素子を含む抵抗回路網とを接続したことを特
徴とする振動センサ。
A piezoelectric vibrator made by bonding a piezoelectric ceramic thin plate with electrodes formed on both sides and polarized in the thickness direction to a thin metal plate, and a resistance network including a temperature-sensitive resistance element connected between the base and emitter of an amplifier element. A vibration sensor featuring:
JP3197288U 1988-03-10 1988-03-10 Pending JPH01136429U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3197288U JPH01136429U (en) 1988-03-10 1988-03-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3197288U JPH01136429U (en) 1988-03-10 1988-03-10

Publications (1)

Publication Number Publication Date
JPH01136429U true JPH01136429U (en) 1989-09-19

Family

ID=31258235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3197288U Pending JPH01136429U (en) 1988-03-10 1988-03-10

Country Status (1)

Country Link
JP (1) JPH01136429U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019087886A (en) * 2017-11-07 2019-06-06 ヤマハ株式会社 Sensor output device, acoustic output device and music instrument

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS635436B2 (en) * 1983-09-06 1988-02-03 Ntn Toyo Bearing Co Ltd

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS635436B2 (en) * 1983-09-06 1988-02-03 Ntn Toyo Bearing Co Ltd

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019087886A (en) * 2017-11-07 2019-06-06 ヤマハ株式会社 Sensor output device, acoustic output device and music instrument
US10659888B2 (en) 2017-11-07 2020-05-19 Yamaha Corporation Sensor output device, sound output device, and musical instrument

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